scholarly journals Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Nanomaterials ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 1456
Author(s):  
Jenn-Ming Song ◽  
Bo-Chang Huang ◽  
David Tarng ◽  
Chih-Pin Hung ◽  
Kiyokazu Yasuda
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Impact Load ◽  
Substrate Material ◽  
Joint Interface ◽  
Impact Performance ◽  
Interfacial Imcs ◽  
High Speed Impact ◽  
Reliability Of Solder Joints ◽  
Impact Reliability

This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young’s modulus, work hardening exponent, yield strength, and plastic ability. Experimental results suggest that nanoindentation responses of IMCs at joint interface definitely dominates joint impact performance. The greater the plastic ability the interfacial IMC exhibits, the superior impact energy the solder joints possess. The concept of mechanical and geometrical discontinuities was also proposed to explain brittle fracture of the solder joints with bi-layer interfacial IMCs subject to impact load.

Reinforced Solder Technology for Increased Reliability

2017 ◽  
Vol 2017 (1) ◽  
pp. 000641-000645
Author(s):  
Tim Jensen ◽  
Sunny Neoh ◽  
Adam Murling
Keyword(s):  
Melting Point ◽  
Solder Joint ◽  
Solder Joints ◽  
Reliability Of Solder Joints ◽  
Impact Reliability ◽  
Selection Of

Abstract The reliability of solder joints have been studied for many years. The selection of a solder for a particular application is often limited based on melting point requirements. This limits the number of options that are available for use. When alloy selection options are limited, people look to process changes to try and improve the reliability. Two such areas that have been identified that can impact reliability are bondline control and void reduction. This paper analyzes a new reinforced solder technology to maintain a consistent solder joint bondline. Experiments were also conducted to determine how best to design these preforms to minimize voiding.

Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit

2012 ◽  
Vol 48 (6) ◽  
pp. 2724-2732 ◽  
Author(s):  
Cheng-Ying Ho ◽  
Jenq-Gong Duh ◽  
Chih-Wei Lin ◽  
Chun-Jen Lin ◽  
Yu-Hui Wu ◽  
...  
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
High Speed Impact ◽  
Impact Responses

Failure mode analysis of lead-free solder joints under high speed impact testing

2008 ◽  
Vol 494 (1-2) ◽  
pp. 196-202 ◽  
Author(s):  
De-Shin Liu ◽  
Chia-Yuan Kuo ◽  
Chang-Lin Hsu ◽  
Geng-Shin Shen ◽  
Yu-Ren Chen ◽  
...  
Keyword(s):  
Failure Mode ◽  
High Speed ◽  
Solder Joints ◽  
Impact Testing ◽  
Lead Free ◽  
Mode Analysis ◽  
Lead Free Solder ◽  
High Speed Impact ◽  
Failure Mode Analysis ◽  
Free Solder

scholarly journals Microscopic Change in Hardened Cement Paste Due to High-Speed Impact

2018 ◽  
Author(s):  
Yuya Sakai ◽  
Ivwananji Sikombe ◽  
Keiko Watanabe ◽  
Hiroyuki Inoue
Keyword(s):  
Cement Paste ◽  
High Speed ◽  
Impact Load ◽  
Hardened Cement ◽  
Hardened Cement Paste ◽  
High Speed Impact ◽  
Gas Gun ◽  
Microscopic Change ◽  
The Moment ◽  
The Impact

Impact load was applied to hardened cement paste (HCP) specimens using a gas gun to investigate microscopic changes in the specimens and develop a better response model of concrete subjected to impact load. Plasma emission was observed at the moment of impact at 420 m/s and the colour of the portion near the impact point turned brighter. This brighter portion was analysed, and it was observed that the pore structure was coarser compared to the other portion; however, the results of thermogravimetry and X-ray diffraction analysis were similar. A possible reason is that the generated heat was instantaneous and the rate of the temperature increase in the HCP decreased due to evaporation of water in the HCP. These results indicate that during impact at a few hundred m/s, porosity increase due to heat effect is more dominant than porosity decrease due to mechanical compaction.

A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead‐free solder joints

2012 ◽  
Vol 24 (1) ◽  
pp. 22-29 ◽  
Author(s):  
De‐Shin Liu ◽  
Chang‐Lin Hsu ◽  
Chia‐Yuan Kuo ◽  
Ya‐Ling Huang ◽  
Kwang‐Lung Lin ◽  
...  
Keyword(s):  
Low Temperature ◽  
Temperature Effects ◽  
High Speed ◽  
Solder Joints ◽  
Impact Testing ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Speed Impact ◽  
Testing Method ◽  
Free Solder

scholarly journals High-speed Impact Performance of Carbon/Epoxy Composites at Very Low Temperatures

2016 ◽  
Vol 167 ◽  
pp. 116-119 ◽  
Author(s):  
Vicente Sánchez Gálvez ◽  
Francisco Gálvez ◽  
David Cendón ◽  
Laura Sánchez
Keyword(s):  
Low Temperatures ◽  
High Speed ◽  
Epoxy Composites ◽  
Impact Performance ◽  
High Speed Impact

Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Ball Impact ◽  
Test Methodology ◽  
Surface Finishes ◽  
Reliability Of Solder Joints ◽  
Tin Silver Copper ◽  
Board Level ◽  
Immersion Tin ◽  
Board Level Reliability

The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this work, we present BIT results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.

Sign in / Sign up

Export Citation Format

Share Document