The Performance and Optimization of Slurry on the Double Sided Polishing Process of Silicon Wafer

2007 ◽  
Vol 359-360 ◽  
pp. 324-328
Author(s):  
Wei Li ◽  
Gang Xiang Hu ◽  
Xiao Dong Hu ◽  
Xiao Zhen Hu
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Process Parameters ◽  
Ph Value ◽  
Removal Rate ◽  
Polished Surface ◽  
Polishing Process ◽  
Stock Removal

This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished surface roughness and stock removal rate, discusses the mechanism of Double Sided Polishing for silicon wafer with different type slurries, also the influence of the pH value, temperature and concentration of the slurries are discussed in this paper. Furthermore, by the optimization of the process parameters, the ultra-smooth of polished surface of silicon wafer has been got with higher efficient.

Fundamental Studies on the Mechanisms of Oxide CMP

2000 ◽  
Vol 613 ◽  
Author(s):  
Uday Mahajan ◽  
Seung-Mahn Lee ◽  
Rajiv K. Singh
Keyword(s):  
Surface Roughness ◽  
Particle Size ◽  
Wear Rate ◽  
Removal Rate ◽  
Polished Surface ◽  
Electrostatic Repulsion ◽  
Polishing Process ◽  
Negative Surface ◽  
Negative Surface Charge ◽  
Slurry Stability

ABSTRACTIn this paper, results of studies on the addition of salt to a polishing slurry, in terms of its effect on slurry stability, SiO2 polishing rate and surface roughness of the polished surface are presented. Three salts, viz. LiCl, NaCl and KCl were selected, and three concentrations were tested. Polishing rate measurements using these slurries show that adding salt leads to increased removal rate without affecting surface roughness significantly. Based on these results, we can say that the agglomerates formed by adding salt to the slurry are fairly soft and easily broken during the polishing process. In addition, turbidity and particle size measurements show that significant coagulation of the particles in the slurry occurs only at the highest salt concentration, and is fastest for LiCl and NaCl, with KCl showing the slowest coagulation. From these results, it can be concluded that the enhancement in polish rate is due to increased contact at the wafer-pad-slurry interface, and not due to formation of larger agglomerated particles in the slurry. This is because of reduced electrostatic repulsion between these three surfaces, due to the screening of their negative surface charge by the metal ions in solution, resulting in a higher wear rate.

scholarly journals Study on Flexible Polishing Force and Polishing Temperature of Flap Disc

2021 ◽  
Author(s):  
De Liu ◽  
Xiaoming Pan ◽  
Zhiyang Gu ◽  
Hui Qiu
Keyword(s):  
Surface Quality ◽  
Process Parameters ◽  
Great Influence ◽  
Contact Length ◽  
Polished Surface ◽  
Polishing Process ◽  
Influence Of Process Parameters ◽  
Polishing Force ◽  
Working Principle ◽  
Cutting Model

Abstract Polishing determines the final surface quality of the aero engine, which have great influence on its working performance and working life. By analyzing the structure and working principle of the flexible self-adaptive polishing platform of the blisk, the abrasive cutting model of the flap disc is established. The theoretical calculation of the effect of elastic deformation during the polishing process on the contact length of flap disc and blisk. The model of polishing force, polishing heat and temperature field during the polishing process of the flap disc are established and analyzed. Single factor method is used to analyze the influence of process parameters on polishing force, polishing temperature, roughness and specific polishing energy. Finally, the polishing test shows that the optimized process parameters improve the polished surface quality and meet the requirements of the blade polishing process.

Mechanochemical Polishing of Single Crystal Diamond with Mixture of Oxidizing Agents

2006 ◽  
Vol 315-316 ◽  
pp. 852-855 ◽  
Author(s):  
Cheng Yong Wang ◽  
C. Chen ◽  
Yue Xian Song
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Smooth Surface ◽  
Removal Rate ◽  
Polishing Process ◽  
Iron Plate ◽  
Oxidizing Agents ◽  
Single Crystal Diamond ◽  
Lower Temperature ◽  
And Control

In order to achieve the smooth surface of diamond, several kinds of mixture oxidizing agents have been used to polish the single crystal diamond by a designed polishing apparatus. The existing of graphite and amorphous carbon has been found in the surface of diamond after polishing. The mechanochemical actions of oxidizing agents and the polishing iron plate have been proved. The mixture of oxidizing agents can decrease the polishing temperature so that the super-smooth surface of single crystal diamond can be achieved at lower temperature. The method provided is benefit not only to simplify polishing device and control the polishing process, but also to improve the removal rate and surface roughness.

Study on Dual-Plane Ball Polishing Method for Finishing Ceramics Ball

2013 ◽  
Vol 797 ◽  
pp. 444-449 ◽  
Author(s):  
Kai Ping Feng ◽  
Zhao Zhong Zhou ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Mechanical Damage ◽  
Lower Plate ◽  
Mathematics Model ◽  
Polishing Process ◽  
High Quality ◽  
Dual Plane ◽  
Surface Polishing ◽  
Polishing Machine

This paper represents a dual-plane polishing method for ceramics ball. Compared with traditional ball polishing method, its upper and lower plate are all flat and easy to use soft pad to polish, so it can largely reduce the surface mechanical damage and obtain high quality processing surface. This paper analyzes surface polishing trajectory by calculation and simulation to test the polishing trajectory uniformity. A mathematics model of polishing process is established to disintegrate the process of a balls movement. Experiment is operated in dual-plane planetary polishing machine. The result shows that perfect polishing surface and spherical error can be obtained under the proper process parameters, the surface roughness achieves 4nm and the spherical error can reach 0.217μm.

Research on Ultra-Precision Machining Technology for KTP

2004 ◽  
Vol 471-472 ◽  
pp. 473-476 ◽  
Author(s):  
Ju Long Yuan ◽  
Fei Yan Lou ◽  
Zhi Wei Wang ◽  
M. Chang ◽  
W.P. Du ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Frequency Conversion ◽  
Removal Rate ◽  
Nonlinear Coefficient ◽  
Damage Threshold ◽  
Green Laser ◽  
Machining Process ◽  
Polished Surface ◽  
Nonlinear Frequency ◽  
Ultra Precision

Potassium Titanium Oxide Phosphate (KTP) is a new nonlinear frequency-conversion crystal. It has chemical stability, high nonlinear coefficient, high damage threshold, easily-polished surface, and a broad transparency range. It is be used in solid green laser with medium and low power widely. The requirement for surface roughness is less than 1nm.In this paper, the removal rate and surface roughness are discussed with different velocity, pressure and size of abrasive powder. In order to satisfy the requirement, new polishing techniques with ultra-precision plane polishing machine (Nanopoli-100), and fine AL2O3, SiO2 powders are proposed in this study. The final surface roughness of the KTP is less than 1nm.The machining process and characteristics are also indicated.

Optimization of Process Parameters in Plasma Arc Cutting Applying Genetic Algorithm and Fuzzy Logic

2018 ◽  
pp. 123-139
Author(s):  
Nehal Dash ◽  
Apurba Kumar Roy ◽  
Sanghamitra Debta ◽  
Kaushik Kumar
Keyword(s):  
Genetic Algorithm ◽  
Surface Roughness ◽  
Fuzzy Logic ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Plasma Arc ◽  
Plasma Arc Cutting ◽  
Optimization Of Process Parameters

Plasma Arc Cutting (PAC) process is a widely used machining process in several fabrication, construction and repair work applications. Considering gas pressure, arc current and torch height as the inputs and among all possible outputs, in the present work Material Removal Rate and Surface Roughness would be considered as factors that determines the quality, machining time and machining cost. In order to reduce the number of experiments Design of Experiments (DOE) would be carried out. In later stages applications of Genetic Algorithm (GA) and Fuzzy Logic would be used for Optimization of process parameters in Plasma Arc Cutting (PAC). The output obtained would be minimized and maximized for Surface Roughness and Material Removal Rate respectively using Genetic Algorithm (GA) and Fuzzy Logic.

scholarly journals Optimization of Boring Process Parameters in Manufacturing of Polyacetal Bushing using High Speed Steel

2019 ◽  
Vol 130 ◽  
pp. 01031 ◽  
Author(s):  
The Jaya Suteja ◽  
Yon Haryono ◽  
Andri Harianto ◽  
Esti Rinawiyanti
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Feed Rate ◽  
High Speed ◽  
Removal Rate ◽  
High Speed Steel ◽  
Cutting Edge ◽  
Depth Of Cut ◽  
Optimum Result ◽  
Edge Angle

Polyacetal is commonly used as bushing material because of its low coefficient of friction and self lubricant characteristics. The polyacetal is machined by using boring process to produce bushing in certain surface roughness. The objectives of this research are to optimize three independent parameters (depth of cut, feed rate and principal cutting edge angle) of boring process of polyacetal using high speed steel tool to achieve the highest material removal rate and the required surface roughness. Response Surface Methodology is used to investigate the influence of the parameters and optimize the boring process. The research shows that the influence of the boring process parameters on polyacetal is similar compared to on metal. The result reveals that the optimum result is achieved by applying the value of depth of cut, feed rate, and principal cutting edge angle is 2.9 × 10–3 m, 0.229 mm rev–1, and 99.1° respectively. By applying these values, the maximum material rate removal achieved in this research is 1263.4 mm3 s–1 and the surface roughness achieved is 1.57 × 10–6 m.

Multi Response Optimization of Process Parameters of Abrasive Water Jet Machining for Stainless Steel AISI 304 Using VIKOR Approach Coupled with Signal to Noise Ratio Methodology

2015 ◽  
Vol 14 (02) ◽  
pp. 107-121 ◽  
Author(s):  
Vedansh Chaturvedi ◽  
Diksha Singh
Keyword(s):  
Surface Roughness ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Aisi 304 ◽  
Steel Aisi ◽  
Machining Characteristics ◽  
Stainless Steel Aisi ◽  
Experimental Runs

As the population of the world is continuously increasing, demand of the mechanical manufactured products is also increasing. Machining is the most important process in any mechanical manufacturing, and in machining two factors, i.e. material removal rate (MRR) and surface roughness (SR) are the most important responses. If the MRR is high, the product will get desired shape in minimum time so the production rate will be high, but we could not scarify with the surface finishing also because in close tolerance limit parts like in automobile industry, if the surface is rough exact fit cannot take place. The term optimization is intensively related to the field of quality engineering. Abrasive water jet machining is an important unconventional machining, in order to obtain better response, i.e. material removal rate and surface roughness. Various process parameters of AWJM need to be observed and selected to improve machining characteristics. Better machining characteristics can be achieved by optimizing various process parameters of AWJM. This study considers four process control parameters such as transverse speed, standoff distance, abrasive flow rate and water pressure. The response is taken to be material removal rate and surface roughness. The work piece for stainless steel AISI 304 material of size 15 cm × 10 cm × 2 cm is selected for experiments. Sixteen experimental runs (two trials for each experimental runs) were carried out for calculating MRR and SR and average value of these two trials have been taken for analysis. MRR is normalized according to higher-is-better and SR is normalized according to lower is better. The experiment data analysis is done and VIKOR index is found. Finally, the analysis of VIKOR index using S/N ratio is done and found the most significant factor for AWJM and predicted optimal parameters setting for higher material removal rate and lower surface roughness. Verification of the improvement in quality characteristics has been made through confirmation test with the predicted optimal parameters setting. It is found that the determined optimum combination of AWJM parameters gives the lowest VIKOR INDEX which shows the successful implementation of VIKOR Method coupled with S/N ratio in AWJM.

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