scholarly journals Colocalized Sensing and Intelligent Computing in Micro-Sensors

Sensors ◽  
2020 ◽  
Vol 20 (21) ◽  
pp. 6346
Author(s):  
Mohammad H Hasan ◽  
Ali Al-Ramini ◽  
Eihab Abdel-Rahman ◽  
Roozbeh Jafari ◽  
Fadi Alsaleem
Keyword(s):  
Electrical Signal ◽  
Virtual Node ◽  
Noise Resistance ◽  
Microelectromechanical System ◽  
Analog To Digital ◽  
Intelligent Computing ◽  
Electrostatically Actuated ◽  
Digital To Analog Converters ◽  
Mems Sensor ◽  
Mems Device

This work presents an approach to delay-based reservoir computing (RC) at the sensor level without input modulation. It employs a time-multiplexed bias to maintain transience while utilizing either an electrical signal or an environmental signal (such as acceleration) as an unmodulated input signal. The proposed approach enables RC carried out by sufficiently nonlinear sensory elements, as we demonstrate using a single electrostatically actuated microelectromechanical system (MEMS) device. The MEMS sensor can perform colocalized sensing and computing with fewer electronics than traditional RC elements at the RC input (such as analog-to-digital and digital-to-analog converters). The performance of the MEMS RC is evaluated experimentally using a simple classification task, in which the MEMS device differentiates between the profiles of two signal waveforms. The signal waveforms are chosen to be either electrical waveforms or acceleration waveforms. The classification accuracy of the presented MEMS RC scheme is found to be over 99%. Furthermore, the scheme is found to enable flexible virtual node probing rates, allowing for up to 4× slower probing rates, which relaxes the requirements on the system for reservoir signal sampling. Finally, our experiments show a noise-resistance capability for our MEMS RC scheme.

Detecting the 10 Angstroms That Change MEMS Performance

2004 ◽  
Author(s):  
Erika Schutte ◽  
Jack Martin
Keyword(s):  
Thin Films ◽  
Device Performance ◽  
Processing Conditions ◽  
Packaging Process ◽  
Mems Sensor ◽  
Process Characterization ◽  
Measurement Protocol ◽  
Mems Device

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.

scholarly journals Accurate Power-Efficient Format-Scalable Multi-Parallel Optical Digital-to-Analogue Conversion

Photonics ◽  
2021 ◽  
Vol 8 (2) ◽  
pp. 38
Author(s):  
Moshe Nazarathy ◽  
Ioannis Tomkos
Keyword(s):  
Energy Efficiency ◽  
Direct Detection ◽  
Coherent Detection ◽  
Performance Limits ◽  
Optical Modulators ◽  
Analog To Digital ◽  
Power Efficient ◽  
Optical Signals ◽  
Digital To Analog Converters ◽  
Optical Analog

In optical transmitters generating multi-level constellations, optical modulators are preceded by Electronic Digital-to-Analog-Converters (eDAC). It is advantageous to use eDAC-free Optical Analog to Digital Converters (oDAC) to directly convert digital bitstreams into multilevel PAM/QAM optical signals. State-of-the-art oDACs are based on Segmented Mach-Zehnder-Modulators (SEMZM) using multiple modulation segments strung along the MZM waveguides to serially accumulate binary-modulated optical phases. Here we aim to assess performance limits of the Serial oDACs (SEMZM) and introduce an alternative improved Multi-Parallel oDAC (MPoDAC) architecture, in particular based on arraying multiple binary-driven MZMs in parallel: Multi-parallel MZM (MPMZM) oDAC. We develop generic methodologies of oDAC specification and optimization encompassing both SEMZM and MPMZM options in Direct-Detection (DD) and Coherent-Detection (COH) implementations. We quantify and compare intrinsic performance limits of the various serial/parallel DD/COH subclasses for general constellation orders, comparing with the scant prior-work on the multi-parallel option. A key finding: COH-MPMZM is the only class synthesizing ‘perfect’ (equi-spaced max-full-scale) constellations while maximizing energy-efficiency-SEMZM/MPMZM for DD are less accurate when maximal energy-efficiency is required. In particular, we introduce multiple variants of PAM4|8 DD and QAM16|64 COH MPMZMs, working out their accuracy vs. energy-efficiency-and-complexity tradeoffs, establishing their format-reconfigurability (format-flexible switching of constellation order and/or DD/COH).

scholarly journals Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

2020 ◽  
Vol 10 (1) ◽  
pp. 494
Author(s):  
Pinki Kumari ◽  
Kuldeep Singh ◽  
Anuj Singal
Keyword(s):  
Performance Analysis ◽  
Pressure Sensor ◽  
Ceramic Mold ◽  
Mems Devices ◽  
Challenging Problem ◽  
Microelectromechanical System ◽  
Saturation Concentration ◽  
Mems Sensor ◽  
Hygroscopic Swelling

Today, Hygroscopic swelling is one of the biggest challenging problem of Epoxy mold compound (EMC) in packaging with Microelectromechanical system (MEMS) devices. To overcome this hygroscopic swelling problem of EMC and guard the devices, MEMS devices are molded in this paper with different Mold Compound (MC) i.e. titanium and ceramic etc. during their interconnection with the board. Also, a comparatively performance analysis of this various mold compound with MEMS pressure sensor has been studied in this paper at 60% humidity, 140 mol/m<sup>3</sup> saturation concentration and 25 <sup>o</sup>C. It was observed that hygroscopic swelling does not take place in the titanium mold compound. But, titanium is very costly so we have to consider something cheaper material i.e. ceramic in this paper. The Hygroscopic swelling in Ceramic Mold Compound after 1 year is nearly 0.05mm which is very less than epoxy.

scholarly journals Multiple Harmonics Fitting Algorithms Applied to Periodic Signals Based on Hilbert-Huang Transform

2013 ◽  
Vol 2013 ◽  
pp. 1-9 ◽  
Author(s):  
Hui Wang ◽  
Zhengshi Liu ◽  
Bin Zhu ◽  
Quanjun Song
Keyword(s):  
Signal Processing ◽  
Harmonic Distortion ◽  
Digital Signal ◽  
Periodic Signal ◽  
Sinusoidal Wave ◽  
Analog To Digital ◽  
Triangular Wave ◽  
Hilbert Huang Transform ◽  
Digital To Analog Converters ◽  
Periodic Signals

A new generation of multipurpose measurement equipment is transforming the role of computers in instrumentation. The new features involve mixed devices, such as kinds of sensors, analog-to-digital and digital-to-analog converters, and digital signal processing techniques, that are able to substitute typical discrete instruments like multimeters and analyzers. Signal-processing applications frequently use least-squares (LS) sine-fitting algorithms. Periodic signals may be interpreted as a sum of sine waves with multiple frequencies: the Fourier series. This paper describes a new sine fitting algorithm that is able to fit a multiharmonic acquired periodic signal. By means of a “sinusoidal wave” whose amplitude and phase are both transient, the “triangular wave” can be reconstructed on the basis of Hilbert-Huang transform (HHT). This method can be used to test effective number of bits (ENOBs) of analog-to-digital converter (ADC), avoiding the trouble of selecting initial value of the parameters and working out the nonlinear equations. The simulation results show that the algorithm is precise and efficient. In the case of enough sampling points, even under the circumstances of low-resolution signal with the harmonic distortion existing, the root mean square (RMS) error between the sampling data of original “triangular wave” and the corresponding points of fitting “sinusoidal wave” is marvelously small. That maybe means, under the circumstances of any periodic signal, that ENOBs of high-resolution ADC can be tested accurately.

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