Influence of Compressive Torsion Processing Temperature on Microstructure Refinement and Property of Aluminum Alloy

2007 ◽  
pp. 133-136
Author(s):  
Shotaro Tahara ◽  
Yuji Kume ◽  
Makoto Kobashi ◽  
Naoyuki Kanetake
Keyword(s):  
Aluminum Alloy ◽  
Processing Temperature ◽  
Microstructure Refinement

Influence of Compressive Torsion Processing Temperature on Microstructure Refinement and Property of Aluminum Alloy

2007 ◽  
Vol 26-28 ◽  
pp. 133-136 ◽  
Author(s):  
Shotaro Tahara ◽  
Yuji Kume ◽  
Makoto Kobashi ◽  
Naoyuki Kanetake
Keyword(s):  
Plastic Deformation ◽  
Deformation Process ◽  
Large Strain ◽  
Tensile Elongation ◽  
Total Elongation ◽  
Work Piece ◽  
Processing Temperature ◽  
Microstructure Refinement ◽  
Plastic Deformation Process ◽  
Eutectic Si

A compressive torsion processing (CTP) was applied to hypereutectic Al-Si alloy in order to raise ductility and formability by microstructure refinement of the alloy. The CTP is a unique severe plastic deformation process and it can easily apply large strain to a work piece without change in shape. In the present work, influence of compressive torsion processing temperature on microstructure refinement and tensile property of hypereutectic Al-Si alloy is dealt with. When the CTP was applied on the Al-Si alloy, primary and eutectic Si particles were refined more effectively at lower processing temperature. Total tensile elongation of CTPed alloy was four times as large as that of non CTPed one. Distribution of the total elongation was quite uniform in the whole CTPed specimen.

scholarly journals Optimized Combination of Strength and Electrical Conductivity of Al-Mg-Si Alloy Processed by ECAP with Two-Step Temperature

Materials ◽  
2020 ◽  
Vol 13 (7) ◽  
pp. 1511 ◽  
Author(s):  
Nannan Zhao ◽  
Chunyan Ban ◽  
Hongfei Wang ◽  
Jianzhong Cui
Keyword(s):  
Electrical Conductivity ◽  
Tensile Strength ◽  
Aluminum Alloy ◽  
Ultimate Tensile Strength ◽  
Yield Strength ◽  
High Strength ◽  
Processing Temperature ◽  
Ecap Processing ◽  
Ultrafine Grained ◽  
6063 Aluminum Alloy

The mechanical properties and electrical conductivity of 6063 aluminum alloy subjected to equal-channel angular press (ECAP) at room temperature (RT), 200 °C, and two-step temperature schedule (TST) have been investigated in this study. The TST refers to one pass at 200 °C followed by further successive pressing at RT. It is shown that this method is effective in obtaining the combination of high strength and electrical conductivity. After two passes, the higher strength can be achieved in TST condition (328 MPa yield strength and 331 MPa ultimate tensile strength), where the changing parameter is processing temperature from the first pass at 200 °C to the second pass at RT, as compared to two passes in RT condition (241 MPa yield strength and 250 MPa ultimate tensile strength) and two passes in 200 °C condition (239 MPa yield strength and 258 MPa ultimate tensile strength). This performance could be associated with grain refinement and nanosized precipitates in TST condition. Moreover, in contrast to RT condition, a higher electrical conductivity was observed in TST condition. It reveals that high strength and electrical conductivity of 6063 aluminum alloy can be obtained simultaneously by ECAP processing in TST condition because of ultrafine-grained microstructure and nanosized precipitates.

Homogeneity of Grain Refinement of Aluminum Alloy with Compressive Torsion Processing

2007 ◽  
Vol 26-28 ◽  
pp. 107-110 ◽  
Author(s):  
Yuji Kume ◽  
Makoto Kobashi ◽  
Naoyuki Kanetake
Keyword(s):  
Aluminum Alloy ◽  
Grain Refinement ◽  
Cylindrical Specimen ◽  
Combined Loading ◽  
Processing Temperature ◽  
Homogeneous Microstructure ◽  
Refined Microstructure ◽  
Cylindrical Metal ◽  
Compressive Pressure ◽  
Lower Temperature

Compressive torsion combined loading that uses relatively low compressive pressure has a great advantage of microstructure refinement of cylindrical metal blocks without changing their shape while processing. In the present work, effects of processing temperature and rotation times on homogeneity of the refined microstructure were investigated for Al-5%Mg alloy. Although lower processing temperature was effective to obtain fine grains, it was difficult to obtain homogeneous refinement at lower temperature. Higher processing temperature was favorable to obtain homogeneous microstructure, for instance, in the cylindrical specimen of φ25×10 mm the homogeneous refinement could be obtained at higher temperatures than 373K. Increasing rotation times was also effective to obtain homogeneous refined microstructure for thicker specimens.

scholarly journals Numerical simulation of deformation behavior of aluminum alloy sheets under processing by groove pressing method

2018 ◽  
Vol 143 ◽  
pp. 01011 ◽  
Author(s):  
Evgeny Moskvichev ◽  
Alexander Kozulin ◽  
Vladimir Krasnoveikin ◽  
Vladimir Skripnyak
Keyword(s):  
Numerical Simulation ◽  
Plastic Deformation ◽  
Aluminum Alloy ◽  
Plastic Strain ◽  
Severe Plastic Deformation ◽  
Reaction Force ◽  
Material Structure ◽  
Processing Temperature ◽  
Pressing Method ◽  
Pressing Cycle

The results of theoretical estimation of capabilities of the material structure modification of 1560 aluminum alloy sheets under processing by severe plastic deformation are presented in this paper. Severe plastic deformation of flat specimens is effected by the constrained groove pressing method in original dies with trapezoidal teeth. The numerical simulation results of the sheet specimen treatment process by severe plastic deformation were used for dies designing. The stress-strain state of flat aluminum alloy specimens and the steel dies at high processing temperature, support reaction force during pressing and the degrees of plastic strain accumulation at the optimum mode of pressing were estimated. The main numerical result is the value of accumulated plastic strain in the specimen per one pressing cycle which is about 1.14. Large degrees of strain are the reasons of grain structure and material texture changes, which leads to inevitable change of its physical-mechanical properties. Increasing the number of pressing cycles leads to proportional increase of the degree of accumulated plastic strain.

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

Interactions Between Al and Cr Thin Films

1976 ◽  
Vol 34 ◽  
pp. 638-639
Author(s):  
R. M. Anderson ◽  
T. M. Reith ◽  
M. J. Sullivan ◽  
E. K. Brandis
Keyword(s):  
Thin Films ◽  
Room Temperature ◽  
Vacuum System ◽  
Processing Temperature ◽  
Diffusion Couples ◽  
Electronic Circuits ◽  
Intermetallic Formation ◽  
Si Substrates ◽  
Aluminum Silicon

Thin films of aluminum or aluminum-silicon can be used in conjunction with thin films of chromium in integrated electronic circuits. For some applications, these films exhibit undesirable reactions; in particular, intermetallic formation below 500 C must be inhibited or prevented. The Al films, being the principal current carriers in interconnective metal applications, are usually much thicker than the Cr; so one might expect Al-rich intermetallics to form when the processing temperature goes out of control. Unfortunately, the JCPDS and the literature do not contain enough data on the Al-rich phases CrAl7 and Cr2Al11, and the determination of these data was a secondary aim of this work.To define a matrix of Cr-Al diffusion couples, Cr-Al films were deposited with two sets of variables: Al or Al-Si, and broken vacuum or single pumpdown. All films were deposited on 2-1/4-inch thermally oxidized Si substrates. A 500-Å layer of Cr was deposited at 120 Å/min on substrates at room temperature, in a vacuum system that had been pumped to 2 x 10-6 Torr. Then, with or without vacuum break, a 1000-Å layer of Al or Al-Si was deposited at 35 Å/s, with the substrates still at room temperature.

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