Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

2016 ◽  
Vol 1133 ◽  
pp. 391-395 ◽  
Author(s):  
Hardinnawirda Kahar ◽  
Zetty Akhtar Abd Malek ◽  
Siti Rabiatull Aisha Idris ◽  
Mahadzir Ishak
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Printed Circuit Board ◽  
Coating Layer ◽  
Hardness Test ◽  
Electroless Nickel ◽  
Circuit Board ◽  
High Wear Resistance ◽  
Plating Bath ◽  
Printed Circuit

Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity in coating thickness. However, in semiconductor sector, the usage of Nickel Boron as coating layer still insufficient due to lack of study in term of its potential as coating on printed circuit board. This study aims to investigate the mechanical and physical properties of electroless Nickel Boron as potential printed circuit board coating layer. The study conducted by cutting Copper substrates to 50mm x 7mm x 1.5mm and then subjected to surface pre-treatment before soak in Nickel Boron plating bath solution that contain of different concentration of Sodium Borohydrate (NaBH4), 0.4, 0.6,0.8,1.0 and 1.2 g/l. Surface roughness was evaluated using 3D Roughness Reconstruction software. For mechanical properties, the hardness test was conducted by using Vickers Hardness Test MMT-X7 Matsuzawa and surface structure was evaluate using ProgRes C3 IM7200 Optical Microscope and Field Emission Scanning Electron Microscopy (FESEM). It was found that the surface roughness and hardness resistance were affected by Sodium Borohydrate (NaBH4) that correlate with the surface microstructure.

scholarly journals Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Metals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 364
Author(s):  
Hyejun Kang ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
Mechanical Properties ◽  
Melting Temperature ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Solder Alloys ◽  
Initial State ◽  
Printed Circuit ◽  
Long Time ◽  
Flexible Printed Circuit ◽  
Electronic Parts

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed.

scholarly journals A Comprehensive Study on The Accelerated Weathering Properties of Polypropylene—Wood Composites with Non-Metallic Materials of Waste-Printed Circuit Board Powders

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 876 ◽  
Author(s):  
Shenghui Tian ◽  
Yuanfang Luo ◽  
Jizun Chen ◽  
Hui He ◽  
Yong Chen ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Uv Exposure ◽  
Metallic Materials ◽  
Wood Composites ◽  
Carbonyl Index ◽  
Printed Circuit ◽  
Waste Printed Circuit Board ◽  
Pp Composites

In this study, non-metallic materials of waste-printed circuit board powders (WPCBP) were successfully used as reinforcing filler to produce polypropylene (PP)–wood composites, and their effect on the weathering properties of PP composites were fully evaluated via oxidation induction time (OIT), attenuated total reflectance Fourier-transform infrared spectroscopy (ATR-FTIR), differential scanning calorimetry, vicat softening point (VST), scanning electron microscopy, and mechanical properties analysis. The OIT analysis confirmed that the anti-thermal oxidative aging properties of PP–wood composites were decreased with the loading of WPCBP. Apart from that, the PP composite, reinforced with 30 wt.% of WPCBP, exhibited the highest value of active energy, which suggests that it is more sensitive to temperature and oxygen when compared with other PP composites. The mechanical properties analysis revealed that neat PP exhibited the poorest weathering properties after being subjected to UV exposure, and its retention rate of tensile strength and notched impact strength were only 70.6% and 59.6%, respectively, while WPCBP and wood flour (WF) could efficiently improve the retention rates of the mechanical properties of the PP composites when subjected to UV exposure. The visual appearance of the PP composites after being subjected to UV exposure showed more and smaller cracks with the loading of WPCBP and WF. The ATR-FTIR results revealed that the carbonyl index increased for all the weathered samples, and the more WPCBP was added into the PP composites led to a higher carbonyl index value, which might be due to the multivalent transition metals in WPCBP, which accelerate the photo-oxidation of the PP composites. The VST results show that both WPCBP and WF can effectively enhance the heat deformation resistance of the PP composites that have been subjected to UV exposure.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

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