Aiming to minimize the interface state density, we fabricated MOS capacitors on n-type
4H-SiC by using wet oxidation of nitrogen implanted layers. We investigated a wide range of
implantation dose, including a high dose able to amorphise a surface SiC layer with the intent to
reduce the oxidation time. The oxide quality and the SiO2-SiC interface properties were
characterized by capacitance-voltage measurements of the MOS capacitors. The proposed process,
in which nitrogen is ion-implanted on SiC layer before a wet oxidation, is effective to reduce the
density of interface states near the conduction band edge if a high concentration of nitrogen is
introduced at the SiO2-SiC interface. We found that only the nitrogen implanted at the oxide-SiC
interface reduces the interface states and we did not observe the generation of fixed positive charges
in the oxide as a consequence of nitrogen implantation. Furthermore, the concentration of the slow
traps evaluated from the Slow Trap Profiling technique was low and did not depend on the nitrogen
implantation fluence.