scholarly journals Monolithic Integration of Nano-Ridge Engineered InGaP/GaAs HBTs on 300 mm Si Substrate

Materials ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 5682
Author(s):  
Yves Mols ◽  
Abhitosh Vais ◽  
Sachin Yadav ◽  
Liesbeth Witters ◽  
Komal Vondkar ◽  
...  
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Cmos Technology ◽  
Growth Conditions ◽  
Device Fabrication ◽  
Threading Dislocation ◽  
Bottom Part ◽  
Transmission Electron ◽  
Hybrid Iii ◽  
Threading Dislocation Density ◽  
Rf Applications

Nano-ridge engineering (NRE) is a novel method to monolithically integrate III–V devices on a 300 mm Si platform. In this work, NRE is applied to InGaP/GaAs heterojunction bipolar transistors (HBTs), enabling hybrid III-V/CMOS technology for RF applications. The NRE HBT stacks were grown by metal-organic vapor-phase epitaxy on 300 mm Si (001) wafers with a double trench-patterned oxide template, in an industrial deposition chamber. Aspect ratio trapping in the narrow bottom part of a trench results in a threading dislocation density below 106∙cm−2 in the device layers in the wide upper part of that trench. NRE is used to create larger area NRs with a flat (001) surface, suitable for HBT device fabrication. Transmission electron microscopy inspection of the HBT stacks revealed restricted twin formation after the InGaP emitter layer contacts the oxide sidewall. Several structures, with varying InGaP growth conditions, were made, to further study this phenomenon. HBT devices—consisting of several nano-ridges in parallel—were processed for DC and RF characterization. A maximum DC gain of 112 was obtained and a cut-off frequency ft of ~17 GHz was achieved. These results show the potential of NRE III–V devices for hybrid III–V/CMOS technology for emerging RF applications.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

Defect Reduction in Cd1-xZnxTe Epilayers on GaAs Substrates

1994 ◽  
Vol 299 ◽  
Author(s):  
Saket Chadda ◽  
Kevin Malloy ◽  
John Reno
Keyword(s):  
Threading Dislocation ◽  
Full Width ◽  
X Ray Diffraction ◽  
Defect Reduction ◽  
X Ray ◽  
Gaas Substrates ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Optimum Period ◽  
Bulk Alloys

AbstractCd0.91Zn0.09Te/CdTe multilayers of various period thicknesses were inserted into Cd0.955Zn0.045Te bulk alloys grown on (001) GaAs. The net strain of the multilayer on the underlying Cd0.955Zn0.045Te was designed to be zero. X-ray diffraction full width at half maximum (FWHM) was used as a means to optimize the period thickness of the multilayer. Transmission electron microscopy of the optimum period thickness samples demonstrated four orders of magnitude decrease in the threading dislocation density. Mechanism of bending by equi-strained multilayers is discussed.

MO-CVD GaAs Grown by Direct Deposition on Si

1987 ◽  
Vol 91 ◽  
Author(s):  
S. M. Vernon ◽  
S. J. Pearton ◽  
J. M. Gibson ◽  
R. Caruso ◽  
C. R. Abernathy ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Gaas Layer ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
Si Substrates ◽  
Transmission Electron ◽  
Activation Data ◽  
Threading Dislocation Density ◽  
Donor Activity

ABSTRACTGaAs layers were grown directly on misoriented (2° off (100)→[011]) Si substrates by Metalorganic Chemical Vapor Deposition. The threading dislocation density at the surface of 4 μm thick layers was typically 108cm−2, as determined by both preferential etching and transmission electron microscopy. Rapid thermal annealing (900°C, 10s) improved the crystalline quality of the GaAs near the heterointerface while allowing no detectable Si diffusion into this layer. Two deep electron traps were observed in the undoped GaAs, but were present at a low concentration (∼ 1013 cm−3 ). The (400) x-ray diffraction peak width from the GaAs was significantly reduced with increasing GaAs layer thickness, indicating improved material quality. This is supported by Si implant activation data, which shows higher net donor activity in thicker layers.

Cantilever Epitaxy of GaN on Sapphire: Further Reductions in Dislocation Density

2002 ◽  
Vol 743 ◽  
Author(s):  
D. M. Follstaedt ◽  
P. P. Provencio ◽  
D. D. Koleske ◽  
C. C. Mitchell ◽  
A. A. Allerman ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Processing Conditions ◽  
Optimum Growth ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Threading Dislocation Density

ABSTRACTThe density of vertical threading dislocations at the surface of GaN grown on sapphire by cantilever epitaxy has been reduced with two new approaches. First, narrow mesas (<1 μm wide) were used and {11–22} facets formed over them early in growth to redirect dislocations from vertical to horizontal. Cross-sectional transmission electron microscopy was used to demonstrate this redirection and to identify optimum growth and processing conditions. Second, a GaN nuc-leation layer with delayed 3D → 2D growth transition and inherently lower threading dislocation density was adapted to cantilever epitaxy. Several techniques show that a dislocation density of only 2–3×107/cm2 was achieved by combining these two approaches. We also suggest other developments of cantilever epitaxy for reducing dislocations in heteroepitaxial systems.

Engineering Dislocation Dynamics in Inx(AlyGa1−y)1−xP Graded Buffers Grown on Gap by Movpe

1998 ◽  
Vol 510 ◽  
Author(s):  
A.Y. Kim ◽  
E.A. Fitzgerald
Keyword(s):  
Surface Roughness ◽  
Dislocation Density ◽  
Growth Conditions ◽  
Dislocation Nucleation ◽  
Dislocation Dynamics ◽  
Threading Dislocation ◽  
High Quality ◽  
Movpe Growth ◽  
Threading Dislocation Density ◽  
Buffer Design

AbstractTo engineer high-quality Inx(AlyGa1−y)1−x P/Ga1−xP graded buffers, we have explored the effects of graded buffer design and MOVPE growth conditions on material quality. We demonstrate that surface roughness causes threading dislocation density (TDD) to increase with continued grading: dislocations and roughness interact in a recursive, escalating cycle to form pileups that cause increasing roughness and dislocation nucleation. Experiments show that V/III ratio, temperature, and grading rate can be used to control dislocation dynamics and surface roughness in InxGa1−xP graded buffers. Control of these parameters individually has resulted in x = 0.34 graded buffers with TDD = 5 × 106 cm−2and roughness = 15 nm and a simple optimization has resulted in TDD = 3 × 106 cm −2and roughness = 10 un. Our most recent work has focused on more sophisticated optimization and the incorporation of aluminum for x > 0.20 to keep the graded buffer completely transparent above 545 nm. Given our results, we expect to achieve transparent, device-quality Inx(AlyGa1−y)1−x P/GaP graded buffers with TDD < 106 cm−2

Microstructure and Physical Properties of GaN Films on Sapphire Substrates

1999 ◽  
Vol 595 ◽  
Author(s):  
Zhizhong Chen ◽  
Rong Zhang ◽  
Jianming Zhu ◽  
Bo Shen ◽  
Yugang Zhou ◽  
...  
Keyword(s):  
Physical Properties ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Band Edge Emission ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
Sapphire Substrates ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Order Of Magnitude

AbstractTransmission electron microscopy (TEM), x-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were applied to study the correlation between the microstructure and physical properties of the GaN films grown by light radiation heating metalorganic chemical vapor deposition (LRH-MOCVD), using GaN buffer layer on sapphire substrates. When the density of the threading dislocation (TD) increases about one order of magnitude, the yellow luminescence (YL) intensity is strengthened from negligible to two orders of magnitude higher than the band edge emission intensity. The full width of half maximum (FWHM) of the GaN (0002) peak of the XRD rocking curve was widened from 11 min to 15 min, and in Raman spectra, the width of E2 mode is broadened from 5 cm-1 to 7 cm-1. A “zippers” structure at the interface of GaN/sapphire was observed by high-resolution electron microscope (HREM). Furthermore the origins of TD and relationship between physical properties and microstructures combining the growth conditions are discussed.

Reduction of Threading Dislocation Density in InN Film Grown with in situ Surface Modification by Radio-frequency Plasma-excited Molecular Beam Epitaxy

MRS Advances ◽  
2018 ◽  
Vol 3 (18) ◽  
pp. 931-936
Author(s):  
F. B. Abas ◽  
R. Fujita ◽  
S. Mouri ◽  
T. Araki ◽  
Y. Nanishi
Keyword(s):  
Surface Modification ◽  
Electrical Properties ◽  
Dislocation Density ◽  
Hall Effect Measurement ◽  
Threading Dislocation ◽  
X Ray ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Order Of Magnitude

ABSTRACTThe objective of this study was to investigate the relationship between the thickness of N radical irradiated InN template with crystallographic quality and electrical properties of InN film grown with the previously proposed method, in situ surface modification by radical beam irradiation. In this study, three InN samples were grown with this method on different thickness of irradiated templates. The crystallographic quality of InN films was analyzed by X-ray diffraction and the electrical properties were studied by Hall effect measurement. InN grown on 100 nm thick irradiated template shows lower full-width at half-maximum of X-ray rocking curves and lower carrier concentration compared to InN grown on 200 nm and 450 nm thick irradiated templates. Transmission electron microscopy revealed that threading dislocation density in the InN film decreased by an order of magnitude to ∼4.6×109cm-2. These results suggest that this method is possible for reduction of threading dislocation density in InN and the thickness of irradiated template should be minimized for higher crystallographic quality and electrical properties of the entire InN film.

Dependence of Threading Dislocation Density on Substrate Misorientation in In0.15Ga0.85As Grown on GaAs(100)

1989 ◽  
Vol 145 ◽  
Author(s):  
P.N. Uppal ◽  
J.S. Ahearn ◽  
R. Herring
Keyword(s):  
Dislocation Density ◽  
Strain Relaxation ◽  
Dislocation Network ◽  
Uniform Density ◽  
Threading Dislocation ◽  
Dislocation Mobility ◽  
Transmission Electron ◽  
Dislocation Arrays ◽  
Threading Dislocation Density ◽  
Strained Layer Superlattices

AbstractThe density and arrangement of dislocations in In0.15Ga0.85As grown on GaAs(100)) were determined by transmission electron microscopy as a function of misorientation toward (111)A, (111)B, and (110). Strained layer superlattices were used in all cases to reduce dislocation density. Layers grown on exact GaAs(100) exhibited a non-uniform threading dislocation dis- tribution whereby some areas had a high density (∼ 109cm-2or higher) of dislocation tangles and other areas that we in between had a more uniform density (∼ 2 x 107cm-2). The misorientated layers exhibited a uniform threading dislocation distribution with densities of ∼ 5 x 106 cm-2 for (100) misoriented towards (111)A, ∼ 1 x 107cm-2towards (111)B, and ∼ 3 x 107cm-2 towards (110). The misfit dislocation network (dislocations located at the GaAs-InO0.15Ga0.85 As interface) formed orthogonal dislocation arrays in the case of exact (100) substrates and slightly non-ortho- gonal arrays in the case of misoriented substrates. These results are explained with the help of a general glide model of strain relaxation in which the exact (100) orientation has eight equally stressed glide systems which presumably activate during strain relaxation. With misoriented substrates the stress symmetry is broken and fewer glide systems experience the maximum stress, thus reducing the number of active dislocation systems. A small asymmetry in interfacial dis- location density was observed in all the cases where the linear dislocation density along the two (011) and (011) orthogonal directions differed by about 20%. This is explained by the preferred activation of (x-dislocations (high dislocation mobility) over 13-dislocations (low dislocation mobility).

Growth of Device-Quality Homoepitaxial Diamond Thin Films

1989 ◽  
Vol 162 ◽  
Author(s):  
M. W. Geis
Keyword(s):  
Activation Energy ◽  
Growth Conditions ◽  
Device Fabrication ◽  
Diamond Growth ◽  
High Resistivity ◽  
Boron Doped Diamond ◽  
Boron Doped ◽  
Transmission Electron ◽  
Heavily Doped ◽  
P Type

ABSTRACTDiamond has an electric-field breakdown 20 times that of Si and GaAs, and a saturated velocity twice that of Si. This results in a predicted cut off frequency for high-power diamond transistors 40 times that of similar devices made of Si or GaAs. Boron is the only known impurity that can be used to lightly dope diamond. This p-type dopant has an activation energy of 0.3 to 0.4 eV, which results in high-resistivity material that is undesirable for devices. However, heavily boron doped diamond has a very small activation energy and a low resistivity and is of device quality. Transistors can be designed that use only undoped and heavily doped diamond. One of the steps in a device fabrication sequence is homoepitaxial diamond growth. Lightly and heavily doped homoepitaxial diamond films were characterized by scanning and transmission electron microscopy, x-ray diffraction, measurements of resistivity as a function of temperature, and secondary ion mass spectroscopy. It was found that under appropriate growth conditions these films are of device quality.

Resistivity Control in Unintentionally Doped GaN Films Grown on Si (111) Substrates by MOCVD

2011 ◽  
Vol 415-417 ◽  
pp. 1959-1963 ◽  
Author(s):  
Yong Wang ◽  
Nai Sen Yu ◽  
Ming Li ◽  
Kei May Lau
Keyword(s):  
Sheet Resistance ◽  
Chemical Vapor ◽  
High Growth ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Threading Dislocation ◽  
Growth Pressure ◽  
Initial Layer ◽  
Threading Dislocation Density ◽  
Metal Organic

Unintentionally doped GaN were grown on Si (111) substrates by metal organic chemical vapor deposition (MOCVD). The high-resolution X-ray diffraction (HRXRD) and Lehighton contactless sheet resistance measuring systems were employed to characterize the quality and sheet resistance (Rs) of GaN epilayer. The threading dislocation density (TDD) was estimated by calculating the full width at half maximum (FWHM) of GaN (0002) and (10-12) diffractions measured by HRXRD. The relationship between Rs and TDD in GaN epilayer was investigated. The influence of growth conditions of bottom GaN initial layer including carrier gas category (H2 or N2), growth temperatures, and growth pressures on the quality or resistivity of top GaN epilayer was discussed and analyzed. As a result, the improved resistivity was achieved in top GaN epilayer with low TDD by using H2 carrier, low growth temperature of 1050°C, and high growth pressure of 400mbar during the growth of bottom GaN initial layer.

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