scholarly journals Thioetherimide-Modified Cyanate Ester Resin with Better Molding Performance for Glass Fiber Reinforced Composites

Polymers ◽  
2019 ◽  
Vol 11 (9) ◽  
pp. 1458 ◽  
Author(s):  
Pengchang Ma ◽  
Chuntao Dai ◽  
Shaohua Jiang
Keyword(s):  
Thermal Expansion ◽  
Glass Fiber ◽  
Printed Circuit Boards ◽  
Cyanate Ester ◽  
Reinforced Composites ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Glass Fiber Reinforced ◽  
Dimension Stability ◽  
Processing Properties

Cyanate ester (CE) resins with higher heat resistance, lower coefficients of thermal expansion (CTEs), and lower water absorption ratios are highly desired in printed circuit boards (PCBs). In this work, a CE was modified by copolymerization with a long-chain thioether bismaleimide (SBMI) to form a thioetherimide-modified CE (SBT). The results indicated that SBT had a wider processing window and better processing properties than a common bismaleimide-modified CE resin (MBMI). After molding with a glass fiber cloth, the composites (GSBT) exhibited moisture adsorption in the range of 1.4%–2.0%, high tensile strength in the range of 311–439 MPa, good mechanical retention of 70%–85% even at 200 °C, and good dimension stability, with coefficients of thermal expansion in the range of 17.3–18.6 (×10−6 m/°C). Such GSBT composites with superior properties would be good candidates for PCB applications.

Mounting Leadless Chip Carriers onto Printed Circuit Boards

1982 ◽  
Vol 1 (1) ◽  
pp. 38-43 ◽  
Author(s):  
D. Fishman ◽  
N. Cooper
Keyword(s):  
Thermal Expansion ◽  
Thermal Cycling ◽  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
Cycling Performance ◽  
Circuit Board ◽  
Circuit Boards ◽  
Acceptable Solution ◽  
Printed Circuit ◽  
Chip Carrier

It is reasoned that wide penetration of chip carriers into equipment for professional and commercial applications depends on developing methods for mounting the leadless types directly on to conventional polymer type printed circuit boards. The main problem to be overcome is fatigue failure of the solder joints due to the mismatch in thermal expansion, evidenced by poor thermal cycling performance. In this paper the thermal cycling performance is compared when four sizes of ceramic leadless chip carrier are mounted on a selection of printed circuit board materials ranging from the conventional to those specially formulated, either on the basis of matching the coefficient of thermal expansion of the chip carrier material, or to provide a layer of compliant elastomer material underneath the layer bearing the copper contact layer, so that strain due to thermal expansion mismatch is not transmitted to the solder layer. Over 400 thermal cycles (−55 to + 125°C) were recorded using proprietary versions of elastomer coated substrates. For appropriate applications the basis is thus laid for an economic and technically acceptable solution. The practical implications of two methods of soldering—wave (jet) and vapour phase—are also discussed.

COPPER/INVAR/COPPER

Alloy Digest ◽  
2004 ◽  
Vol 53 (1) ◽  
Keyword(s):  
Composite Material ◽  
Thermal Expansion ◽  
Printed Circuit Boards ◽  
Heat Treating ◽  
Heat Sinks ◽  
Circuit Boards ◽  
Annealed Condition ◽  
Roll Bonding ◽  
Printed Circuit ◽  
Metallic Composite Material

Abstract Copper/Invar/Copper is a wrought metallic composite material used in printed circuit boards, power planes, metal cores, hybrid enclosures, heat sinks, and other applications where coefficients of thermal expansion (CTE) match or where constraint of thermal expansion is required or beneficial. The laminated Cu/Invar/Cu composite material is metallurgically bonded by roll bonding and normally used in the fully annealed condition. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: FE-125. Producer or source: Engineered Materials Solutions Inc.

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