Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition

2011 ◽  
Vol 462-463 ◽  
pp. 247-252 ◽  
Author(s):  
Hirohiko Watanabe ◽  
Masayoshi Shimoda ◽  
Noboru Hidaka ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Heat Exposure ◽  
Ni Addition ◽  
Exposure Conditions

Sn-Ag-Cu-Ni-Ge solder alloy has been developed to improve the mechanical properties of the Sn-Ag-Cu base solders and prevent oxidation of those solders. In this paper, an interfacial reaction and microstructure between the solder and a Cu electrode were investigated under heat exposure conditions. It was found that intermetallic compounds growth at the interface of the solder and the Cu electrode was greatly affected by amounts of added elements. Adding Ni in the solder can suppress the formation and growth of intermetallic compounds (IMCs) such as Cu-Sn and decreasing the amount of adding Ag in the solder can prevent the formation and growth of Ag3Sn. Moreover, it was found that there was an effect of suppress the growth of the Cu3Sn formed on the interface of Cu and (Cu,Ni)6Sn5 by adding Ni from analysis results of EDX and TEM.

Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging

2016 ◽  
Vol 667 ◽  
pp. 368-375 ◽  
Author(s):  
Lizhuang Yang ◽  
Wei Zhou ◽  
Yong Ma ◽  
Xuezheng Li ◽  
Yinghua Liang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solid State ◽  
Solder Alloy ◽  
Ni Addition

The Nature of Intermetallic Compounds and its Effect on Mechanical Properties of Cu/Al/Cu Clad Metals

2014 ◽  
Vol 951 ◽  
pp. 87-91 ◽  
Author(s):  
Won Nyeon Kim ◽  
Sun Ig Hong
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Intermetallic Compounds ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Drastic Decrease ◽  
Interfacial Cracks ◽  
Clad Metals ◽  
Reaction Compound ◽  
Intermetallic Layers

The mechanical properties and microstructure of layered Cu/Al/Cu composites was investigated after annealing at various temperatures. The nature of intermetallic compounds in roll-bonded Cu/Al/Cu clad metals after heat treatment was investigated using SEM, XRD and EBSD.in the temperature range 200~500oC. In the roll-bonded 3-ply Cu/Al/Cu clad metal, no visible interfacial reaction compound and defects were observed at the interfaces. The reaction layer was observed grow rapidly at the Cu/Al interface after annealing at and above 400oC, which deteriorated the ductility of clad metals. Intermetallic reaction layers of Cu/Al/Cu clad materials annealed at 500oC for 3, 5, 10hours was found to consist of three layers, CuAl2, CuAl and Cu9Al4. EBSD analyses revealed that intermetallic layers are polycrystalline. The drastic decrease of stress and elongation in Cu/Al/Cu clad composite annealed at 500oC can be linked to the interfacial cracks between Al and Cu layer.

Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

2018 ◽  
Vol 928 ◽  
pp. 188-193
Author(s):  
Suchart Chantaramanee ◽  
Worawit Sriwittayakul ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Rich Phase ◽  
Pasty Range ◽  
Free Solder

The effects of antimony and indium addition on wettability and interfacial reaction of Sn-3.0Ag-0.5Cu lead free solder on copper substrate were investigated. The experimental results showed the melting point of solder alloy containing 0.5 wt.% In and 0.5 wt.% Sb were slightly increased about 3.66°C. The pasty range of solder alloys were increased about 6°C while the undercooling of solder alloys were decreased. The microstructures of solder alloy were contained of In and Sb consists of Ag3Sn, Cu6(Sn,In)5, SnIn, Ag3(Sn,In) and SnSb intermetallic compounds (IMCs) dispersed on Sn-rich phase. The wettability of solder alloys were improved by increasing soldering times. In addition, the thickness of intermetallic compounds (Cu6Sn5) were obviously increased with increasing soldering times.

scholarly journals Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1077
Author(s):  
Umair Ali ◽  
Hamza Khan ◽  
Muhammad Aamir ◽  
Khaled Giasin ◽  
Numan Habib ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Thermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Lead Free Solder Alloy ◽  
Free Solder

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

2005 ◽  
Vol 502 ◽  
pp. 411-416
Author(s):  
Keisuke Uenishi ◽  
Kojiro F. Kobayashi
Keyword(s):  
Intermetallic Compounds ◽  
Melting Temperature ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Joint Strength ◽  
Heat Exposure ◽  
Compound Layer ◽  
Intermetallic Phases ◽  
Ni Alloy ◽  
Ni3p Layer

The microstructure and strength for the micro joints of Pb free Sn-Ag based solders with Au/Ni alloy platings were investigated. For the joint using Sn-Ag solder, Ni3Sn4 reaction layer formed at the solder/pad interface and also P-rich layer formed in Ni-P plating. The P-rich layer was confirmed to be composed of Ni-P-Sn ternary compound layer and crystallized Ni3P layer. Both of them introduced defects, which degraded the joint strength. Addition of Cu to Sn-Ag solders suppressed the formation of such a P rich layer while the (Cu, Ni)6Sn5 reaction layer was formed at the solder/pad interface. These different interfacial reactions would affect the changes in the joint strength during heat exposure at 423K. On the contrary, addition of Co to Ni platings enhanced the interfacial reaction and the Sn-Ag solder completely transformed to the intermetallic compounds under higher melting temperature even by heating to 543K. The addition of Co in Ni could change the interfacial reaction layer from Ni3Sn4 to (Ni, Co)Sn2 with higher diffusivity of Ni which enhanced formation of intermetallic phases. The control of interfacial reaction by the alloying elements is important to obtain ideal micro joints.

scholarly journals The Extrusion and SPS of Zirconium–Copper Powders and Studies of Selected Mechanical Properties

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3560
Author(s):  
Tomasz Skrzekut ◽  
Grzegorz Boczkal ◽  
Adam Zwoliński ◽  
Piotr Noga ◽  
Lucyna Jaworska ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Room Temperature ◽  
Intermetallic Phase ◽  
Extrusion Process ◽  
Strength Properties ◽  
Plasma Sintering ◽  
Copper Powders ◽  
Spark Plasma ◽  
Zirconium Copper

Zr-2.5Cu and Zr-10Cu powder mixtures were consolidated in the extrusion process and using the spark plasma sintering technique. In these studies, material tests were carried out in the fields of phase composition, microstructure, hardness and tensile strength for Zr-Cu materials at room temperature (RT) and 400 °C. Fractography analysis of materials at room temperature and 400 °C was carried out. The research took into account the anisotropy of the materials obtained in the extrusion process. For the nonequilibrium SPS process, ZrCu2 and Cu10Zr7 intermetallic compounds formed in the material at sintering temperature. Extruded materials were composed mainly of α-Zr and ZrCu2. The presence of intermetallic compounds affected the reduction in the strength properties of the tested materials. The highest strength value of 205 MPa was obtained for the extruded Zr-2.5Cu, for which the samples were cut in the direction of extrusion. For materials with 10 wt.% copper, more participation of the intermetallic phase was formed, which lowered the mechanical properties of the obtained materials. In addition to brittle intermetallic phases, the materials were characterized by residual porosity, which also reduced the strength properties.

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