Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials
2011 ◽
Vol 391-392
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pp. 332-335
Keyword(s):
Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.
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2011 ◽
Vol 308-310
◽
pp. 804-807
2017 ◽
Vol 30
(2)
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pp. 202-210
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2020 ◽
Vol 199
◽
pp. 108228
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2018 ◽
Vol 153
◽
pp. 210-219
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