The Nature of Intermetallic Compounds and its Effect on Mechanical Properties of Cu/Al/Cu Clad Metals

2014 ◽  
Vol 951 ◽  
pp. 87-91 ◽  
Author(s):  
Won Nyeon Kim ◽  
Sun Ig Hong
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Intermetallic Compounds ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Drastic Decrease ◽  
Interfacial Cracks ◽  
Clad Metals ◽  
Reaction Compound ◽  
Intermetallic Layers

The mechanical properties and microstructure of layered Cu/Al/Cu composites was investigated after annealing at various temperatures. The nature of intermetallic compounds in roll-bonded Cu/Al/Cu clad metals after heat treatment was investigated using SEM, XRD and EBSD.in the temperature range 200~500oC. In the roll-bonded 3-ply Cu/Al/Cu clad metal, no visible interfacial reaction compound and defects were observed at the interfaces. The reaction layer was observed grow rapidly at the Cu/Al interface after annealing at and above 400oC, which deteriorated the ductility of clad metals. Intermetallic reaction layers of Cu/Al/Cu clad materials annealed at 500oC for 3, 5, 10hours was found to consist of three layers, CuAl2, CuAl and Cu9Al4. EBSD analyses revealed that intermetallic layers are polycrystalline. The drastic decrease of stress and elongation in Cu/Al/Cu clad composite annealed at 500oC can be linked to the interfacial cracks between Al and Cu layer.

Mechanical Performance and Fracture of 3-Ply Cu/Al/Cu Clad Metals

2012 ◽  
Vol 557-559 ◽  
pp. 23-27 ◽  
Author(s):  
In Kyu Kim ◽  
Jong Su Ha ◽  
Sun Ig Hong
Keyword(s):  
Heat Treatment ◽  
Reaction Layer ◽  
Mechanical Performance ◽  
Heat Treating ◽  
Compound Layer ◽  
Treatment Temperature ◽  
Tensile Direction ◽  
Heat Treated ◽  
Clad Metals ◽  
Reaction Compound

The mechanical performance and fracture of roll-bonded Cu/Al/Cu clad metal were investigated after heat treatment in the temperature range 200~500OC. In the roll-bonded 3-ply Cu/Al/Cu clad metal, no visible interfacial reaction compound and defects were observed at the interfaces, ensuring the well-bonded Cu/Al interface until the final moment of fracture in tension. The reaction layer was observed at the Cu/Al interface after annealing at and above 400OC, which deteriorated the ductility of clad metals. The thickness of the reaction layer increased with increasing heat treatment temperature. The periodic cracks were formed perpendicular to the tensile direction due to the strain mismatch between metal layers and the reaction compound layer in the clad heat treated at high temperatures at 500oC. The slip localization and delamination induced premature crack formation in Cu and Al layer, resulting in the decreased clad metal fracture strain, especially after heat treating at 500oC.

Effects of Thickness Ratio on Interface Characteristic and Mechanical Properties of Ti/C Laminated Composites

2011 ◽  
Vol 418-420 ◽  
pp. 1498-1501
Author(s):  
Wen Yuan Long ◽  
Pei Pei Li
Keyword(s):  
Mechanical Properties ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Bending Strength ◽  
Laminated Composite ◽  
Thickness Ratio ◽  
Plasma Sintering ◽  
Interface Characteristics ◽  
Spark Plasma ◽  
Laminated Composite Material

The Ti/TiC/C laminated composite material was fabricated with the sheet of Ti and C by spark plasma sintering (SPS) technology. The effects of thickness ratio on the interface characteristics and mechanical properties of interfacial reaction were studied. The results show that: the reaction layer thickness increases with the thickness ratio. When the thickness ratio was 3:1, the degree of interfacial reaction was better in the case of other conditions are the same. The thickness of reaction layer achieved 33.58μm. The laminated composite bending strength and fracture power reached the maximum 3494.52MPa and 614.89×103J/m2, respectively. The greater fracture power, the more energy absorbed in the process of damage, the higher toughness improved.

Effects of heat treatment on the intermetallic compounds and mechanical properties of the stainless steel 321–aluminum 1230 explosive-welding interface

2017 ◽  
Vol 24 (11) ◽  
pp. 1267-1277 ◽  
Author(s):  
Mohammadreza Khanzadeh Gharah Shiran ◽  
Gholamreza Khalaj ◽  
Hesam Pouraliakbar ◽  
Mohammadreza Jandaghi ◽  
Hamid Bakhtiari ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Stainless Steel ◽  
Intermetallic Compounds ◽  
Explosive Welding ◽  
Welding Interface

Mechanical and Microstructural Analyses of Three Layered Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn Clad Material Processed by High Pressure Torsioning (HPT)

2012 ◽  
Vol 557-559 ◽  
pp. 1161-1165
Author(s):  
Ki Hwan Oh ◽  
Hob Yung Kim ◽  
Sun Ig Hong
Keyword(s):  
Heat Treatment ◽  
High Pressure ◽  
Intermetallic Compounds ◽  
Interfacial Reaction ◽  
Room Temperature ◽  
Mechanical Reliability ◽  
Final Fracture ◽  
Heat Treated

Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn three layered clad plates were prepared by high pressure torsioning (HPT) at room temperature and theirmicrostructural and mechanical analyses wereperformed. No intermetallic compounds were observed at Cu-Zr/Cu-Ni-Zn interfaces in the as-HPTed and heat-treated Cu/Ni-Zn/Cu-Zr/Cu-Ni-Zn clad plates. The strength of as-HPTed clad plate reached up to 610 MPa with the ductility of 14%. After heat treatment at 500oC, Cu-Ni-Zn/Cu-Zr/Cu-Ni-Zn clad plate exhibited the strength up to 490 MPa and the ductility of 28 %. The clad plate fractured all together at the same time without discontinuous drop of the stress until final fracture. The excellent mechanical reliability and the good interfacialbonding strength can be attributed to the absence of detrimental interfacial reaction compounds between Cu-Ni-Zn and Cu-Zr.

Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition

2011 ◽  
Vol 462-463 ◽  
pp. 247-252 ◽  
Author(s):  
Hirohiko Watanabe ◽  
Masayoshi Shimoda ◽  
Noboru Hidaka ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Heat Exposure ◽  
Ni Addition ◽  
Exposure Conditions

Sn-Ag-Cu-Ni-Ge solder alloy has been developed to improve the mechanical properties of the Sn-Ag-Cu base solders and prevent oxidation of those solders. In this paper, an interfacial reaction and microstructure between the solder and a Cu electrode were investigated under heat exposure conditions. It was found that intermetallic compounds growth at the interface of the solder and the Cu electrode was greatly affected by amounts of added elements. Adding Ni in the solder can suppress the formation and growth of intermetallic compounds (IMCs) such as Cu-Sn and decreasing the amount of adding Ag in the solder can prevent the formation and growth of Ag3Sn. Moreover, it was found that there was an effect of suppress the growth of the Cu3Sn formed on the interface of Cu and (Cu,Ni)6Sn5 by adding Ni from analysis results of EDX and TEM.

Effect of Heat Treatment on the Mechanical Properties and Interface Structure of 3-ply Ti/Cu/Ti Clad Composite

2015 ◽  
Vol 1102 ◽  
pp. 51-54 ◽  
Author(s):  
Yong Keun Kim ◽  
Pyung Woo Shin ◽  
Sun Ig Hong
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Gradual Increase ◽  
Intermetallic Layer ◽  
Interface Structure ◽  
Treatment Temperature ◽  
Compound Formation ◽  
Indentation Mark ◽  
Intermetallic Compound Formation ◽  
Intermetallic Layers

The effect of heat treatment on the mechanical properties and interface structure of 3-ply Ti/Cu/Ti clad composite was investigated. Strength decreased and the ductility increased with increase of heat treatment temperature. The gradual increase of hardness at 700°C and 800°C indicates the growth of intermetallic compounds at the interface. No visible intermetallic compound formation was observed up to 400°C. The intermetallic layer grew very rapidly above 600°C and its thickness reached ~10μm after heat treatment at 800°C. The absence of cracks emanating from the corners of the indentation mark indicates that intermetallics in Ti/Cu/Ti clad are ductile enough to accommodate the micro-plastic flow from indentation. Four intermetallic layers at the interface were confirmed to be Cu4Ti, Cu3Ti2, CuTi and CuTi2 based on the EDS spectra, XRD and phase diagram analyses.

scholarly journals Effects of Heat Treatment on the Microstructure and Hardness of A356 (AlSi7Mg0.3) Manufactured by Vertical Centrifugal Casting

2021 ◽  
Vol 11 (23) ◽  
pp. 11572
Author(s):  
Wonho Kim ◽  
Kyungsu Jang ◽  
Changwook Ji ◽  
Eunkyung Lee
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Solid Solution ◽  
Intermetallic Compounds ◽  
Centrifugal Casting ◽  
A356 Alloy ◽  
Brake Disk ◽  
Centrifugally Cast ◽  
Average Hardness ◽  
Heat Treated

The A356 alloy has been widely used in automotive components, such as wheels and brake disks, because it is an excellent lightweight material with high corrosion resistance and good mechanical properties. Recently, to reduce the weight of brake disks, the Fe-A356 hybrid brake disk has been suggested. Because brake disk quality is directly related to driving safety, the T4/T6 heat treatment of centrifugally cast A356 alloys were performed to enhance the mechanical properties and reduce micro-segregation. The solid-solution heat treatment followed by annealing caused the formation of Mg-rich intermetallic compounds on the grain boundaries of the Al matrix, decreasing the average hardness of the alloys by 13 HV. In contrast, the solid solution followed by water quenching (T4) reduced the area fractions of the intermetallic compounds and increased the average hardness by 11 HV. The T6 heat-treated A356 alloys, which were influenced by the formation of the Guinier–Preston zone exhibited a relatively higher average hardness, by 18 HV, compared to T4 heat-treated A356 alloys.

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