scholarly journals Practical Use of Composite Materials Used in Military Aircraft

Materials ◽  
2021 ◽  
Vol 14 (17) ◽  
pp. 4812
Author(s):  
Lucjan Setlak ◽  
Rafał Kowalik ◽  
Tomasz Lusiak
Keyword(s):  
Composite Material ◽  
Programming Environment ◽  
Element Analysis ◽  
Practical Applications ◽  
Two Samples ◽  
Fiberglass Composite ◽  
Materials Used ◽  
Research Analysis ◽  
Shore’S Method

The article presents a comparative characterization of the structural materials (composites and metals) used in modern aviation structures, focusing on the airframe structure of the most modern aircraft (Airbus A-380, Boeing B-787, and JSF F-35). Selected design and operational problems were analysed, with particular emphasis on composites and light metals (aluminium). For this purpose, the Shore’s method was used for the analysis of the obtained strength results and the programming environment (ANSYS, SolidWorks) required to simulate the GLARE 3 2/1-04 composite. The focus was on highlighting the differences in the construction and modelling of these materials resulting from their various structures (isotropy and anisotropy), e.g., by analyzing the mechanics of metal destruction and comparing it with the composite material. In terms of solving the problems of finite element analysis FEM, tests have been carried out on two samples made of an aluminium alloy and a fiberglass composite. The focus was on highlighting the differences in the construction and modelling of these materials resulting from their various structures (isotropy and anisotropy), e.g., by analyzing the mechanics of metal destruction and comparing it with the composite material. On the basis of the obtained results, the preferred variant was selected, in terms of displacements, stresses, and deformations. In the final part of the work, based on the conducted literature analysis and the conducted research (analysis, simulations, and tests), significant observations and final conclusions, reflected in practical applications, were formulated.

Generating a skin-based meta-model for compliant parts in composite material: numerical and experimental results

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Wilma Polini ◽  
Andrea Corrado
Keyword(s):  
Composite Material ◽  
Manufacturing Process ◽  
Process Model ◽  
Tolerance Analysis ◽  
Simulation Models ◽  
Next Generation ◽  
Element Analysis ◽  
Content Type ◽  
Meta Model ◽  
Practical Applications

Purpose The purpose of this paper is to present a skin-based approach able to generate the variability model for a component in composite material due to its manufacturing process. It generates a skin-based model of the manufactured part. The skin model discretizes the part surfaces by points to take into account the geometric deviations, those points are the nodes of finite element analysis used for tolerance analysis of compliant assemblies. Design/methodology/approach The paper presents a general and systematic simulation model for generating a variability meta-model for a component in composite material due to its manufacturing process. The model is constituted by three steps: definition and pre-processing of the nominal model, generation of the manufacturing process model and evaluation of the part variability. Findings The advantage of this approach is related to the fact that it is designed as a part of a digital process that establishes a continuous and unambiguous flow of variation information from the part design to manufacturing and assembly and that takes into account the manufacturing signature. This is its uniqueness compared to other simulation approaches focused only on manufacturing. Research limitations/implications Considering the variability around the nominal value of all the process parameters and parts with more complex geometries are not taken into account now, which will be modelled in practical applications. Practical implications To properly manage uncertainty since conceptual design of complex product, next generation geometry assurance requires simulation models to realistically consider process signatures due to the manufacturing process. This work focusses on this next generation tool for geometry assurance. Originality/value The literature is focused on metal sheets joined by welding or riveting. There are other materials widely used and typically compliant: the composite materials that typically used mechanical fixing elements (bolting, riveting) and structural adhesives to joint parts. No software tools exist in the literature to deal with uncertainty from manufacturing to assembly processes in products made by composite. This is the reason of the present work.

Characterization of intergranular cuprous oxide in polycrystalline YBa2Cu3O7-x

1988 ◽  
Vol 46 ◽  
pp. 880-881
Author(s):  
Bradley L. Thiel ◽  
Chan Han R. P. ◽  
Kurosky L. C. Hutter ◽  
I. A. Aksay ◽  
Mehmet Sarikaya
Keyword(s):  
Grain Boundary ◽  
Cuprous Oxide ◽  
Room Temperature ◽  
Boundary Phase ◽  
Spectroscopic Techniques ◽  
Transition Width ◽  
Practical Applications ◽  
Thin Foils ◽  
Superconducting Oxides

The identification of extraneous phases is important in understanding of high Tc superconducting oxides. The spectroscopic techniques commonly used in determining the origin of superconductivity (such as RAMAN, XPS, AES, and EXAFS) are surface-sensitive. Hence a grain boundary phase several nanometers thick could produce irrelevant spectroscopic results and cause erroneous conclusions. The intergranular phases present a major technological consideration for practical applications. In this communication we report the identification of a Cu2O grain boundary phase which forms during the sintering of YBa2Cu3O7-x (1:2:3 compound).Samples are prepared using a mixture of Y2O3. CuO, and BaO2 powders dispersed in ethanol for complete mixing. The pellets pressed at 20,000 psi are heated to 950°C at a rate of 5°C per min, held for 1 hr, and cooled at 1°C per min to room temperature. The samples show a Tc of 91K with a transition width of 2K. In order to prevent damage, a low temperature stage is used in milling to prepare thin foils which are then observed, using a liquid nitrogen holder, in a Philips 430T at 300 kV.

Processing and characterization of YBa2Cu3O7−x/Ag composites

1990 ◽  
Vol 48 (4) ◽  
pp. 46-47
Author(s):  
Jafar Javadpour ◽  
Bradley L. Thiel ◽  
Sarikaya Mehmet ◽  
Ilhan A. Aksay
Keyword(s):  
Composite System ◽  
Precursor Solution ◽  
Microstructural Development ◽  
Superconducting Properties ◽  
Practical Applications ◽  
Nitrate Precursor ◽  
Cold Pressed ◽  
Tape Cast ◽  
Composite Samples

Practical applications of bulk YBa2Cu3O7−x materials have been limited because of their inadequate critical current density (jc) and poor mechanical properties. Several recent reports have indicated that the addition of Ag to the YBa2Cu3O7−x system is beneficial in improving both mechanical and superconducting properties. However, detailed studies concerning the effect of Ag on the microstructural development of the cermet system have been lacking. Here, we present some observations on the microstructural evolution in the YBa2Cu3O7−x/Ag composite system.The composite samples were prepared by mixing various amounts (2.5 - 50 wt%) AgNO3 in the YBa2Cu3O7−x nitrate precursor solution. These solutions were then spray dried and the resulting powders were either cold pressed or tape cast. The microstructures of the sintered samples were analyzed using SEM (Philips 515) and an analytical TEM (Philips 430T).The SEM micrographs of the compacts with 2.5 and 50 wt% Ag addition sintered at 915°C (below the melting point of Ag) for 1 h in air are displayed in Figs. 1 and 2, respectively.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

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