Comparison of Material Removal Characteristics in Single and Multiple Cutting Edge Scratches

2013 ◽  
Vol 797 ◽  
pp. 189-195 ◽  
Author(s):  
Xun Chen ◽  
Tahsin Tecelli Öpöz
Keyword(s):  
Cutting Force ◽  
Specific Energy ◽  
Material Removal ◽  
Experimental Results ◽  
Multiple Edge ◽  
Test Material ◽  
Grinding Process ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Single Edge

This paper presents the important characteristics of material removal mechanism during single grit scratching test. Material removal mechanism in these scratches shows cutting and ploughing action varies with the number of cutting edges leading to different cutting force and specific energy. According to experimental results, single edge scratches are more efficient cutting while multiple edge scratches give more ploughing actions, which consume energy with little contribution to materials removal. The results provided an important insight of material removal during grinding process.

Surface Behaviors of ELID Ground Engineering Ceramics

2007 ◽  
Vol 336-338 ◽  
pp. 1469-1472 ◽  
Author(s):  
Jian Yun Shen ◽  
Wei Min Lin ◽  
Hitoshi Ohmori ◽  
Xi Peng Xu
Keyword(s):  
Mechanical Properties ◽  
Material Properties ◽  
Material Removal ◽  
Grinding Process ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Silicon Nitride Ceramic ◽  
Engineering Ceramics ◽  
Elid Grinding ◽  
Engineering Ceramic

In this study, grinding of Si3N4, SiC, and Al2O3 ceramics under the condition of electrolytic in-process dressing (ELID) system was investigated. The surface appearances of these engineering ceramics during the ELID grinding process were attentively observed to describe the formation of finely finished surfaces. Based on the analysis of material properties and detailed micro-observation of ground surfaces, it can be concluded that the material removal mechanism of engineering ceramic is closely related to its mechanical properties. The silicon nitride ceramic was most easily machined to precision surface among these three engineering ceramics.

scholarly journals Analytical and Experimental Investigation on Cutting Force in Longitudinal-Torsional Coupled Rotary Ultrasonic Machining Zirconia Ceramics

2021 ◽  
Author(s):  
Fan Chen ◽  
Wenbo Bie ◽  
Yingli Chang ◽  
Bo Zhao ◽  
Xiaobo Wang ◽  
...  
Keyword(s):  
Cutting Force ◽  
Material Removal ◽  
Processing Parameters ◽  
Force Model ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Zirconia Ceramics ◽  
The Impact

Abstract Ceramics and other hard-and-brittle materials are very effectively processed by longitudinal-torsional coupled rotary ultrasonic machining (LTC-RUM). However, the cutting force evolution and the effects of processing parameters on the material removal mechanism in LTC-RUM need to be clarified for machining optimization. This paper proposes a cutting force model of the LTC-RUM of zirconia ceramics via the brittle material removal mechanism. Firstly, the kinematic analysis of a single abrasive grain was performed, with further consideration of the material removal volume, the effective contact time, and the impact force per one ultrasonic vibration cycle. Then, the longitudinal-torsional coupled vibration of the core tool was analyzed from the standpoint of wave energy conversion. The analytical model was finalized and experimentally verified by LTC-RUM tests. The cutting force curves predicted via the proposed model were in good agreement with the experimental results. The results obtained are considered instrumental in predicting the effects of processing parameters on cutting force during LTC-RUM of ceramics and their further optimization.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

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