Experimental Study of Thermal Resistance of a Liquid-Thermoelectric System

2003 ◽  
Author(s):  
Jihad Y. Hammoud
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Control Unit ◽  
Thermal Control ◽  
Liquid System ◽  
Bulk Temperature ◽  
Management Technique ◽  
Thermo Electric ◽  
Management Capability ◽  
A Tec

The heat generated by microprocessors is steadily increasing as die size shrinks. The trend towards increasing microprocessor heat flux is forcing thermal engineers to consider alternative system cooling technologies. Greater thermal control is also an issue during the engineering test of microprocessors and package characterization. The thermal challenges posed during test and debug are significant as power levels are higher than system power and temperature control requirements are very tight. Thermo-electric cooling technology (TEC) integrated with liquid cooling has evolved significantly in the past few years as a thermal management technique for engineering test and debug. In this study, an experimental approach was taken to characterize a TEC-based thermal control unit (TCU). The TCU thermal resistance was calculated as a function of the water temperature and device heat outputs. Several tests evaluated the suitability of using the TCU to control a device at low and elevated package case temperatures. Test results indicated that the TEC-Liquid system can operate in a cold or hot mode and that the thermal management capability of the system is a strong function of the liquid bulk temperature on the hot side of the TEC surface. The water bulk temperature at which the TCU fails to maintain the required device temperature is also reported in this paper.

Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials

2003 ◽  
Author(s):  
Jihad Y. Hammoud
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Cooling System ◽  
Control Unit ◽  
Thermal Control ◽  
Active Device ◽  
Thermo Electric ◽  
Surface Contact ◽  
Liquid Cooling System ◽  
Interface Materials

Thermal interface materials are crucial to improving the overall performance of an active device and the design/selection of a thermal management system. In most practical thermal management protocols, interface materials are used to enhance heat transfer by reducing thermal resistance across contact surfaces. This improves surface contact by forming a continuous path of heat across an interface. This paper focuses on characterizing a thermal control unit (TCU) and employing the thermo-electric technology (TEC) in a liquid cooling system, using selected interface materials mounted on the TEC surfaces. Qualification tests performed on several common interface materials within the TCU are presented in this paper, with results compared to surface-to-surface contact. Tests included the measurement of minimum achievable device case temperature and the minimum TCU thermal resistance as a function of the net heat using selected interface materials. In addition, package minimum case temperature was measured as a function of pressure exhibited on the interface material to determine the TEC optimum contact pressure. Based on results, graphite base interface material was selected as an optimum interface material between TEC assembly and the TCU internal components.

Application of thermal management technique to thermal control for ultraviolet imaging spectrometers

2014 ◽  
Vol 22 (7) ◽  
pp. 1877-1885
Author(s):  
郭亮 GUO Liang ◽  
吴清文 WU Qing-wen ◽  
黄勇 HUANG Yong ◽  
王淑荣 WANG Shu-rong
Keyword(s):  
Thermal Management ◽  
Thermal Control ◽  
Management Technique

Thermal Management and Alignment Strategies in MEMS Tunable Laser Packaging

2009 ◽  
Vol 74 ◽  
pp. 319-322
Author(s):  
Ji Fang Tao ◽  
Jonathan Tamil ◽  
Jian Wu ◽  
Kun Xu ◽  
Jin Tong Lin ◽  
...  
Keyword(s):  
Thermal Management ◽  
Tunable Laser ◽  
Thermal Control ◽  
High Accuracy ◽  
Vertical Alignment ◽  
Thermo Electric ◽  
Laser Chip ◽  
Optical Alignment ◽  
Bonding Method ◽  
Packaging Cost

A packaging architecture is developed for MEMS tunable laser (MEMS-TL). The hybrid integration of chips is realized under high accuracy thermal control and precise alignment. The thermal conductivity of the laser chip has been improved up to 60% by the proper substrate design of device and epi-down bonding method. Under the analysis of heat flux, we employ a thermo-electric cooler (TEC) to stabilize the temperature. The substrate is designed to accommodate gain chips with minimal active optical alignment, thus reducing the packaging cost. With this packaging scheme, the insertion loss is greatly induced less than 1 dB due to the advantages of horizontal and vertical alignment in optical fiber fastening and laser diode bonding.

DETERMINING THERMAL RESISTANCE IN THE MODEL OF THE LIQUID CIRCUIT OF SPACECRAFT THERMAL CONTROL SYSTEM

2019 ◽  
Vol 20 (3) ◽  
pp. 366-374
Author(s):  
Yu. N. Shevchenko ◽  
◽  
A. A. Kishkin ◽  
F. V. Tanasiyenko ◽  
O. V. Shilkin ◽  
...  
Keyword(s):  
Control System ◽  
Thermal Resistance ◽  
Thermal Control ◽  
Thermal Control System ◽  
Spacecraft Thermal Control

scholarly journals Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 958
Author(s):  
Maosheng Zhang ◽  
Yu Bai ◽  
Shu Yang ◽  
Kuang Sheng
Keyword(s):  
Thermal Resistance ◽  
Power Control ◽  
Electric Vehicles ◽  
Low Cost ◽  
Control Unit ◽  
Underlying Mechanism ◽  
Power Converter ◽  
Liquid Cooling ◽  
Integration Density ◽  
Unit Module

With the increasing integration density of power control unit (PCU) modules, more functional power converter units are integrated into a single module for applications in electric vehicles or hybrid electric vehicles (EVs/HEVs). Different types of power dies with different footprints are usually placed closely together. Due to the constraints from the placement of power dies and liquid cooling schemes, heat-flow paths from the junction to coolant are possibly inconsistent for power dies, resulting in different thermal resistance and capacitance (RC) characteristics of power dies. This presents a critical challenge for optimal liquid cooling at a low cost. In this paper, a highly integrated PCU module is developed for application in EVs/HEVs. The underlying mechanism of the inconsistent RC characteristics of power dies for the developed PCU module is revealed by experiments and simulations. It is found that the matching placement design of power dies with a heat sink structure and liquid cooler, as well as a liquid cooling scheme, can alleviate the inconsistent RC characteristics of power dies in highly integrated PCU modules. The findings in this paper provide valuable guidance for the design of highly integrated PCU modules.

Asymmetric Sandwich Structural Cellulose-based Film with Self-supported MXene and AgNW Layers for Flexible Electromagnetic Interference Shielding and Thermal Management

Nanoscale ◽  
2021 ◽  
Author(s):  
Bing Zhou ◽  
Qingtao Li ◽  
Penghui Xu ◽  
Yuezhan Feng ◽  
Jianmin Ma ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Electromagnetic Interference ◽  
High Potential ◽  
Emi Shielding ◽  
Electromagnetic Interference Shielding ◽  
Conductive Films

Flexible cellulose-based conductive films reveal the high potential in electromagnetic interference (EMI) shielding and thermal management applications. However, the high contact electrical/thermal resistance in these films is still one of...

Critical review towards thermal management systems of lithium-ion batteries in electric vehicle with its electronic control unit and assessment tools

2021 ◽  
pp. 095440702098286
Author(s):  
C Kannan ◽  
R Vignesh ◽  
C Karthick ◽  
B Ashok
Keyword(s):  
Lithium Ion Batteries ◽  
Thermal Management ◽  
Electronic Control Unit ◽  
Lithium Ion ◽  
Control Unit ◽  
Assessment Tools ◽  
Electronic Control ◽  
Battery Thermal Management ◽  
Thermal Management System ◽  
Battery Thermal Management System

Lithium-ion batteries are facing difficulties in an aspect of protection towards battery thermal safety issues which leads to performance degradation or thermal runaway. To negate these issues an effective battery thermal management system is absolute pre-requisite to safeguard the lithium-ion batteries. In this context to support the future endeavours and to improvise battery thermal management system (BTMS) design and its operation the article reveals on three aspects through the analysis of scientific literatures. First, this paper collates the present research progress and status of various battery management strategies employed to lithium-ion batteries. Further, to promote stable and efficient BTMS operation as an initiation the extensive attention is paid towards roles of BTMS electronic control unit and also presented the essential functionality need to consider for designing best BTMS control strategy. Finally, elucidates the various unconventional assessment tools can be employed to recognize the suitable thermal management technique and also for establish optimum BTMS operation based on requirements. From the experience of this article additionally delivers some of the research gaps identified and the essential areas need to focus for the development of superior lithium-ion BTMS technology. All the contents reveal in this article will hopefully assist to the design commercially suitable effective BTMS technology especially for electro-mobility application.

Self-Assembled Boron Nitride Nanotube Reinforced Graphene Oxide Aerogels for Dielectric Nanocomposites with High Thermal Management Capability

2019 ◽  
Vol 12 (1) ◽  
pp. 1436-1443 ◽  
Author(s):  
Chi Zhang ◽  
Rongjin Huang ◽  
Yongguang Wang ◽  
Zhixiong Wu ◽  
Hua Zhang ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Boron Nitride ◽  
Thermal Management ◽  
Boron Nitride Nanotube ◽  
Management Capability ◽  
Self Assembled

Exergy Analysis of Data Center Thermal Management Systems

2003 ◽  
Author(s):  
Amip J. Shah ◽  
Van P. Carey ◽  
Cullen E. Bash ◽  
Chandrakant D. Patel
Keyword(s):  
Thermal Management ◽  
Data Center ◽  
Data Centers ◽  
Exergy Analysis ◽  
Thermal Control ◽  
Management Systems ◽  
World Systems ◽  
Sample Data ◽  
Potential Applications ◽  
Temperature Ranges

Data centers today contain more computing and networking equipment than ever before. As a result, a higher amount of cooling is required to maintain facilities within operable temperature ranges. Increasing amounts of resources are spent to achieve thermal control, and tremendous potential benefit lies in the optimization of the cooling process. This paper describes a study performed on data center thermal management systems using the thermodynamic concept of exergy. Specifically, an exergy analysis has been performed on sample data centers in an attempt to identify local and overall inefficiencies within thermal management systems. The development of a model using finite volume analysis has been described, and potential applications to real-world systems have been illustrated. Preliminary results suggest that such an exergy-based analysis can be a useful tool in the design and enhancement of thermal management systems.

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