Effect of Stabilizers on Electromagnetic Property of Electroless Ni Coating on Aluminum Powder

2013 ◽  
Vol 750-752 ◽  
pp. 2070-2073 ◽  
Author(s):  
Zhe Li ◽  
Zhi Dong Xia ◽  
Xiao Ya Wang
Keyword(s):  
Electrical Conductivity ◽  
Aluminum Powder ◽  
Electroless Plating ◽  
Electromagnetic Property ◽  
Plating Bath ◽  
Aluminum Powders ◽  
Conductive Fillers ◽  
Electroless Ni

Nickel-coated aluminum powders used as conductive fillers were prepared with different stabilizers added in electroless plating bath. Their Electrical conductivity and magnetoconductivity were measured to evaluate the effect of stabilizers on Nickel-coated aluminum powders. The results suggested that the electrical conductivity of Ni-coated aluminum powder was dependent on the variety and content of stabilizers while the magnetoconductivity was irrelevant to the stabilizers. It was proved that the concentration and variety of stabilizer had different influence on the microstructure of coating and changed the electrical conductivity of Ni-coated aluminum powder thereby.

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

Synthesis of Aluminum Nitride Whiskers Via a Vapor-Liquid-Solid Process

1998 ◽  
Vol 547 ◽  
Author(s):  
Ying Dai ◽  
Ce-Wen Nan
Keyword(s):  
Carbon Black ◽  
Aluminum Nitride ◽  
Aluminum Powder ◽  
Nitrogen Atmosphere ◽  
Processing Conditions ◽  
Vapor Liquid Solid ◽  
Aluminum Powders ◽  
Sem And Tem ◽  
Vapor Liquid Solid Mechanism ◽  
Vapor Liquid

AbstractAluminum nitride whiskers were synthesized by nitridation of commercial aluminum powder at 1623K in a nitrogen atmosphere. The starting materials consisted of aluminum and carbon black. The carbon acted as a barrier between aluminum powders during nitridation and was removed by heating in air at 923K. The whiskers were about 0.5-1μm in diameter and 10-20μm in length. The droplets at the whisker tips showed that the whiskers grew via a vapor-liquid-solid mechanism. The morphologies of the whiskers were studied by means of SEM and TEM. The formation of the whiskers depended on the processing conditions.

scholarly journals Development of Electroless Ni Plating Bath Using Ti (III) Ion Reductant.

2002 ◽  
Vol 53 (10) ◽  
pp. 694-697 ◽  
Author(s):  
Shinji INAZAWA ◽  
Masatoshi MAJIMA ◽  
Keiji KOYAMA ◽  
Yoshie TANI ◽  
Shigeyoshi NAKAYAMA ◽  
...  
Keyword(s):  
Plating Bath ◽  
Electroless Ni

scholarly journals 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2015 ◽  
Vol 2015 ◽  
pp. 1-11
Author(s):  
Ahmet Ozan Gezerman ◽  
Burcu Didem Çorbacıoğlu
Keyword(s):  
Waste Water ◽  
Electroless Plating ◽  
Thioglycolic Acid ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Bath ◽  
Bath Solution ◽  
Microscope Images

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

Influence of Preliminary Heat Treatment and Ball Milling of Aluminum Powder on Cold Spray Process

2021 ◽  
Vol 313 ◽  
pp. 127-135
Author(s):  
S.V. Klinkov ◽  
V.F. Kosarev ◽  
A.E. Chesnokov ◽  
A.V. Smirnov ◽  
V.S. Shikalov
Keyword(s):  
Heat Treatment ◽  
Ball Milling ◽  
Aluminum Powder ◽  
Cold Spraying ◽  
Preliminary Heat Treatment ◽  
Aluminum Powders ◽  
Aluminum Coatings ◽  
Spray Process ◽  
Spraying Process ◽  
Milled Powders

This paper presents the results of a study of the effect of preliminary heat treatment and ball milling of aluminum powder on the cold spraying process and the properties of the obtained coatings (porosity and microhardness). The ball milling of aluminum powder leads to an increase in specific surface area, a decrease in apparent density and a decrease in the value of the crystallite size, which indicates a decrease in grain size. It is shown that coatings deposited from ball milled powders have slightly higher coatings hardness averagely. The profilometry of aluminum coatings obtained under the same conditions from the initial and processed powders did not reveal significant changes in the form of coatings and their typical dimensions (width, thickness), which indicates the absence of significant changes in the deposition coefficient of the initial and processed aluminum powders. Ball milled powders on average correspond to slightly higher hardnesses of coatings.

Moisture and Hydrogen Release in Optoelectronic Hermetic Packages

2013 ◽  
Vol 2013 (1) ◽  
pp. 000061-000066
Author(s):  
M. Albarghouti ◽  
N. El Dahdah ◽  
G. Perosevic ◽  
S. Jain ◽  
J-M Papillon ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Moisture Content ◽  
Hydrogen Content ◽  
Electroless Plating ◽  
Hydrogen Release ◽  
Surface Oxides ◽  
Sims Analysis ◽  
Electroless Ni

In this work we investigated the effect of Nickel (Ni) plating process on the Hydrogen (H) and moisture content of hermetic packages such as those used in optoelectronics. The work offers an explanation of moisture formation inside hermetic packages by showing that the problem arises from the electroless plating of Ni which is found to be inherently rich in H. The effects of the Ni plating process, baking, and Au thickness on the moisture and hydrogen content of hermetic packages were thoroughly explored. It was observed that baking the package components before sealing alleviates the problem of moisture formation inside the package but it doesn't fully eliminate it. It was only after changing the Ni plating process from electroless to electrolytic that the moisture problem actually disappeared. Our investigation showed that moisture formation inside hermetic packages is due to H evolution from the electroless Ni which eventually reacts with surface oxides to form H2O. SIMS analysis of electroless and electrolytic Ni showed that electroless Ni is around ten folds richer in H compared to its electrolytic counterpart. SIMS analysis also showed that H content in electroless Ni can be significantly reduced with heat treatment.

Moisture and Hydrogen Release in Optoelectronic Hermetic Packages

2014 ◽  
Vol 11 (2) ◽  
pp. 75-79 ◽  
Author(s):  
M. Albarghouti ◽  
N. El Dahdah ◽  
G. Perosevic ◽  
S. Jain ◽  
J.-M. Papillon ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Moisture Content ◽  
Hydrogen Content ◽  
Electroless Plating ◽  
Hydrogen Release ◽  
Surface Oxides ◽  
Sims Analysis ◽  
Electroless Ni

In this work the effect of nickel (Ni) plating process on the hydrogen (H) and moisture content of hermetic packages such as those used in optoelectronics was investigated. The work offers an explanation of moisture formation inside hermetic packages by showing that the problem arises from the electroless plating of Ni, which is found to be inherently rich in H. The effects of the Ni plating process, baking, and Au thickness on the moisture and hydrogen content of hermetic packages were thoroughly explored. It was observed that baking the package components before sealing alleviates the problem of moisture formation inside the package but does not fully eliminate it. It was only after changing the Ni plating process from electroless to electrolytic that the moisture problem actually disappeared. This investigation showed that moisture formation inside hermetic packages is due to H evolution from the electroless Ni which eventually reacts with surface oxides to form H2O. SIMS analysis of electroless and electrolytic Ni showed that electroless Ni is around 10-fold richer in H compared with its electrolytic counterpart. SIMS analysis also showed that H content in electroless Ni can be significantly reduced with heat treatment.

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