NMOS Low Boron Activation in Pre-Amorphise Silicon

2014 ◽  
Vol 875-877 ◽  
pp. 734-738
Author(s):  
Muzalifah Mohd Said ◽  
Zul Atfyi Fauzan ◽  
Nur Fatihah Azmi

The high demand of smaller and compact size of MOSFETs has leads to desirable for ultra shallow junction formation with low sheet resistance and good electrical performances. These two characteristics are required to suppress short channel effects and to increase the efficiency of device. In this paper, Pre-amorphise implantation (PAI) PMOS with different doses of Boron and the basic PMOS structure are done by using ATHENA and the performance of devices is compared by using ATLAS software package from Silvaco TCAD. Comparison done in electrical characteristic, I-V curve Ion and Ioff has showed PMOS with PAI technology with low boron doses resulted in increasing electrical performance characteristic.

In this paper we have presented the non-uniformly doped bulk Junctionless transistor (JLT) and investigated bulk-JLT and SOI-JLT with non-uniform doping in terms of its electrical performance parameters and short channel effects (SCEs) parameters comparatively. Effective thickness of channel depends on non-uniform doping distribution parameters and this affects the performance of bulk-JLT notably, however it is not so in case of SOI-JLT. The effect of non-uniform doping on electrical characteristics of JLTs (bulk and SOI) in terms of Subthreshold Slope (SS), ON-current, OFF-Current and ON/OFF current ratio has been investigated, and the non-uniformly doped bulk-JLT exhibits high ON/OFF ratio (109 for 20 nm Gate Length). Moreover, the non-uniformly doped bulk-JLT also shows improved short-channel effects (SCEs) parameters (such as Drain Induced Barrier Lowering, Threshold Voltage variations etc.) compared to SOI-JLT. Lastly, the effect of standard deviation, dielectric constant, substrate doping, and well biasing on the device performance are examined to further improve the performance of bulk-JLT independently.


1993 ◽  
Vol 3 (9) ◽  
pp. 1719-1728
Author(s):  
P. Dollfus ◽  
P. Hesto ◽  
S. Galdin ◽  
C. Brisset

2007 ◽  
Vol 54 (8) ◽  
pp. 1943-1952 ◽  
Author(s):  
A. Tsormpatzoglou ◽  
C.A. Dimitriadis ◽  
R. Clerc ◽  
Q. Rafhay ◽  
G. Pananakakis ◽  
...  

1989 ◽  
Vol 36 (3) ◽  
pp. 522-528 ◽  
Author(s):  
S. Veeraraghavan ◽  
J.G. Fossum

MOSFET have been scaled down over the past few years in order to give rise to high circuit density and increase the speed of circuit. But scaling of MOSFET leads to issues such as poor control gate over the current which depends on gate voltage. Many short channel effects (SCE) influence the circuit performance and leads to the indeterminist response of drain current. These effects can be decreased by gate excitation or by using multiple gates and by offering better control gate the device parameters. In Single gate MOSFET, gate electric field decreases but multigate MOSFET or FinFET provides better control over drain current. In this paper, different FET structures such as MOSFET, TFET and FINFET are designed at 22nm channel length and effect of doping had been evaluated and studied. To evaluate the performance donor concentration is kept constant and acceptor concentration is varied.


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