N2 gas flow rate dependence on the high-k LaBxNy thin film characteristics formed by RF sputtering for floating-gate memory applications

Author(s):  
Kyung Eun Park ◽  
Hideki Kamata ◽  
Shun-ichiro OHMI
2015 ◽  
Vol 1734 ◽  
Author(s):  
Kento Nakanishi ◽  
Jun Otsuka ◽  
Masanori Hiratsuka ◽  
Chen Chung Du ◽  
Akira Shirakura ◽  
...  

ABSTRACTDiamond-like carbon (DLC) has widespread attention as a new material for its application to thin film solar cells and other semiconducting devices. DLC can be produced at a lower cost than amorphous silicon, which is utilized for solar cells today. However, the electrical properties of DLC are insufficient for this purpose because of many dangling bonds in DLC. To solve this problem, we investigated the effects of the fluorine incorporation on the structural and electrical properties of DLC.We prepared five kinds of fluorinated DLC (F-DLC) thin film with different amounts of fluorine. Films were deposited by the radio-frequency plasma enhanced chemical vapor deposition (RF-PECVD) method. C6H6 and C6HF5 were used as source gases. The total gas flow rate was constant and the gas flow rate ratio R (=C6H6 / (C6H6 + C6HF5)) was changed from 0 to 1 in 0.25 ratio steps. We also prepared nitrogen doped DLC (F-DLC) on p-Si using N2 gas as a doping gas to form nitrogen doped DLC (F-DLC) / p-Si heterojunction diodes.X-ray photoelectron spectroscopy (XPS) showed that fluorine concentration in the DLC films was controlled. Moreover, the XPS analysis of the C1s spectrum at R=2/4 showed the presence of CF bonding. At R=1, CF2 bonding was observed in addition to CF bonding. The sheet resistivity of the films changed from 3.07×1012 to 4.86×109 Ω. The minimum value was obtained at R=2/4. The current-voltage characteristics indicated that nitrogen doped F-DLC of 2/4 and p-Si heterojunction diode exhibited the best rectification characteristics and its energy conversion efficiency had been maximized. This is because of a decrease of dangling bonds density by ESR analysis and an increase of sp2 structures by Raman analysis. When the fluorine is over certain content, the sheet resistivity increases because chain structures become larger, which is due to the CF2 bonding in F-DLC prevents ring structures. Many C2F4 species were observed and it may become precursors of the chain structure domains, such as (CF2)n.In this study, we revealed effects of fluorine incorporation on DLC and succeeded in increasing its conductivity and improving rectification characteristics of DLC/ p-Si hetero-junction diodes. Our results indicate that DLC fluorination is effective for the semiconducting material, such as solar cell applications.


2011 ◽  
Vol 63 (6) ◽  
pp. 433-439 ◽  
Author(s):  
Mohammad Asaduzzaman Chowdhury ◽  
Dewan Muhammad Nuruzzaman ◽  
Khaled Khalil ◽  
Mohammad Lutfar Rahaman

MRS Advances ◽  
2016 ◽  
Vol 2 (29) ◽  
pp. 1533-1538 ◽  
Author(s):  
S. Ishihara ◽  
Y. Hibino ◽  
N. Sawamoto ◽  
T. Ohashi ◽  
K. Matsuura ◽  
...  

ABSTRACTMolybdenum disulfide (MoS2) thin films were fabricated by two-step chemical vapor deposition (CVD) using (t-C4H9)2S2 and the effects of temperature, gas flow rate, and atmosphere on the formation were investigated in order to achieve high-speed low-temperature MoS2 film formation. From the results of X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) investigations, it was confirmed that c-axis orientation of the pre-deposited Mo film has a significant involvement in the crystal orientation after the reaction low temperature sulfurization annealing and we successfully obtained 3 nm c-axis oriented MoS2 thin film. From the S/Mo ratios in the films, it was revealed that the sulfurization reaction proceeds faster with increase in the sulfurization temperature and the gas flow rate. Moreover, the sulfurization under the H2 atmosphere promotes decomposition reaction of (t-C4H9)2S2, which were confirmed by XPS and density functional theory (DFT) simulation.


2012 ◽  
Vol 1430 ◽  
Author(s):  
J.G. Lisoni ◽  
L. Breuil ◽  
P. Blomme ◽  
J. Van Houdt

ABSTRACTWe report on the materials issues involved in the hybrid floating gate (HFG) device fabrication, where the interpoly dielectric is replaced by an intermetal dielectric (IMD). Indeed, in HFG the dielectric is inserted in between two metal layers in a metal\dielectric\metal stack. The materials of choice were TiN as the metal layer and Al2O3 and HfO2 (and their combination) as IMD. The program/erase performance is discussed based on the dielectric constant and crystallinity of the IMD and the metal-IMD interface characteristics.


2009 ◽  
Author(s):  
Zhe Kang ◽  
Weizhi Li ◽  
Yadong Jiang
Keyword(s):  
Gas Flow ◽  

AIP Advances ◽  
2017 ◽  
Vol 7 (12) ◽  
pp. 125105 ◽  
Author(s):  
Muntaser Al-Mansoori ◽  
Sahar Al-Shaibani ◽  
Ahlam Al-Jaeedi ◽  
Jisung Lee ◽  
Daniel Choi ◽  
...  

2006 ◽  
Vol 506-507 ◽  
pp. 92-95 ◽  
Author(s):  
T. Oshiro ◽  
F. Begum ◽  
M. Yamazato ◽  
A. Higa ◽  
T. Maehama ◽  
...  

2020 ◽  
Vol 30 (9) ◽  
pp. 095010
Author(s):  
Qian Zhang ◽  
Yong Wang ◽  
Ran Tao ◽  
Hamdi Torun ◽  
Jin Xie ◽  
...  

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