scholarly journals Effects of Grinding Passes and Direction on Material Removal Behaviours in the Rail Grinding Process

Materials ◽  
2018 ◽  
Vol 11 (11) ◽  
pp. 2293 ◽  
Author(s):  
Shuyue Zhang ◽  
Kun Zhou ◽  
Haohao Ding ◽  
Jun Guo ◽  
Qiyue Liu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Three Dimensional ◽  
Element Model ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Ratio ◽  
Rail Grinding ◽  
Three Dimensional Finite Element

A three-dimensional finite element model of rail grinding was established to explore the effects of grinding passes and grinding direction on the material removal behaviour of grinding rails during the grinding process. The results indicate that as the number of grinding passes increases, a decrease in the grinding force reduces both the amount of removed rail material and the surface roughness. There is a decrease in the grinding ratio caused by the increase in the wear on the grinding wheel and the decreased removal of the rail material. When the grinding direction changes, the wear of the grinding wheel decreases, which is contrary to the increasing trend of the amount of removed rail material, the grinding ratio, the surface roughness and the grinding force.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

Influence of granularity of grinding stone on grinding force and material removal in the rail grinding process

2018 ◽  
Vol 233 (2) ◽  
pp. 355-365 ◽  
Author(s):  
Wen-jian Wang ◽  
Kai-kai Gu ◽  
Kun Zhou ◽  
Zhen-bing Cai ◽  
Jun Guo ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Friction Coefficient ◽  
Material Removal ◽  
Grinding Force ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Material Removal Mechanisms ◽  
Rail Grinding ◽  
Grinding Efficiency ◽  
Grinding Stone

The objective of this study is to explore the influence of grinding stone granularity on the grinding force and rail material removal behaviors using a rail grinding friction machine. The results indicate that with the increase in granularity, the grinding force, and friction coefficient in the grinding interface obviously increase, which brings about a rise in the hardness and grinding temperature-rise of rail specimens. The increase in the grinding stone granularity causes a fall in the grinding volume and surface roughness of rail materials and brings about stronger vibration in the grinding interface owing to different material removal mechanisms. In view of the experimental results, the optimization of grinding stone granularity is significant for improving the rail grinding efficiency and surface quality.

Development of Three-Dimensional Dynamometer for Wafer Grinder

2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo
Keyword(s):  
Three Dimensional ◽  
High Sensitivity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Performance Parameters ◽  
Grinding Forces ◽  
Grinding Method ◽  
Static Performance ◽  
Good Repeatability

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.

Finite Element Method Modeling Approaches in Grinding

2011 ◽  
Vol 188 ◽  
pp. 368-371
Author(s):  
H.L. Zhang ◽  
H. Guo
Keyword(s):  
Finite Element ◽  
Tangential Force ◽  
Three Dimensional ◽  
Element Model ◽  
Grinding Force ◽  
Wheel Speed ◽  
Grinding Forces ◽  
Force Increase ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element

In the present paper, a three-dimensional finite element model was used for simulating the grinding force at different cutting conditions. The effects of the wheel speed, feed and grinding depth on the grinding force per unit width were analyzed in detail. The results show that both the normal force and tangential force increase linearly with the increasing of feed and grinding depth, however, with the increasing of wheel speed, the grinding force decreases gradually. The predicted normal and tangential grinding forces were compared with those experimentally obtained and the results show reasonable agreement quantitatively.

Investigation of Grinding Characteristics of Cemented Carbides YL10.2 and YF06

2014 ◽  
Vol 1017 ◽  
pp. 104-108 ◽  
Author(s):  
Tao Xu ◽  
Jian Wu Yu ◽  
Zhong Jian Zhang ◽  
Jian Gang Tu ◽  
Xiang Zhong Liu ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Ground Surface ◽  
Grinding Force ◽  
Cemented Carbides ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Machined Surface ◽  
Ultrafine Grained ◽  
Machined Surface Roughness

YL10.2 and YF06 are ultrafine-grained cemented carbides, and grinding experiments were carried out with resin-bonded diamond grinding wheel. Based on measured grinding force, surface roughness and SEM topography, experimental results were analyzed; grinding forces and depth of grinding approach linear correlation; and the grinding force of YF06 is greater than that of YL10.2 in rough grinding, but the grinding force increases significantly if depth of cut is greater than a certain value in finish grinding. The trend of machined surface roughness looks like “V” type with the increasing of depth of cut; the material removal behavior of ultrafine-grained cemented carbides in grinding was observed; the ploughing and fragmentation exist simultaneously on the ground surface, and the dominated material removal behavior depends on the grinding parameters or chemical composition of workpiece.

A Combined Experimental and Numerical Study of the Effect of Surface Roughness on Nanoindentation

2019 ◽  
Vol 11 (07) ◽  
pp. 1950070
Author(s):  
M. Nazemian ◽  
M. Chamani ◽  
M. Baghani
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Finite Element ◽  
Rough Surface ◽  
Numerical Study ◽  
Three Dimensional ◽  
Element Model ◽  
Element Analysis ◽  
Three Dimensional Finite Element ◽  
Effect Of Surface

Gold and copper thin films are widely used in microelectromechanical system (MEMS) and nanoelectromechanical system (NEMS) devices. Nanoindentation has been developed in mechanical characterization of thin films in recent years. Several researchers have examined the effect of surface roughness on nanoindentation results. It is proved that the surface roughness has great importance in nanoindentation of thin films. In this paper, the surface topography of thin films is simulated using the extracted data from the atomic force microscopy (AFM) images. Nanoindentation on a rough surface is simulated using a three-dimensional finite-element model. The results are compared with the results of finite-element analysis on a smooth surface and the experimental results. The results revealed that the surface roughness plays a key role in nanoindentation of thin films, especially at low indentation depths. There was good compatibility between the results of finite-element simulation on the rough surface and those of experiments. It is observed that on rough films, at low indentation depths, the geometry of the location where the nanoindentation is performed is of major importance.

Material Removal Simulation in Sawing Processes of Photovoltaic Silicon

MRS Advances ◽  
2019 ◽  
Vol 4 (13) ◽  
pp. 761-768 ◽  
Author(s):  
F. Wallburg ◽  
M. Kuna ◽  
S. Schoenfelder
Keyword(s):  
Cohesive Zone ◽  
Damage Evolution ◽  
Material Removal ◽  
Three Dimensional ◽  
Element Model ◽  
Silicon Substrates ◽  
Nano Indentation ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Sawing Process

ABSTRACTThe wafering of thin silicon substrates is done by wire sawing technology. In this work a numerical model for the investigation of microstructural mechanisms like cracking and damage evolution during the sawing process is presented. A three-dimensional finite element model representing the phase transformation properties of silicon is validated by loading curves from nano-indentation experiments. By using cohesive zone finite elements, the crack lengths as well as crack initiation depths can be quantified and compared with the experimental results in terms of the maximum depth of subsurface damage.

Modeling and Predicting Surface Roughness for the Grinding Process

2014 ◽  
Vol 599-601 ◽  
pp. 622-625 ◽  
Author(s):  
Xiao Ni Wen
Keyword(s):  
Surface Roughness ◽  
Three Dimensional ◽  
Measurement Data ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Cross Sectional ◽  
Three Dimensional Modeling ◽  
Dimensional Modeling ◽  
The Cross ◽  
Sectional Surface

This paper proposes a new algorithm for predicting the cross-sectional surface roughness of the workpiece for the grinding process, which reduces three-dimensional modeling to two-dimensional modeling by virtue of the cross-sectional area of the undeformed grinding chip. Besides, this paper develops a search technique to figure out systematically the surface roughness in order to determine the final cross-sectional surface roughness produced by thousands of grinding wheel grains with randomly distributed protrusion heights. The simulated results are consistent with the measurement data, which proves the effectiveness of the proposed algorithm.

Study on Thermal Influence of Grinding Process on LiTaO3

2013 ◽  
Vol 797 ◽  
pp. 252-257 ◽  
Author(s):  
Wei Hang ◽  
Li Bo Zhou ◽  
Jun Shimizu ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Crack Initiation ◽  
Material Removal ◽  
Critical Issue ◽  
Wafer Surface ◽  
Coolant Temperature ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Thermal Influence ◽  
Major Factors

As a typical multi-functional single crystal material, Lithium tantalate (LiTaO3 or LT) exhibits its excellent electro-optical, pyroelectric and piezoelectric properties, and has now been widely applied into many applications, especially in the telecommunication field. However, the most critical issue in the process is its pyroelectric effect and piezoelectric effect which potentially leads to crack initiation during grinding. Because it is rich in plasticity, LT demands larger specific energy for material removal. As the most machining energy is eventually converted into heat, LT undergoes a rapid rise in temperature during the grinding process, thus highly risks in thermal shock. In order to clarify the thermal influence on the grinding process of LiTaO3, the effects of coolant temperature, diamond grinding wheel geometry and material of substrate are investigated in this research. The experimental results show that the increasing rate of grinding torque (or force) and surface roughness are two major factors dominating the crack initiation during grinding of LT wafers. Via a DOE (design of experiment) analysis, coolant temperature and wheel type stand out as the main factors influencing on the increasing rate and wafer surface roughness.

scholarly journals Effect of Types of Grinding Fluid on Grinding Characteristics of CMSX4

2022 ◽  
Vol 16 (1) ◽  
pp. 43-51
Author(s):  
Tatsuki Ikari ◽  
Takayuki Kitajima ◽  
Akinori Yui ◽  
◽  
Keyword(s):  
Surface Roughness ◽  
High Efficiency ◽  
Removal Rate ◽  
Turbine Blades ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Temperature Strength ◽  
Heat Resistant ◽  
Grinding Ratio ◽  
Grinding Fluid

Nickel-based heat-resistant alloys are widely used for fabricating the turbine blades in gas turbine engines. An increase in the number of such engines operated by air carriers will increase the demand for high-efficiency machining of nickel-based heat-resistant alloys. However, the high-efficiency grinding of nickel-based heat-resistant alloys is challenging because of their low thermal conductivity and thermal diffusivity, high chemical activity, large work-hardening properties, and high-temperature strength. In this work, the authors propose a high-efficiency grinding technique that uses speed-stroke grinding of nickel-based heat-resistant alloys, and aim to clarify the optimum grinding conditions for the proposed grinding method. The workpiece material is CMSX4 used for the turbine blades. A Cubitron + WA grinding wheel and WA grinding wheel mounted on a linear motor-driven surface grind machines are used for grinding, and the grinding force, surface roughness, and grinding ratio are investigated with the removal rate maintained constant. Two types of grinding fluid are prepared: solution and soluble. From the experiments, it is found that wet grinding features a lower grinding force, smaller surface roughness, and higher grinding ratio when compared to dry-cut grinding. The improvement in the grinding ratio at high table speeds is significant, and it is found to be greater for the soluble-type fluid than for the solution-type fluid.

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