Polymer Core BGA Stress Analysis at Minimal Vertical Loading

2012 ◽  
Vol 622-623 ◽  
pp. 639-642 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
N.A.Z. Rahman ◽  
M.H.A. Aziz
Keyword(s):  
Stress Response ◽  
Stress Analysis ◽  
Electronic Packaging ◽  
Solder Ball ◽  
Ball Grid Array ◽  
New Materials ◽  
Vertical Loading ◽  
Packaging Industry ◽  
Simulation Results

Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Higher Copper Composition Shear Stress Analysis on Lead Free Solder Ball

2013 ◽  
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Phaklen Ehkan ◽  
Steven Taniselass
Keyword(s):  
Shear Stress ◽  
Stress Analysis ◽  
Solder Ball ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Ceramic ball grid array package stress analysis

2017 ◽  
Author(s):  
S. H. B. S. Badri ◽  
M. H. A. Aziz ◽  
N. R. Ong ◽  
Z. Sauli ◽  
J. B. Alcain ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Ball Grid Array ◽  
Ceramic Ball ◽  
Ball Grid Array Package

An Improved Sliding Mode Control Method and its Application

2012 ◽  
Vol 200 ◽  
pp. 459-461
Author(s):  
Jian Zhu ◽  
Chang Fan Zhang ◽  
Mao Zhen Cui ◽  
Gang Huang
Keyword(s):  
Motor Control ◽  
Control Method ◽  
Sliding Mode ◽  
Variable Speed ◽  
Servo Motor ◽  
Motor Speed ◽  
Reaching Law ◽  
Speed Range ◽  
Packaging Industry ◽  
Simulation Results

With the shaftless driving technology used in the packaging industry,servo motor control has become increasingly demanding. Beginning with the reasons of chattering, this article proposes a new sliding mode reaching law,adding a power attenuation term in front of the variable speed item,and then affects the shaftless gravure package printing chromatography system with PMSM as the actuator, improved servo motor speed range and efficency of the shaftless driving system.At last,the simulation results indicate the effectiveness of the proposed approach.

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

2012 ◽  
Vol 622-623 ◽  
pp. 647-651 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
A.H.M. Shapri ◽  
R. Vairavan
Keyword(s):  
Stress Response ◽  
Shear Test ◽  
Copper Wire ◽  
Gold Wire ◽  
Shear Tests ◽  
Groove Surface ◽  
Wire Bond ◽  
Packaging Industry ◽  
Semiconductor Packaging ◽  
Surface Bond

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

Material Issues of Low Temperature Co-fired Ceramic (LTCC) Fine Pitch Chip Scale Package (CSP) Designs

2003 ◽  
Vol 783 ◽  
Author(s):  
Megan M. Owens ◽  
Joseph W. Soucy ◽  
Thomas F. Marinis ◽  
Kevin A. Bruff ◽  
Henry G. Clausen
Keyword(s):  
Shear Test ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Substrate Material ◽  
Test Results ◽  
Shear Tests ◽  
Fine Pitch ◽  
Test Board ◽  
Chip Scale Package ◽  
Ltcc Substrate

ABSTRACTLTCC substrates for fine pitch (1.0 mm and 0.8 mm) CSP applications have been designed, fabricated, and assembled. The assembly process, including ball grid array (BGA) solder ball attach, die mount, wire bond, and glob top is described. The material and physical design interaction issues that emerged during development are discussed.The initial CSP design was conventional, with co-fired yellow gold (Au) vias and capture pads and post-fired solderable gold (PtPdAu) pads for solder ball attachment. Because LTCC tape shrinks during co-fire, solder pads were applied post co-fire to ensure proper mating with existing test fixtures and to provide the best alignment relative to the CSP body. Solder pad to capture pad misalignment was visible following solder pad firing. After CSP attachment to a test board, electrical tests revealed opens. Investigation led to the following conclusions. The decreased solder pad diameter necessary to accommodate the fine pitch design was significant relative to the area allocated for the underlying via and capture pad. Misalignment that would have been hidden under larger solder pads was exposed. Even when the capture pad surface was not visibly exposed, the offset solder pad meant less material between the capture pad and the solder ball, less of a barrier to solder leaching. Solder leaching into the yellow gold, observed after CSP removal from the test board, was the cause of the electrical disconnects. In the second design, the capture pad was eliminated in order to discourage leaching by reducing the volume of yellow gold available to alloy with the solder pad during co-fire. Reflow operations still resulted in leached solder pads. A third design replaced the first-layer via yellow gold with a solderable gold. This design proved to be robust.While developing designs and fabricating these prototypes, it was noted that all ball failures consistently occurred between the solder pad and the LTCC substrate. To investigate adhesion using different metallizations, shear tests were performed on LTCC substrates with either post-fired solder pads or co-fired pads. To investigate how the substrate material affects adhesion, alumina CSPs were also sheared. Shear test results are presented.

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