Development of Resin Bonded Diamond Wire Saw and Slicing Experiments

2009 ◽  
Vol 416 ◽  
pp. 321-326 ◽  
Author(s):  
Pei Qi Ge ◽  
Zhi Jian Hou ◽  
Shao Jie Li
Keyword(s):  
Epoxy Resin ◽  
Phenolic Resin ◽  
Orthogonal Experiment ◽  
Silicon Crystal ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Mixed Material ◽  
Diamond Grain ◽  
Peeling Off

Because its advantages of lower manufacture cost and higher slicing quality, the resin bonded diamond wire saw is supposed to be used widely in the future for slicing hard-brittle materials such as silicon crystal. In this paper, based on the research of the resin bonded diamond wire saw manufacturing technology and slicing process, we select Φ0.2mm SWPB piano string as core wire, 20-30m (800#) diamond grain as abrasive, liquid phenolic resin mixed with epoxy resin as adhesive, the nanometer powders as additive to improve the adhesive holding strength of abrasive grains and heat resistance. By orthogonal experiment, we find the resin bonded diamond wire saw has optimizing performance as the additives is 10% in adhesive, the epoxy resin is 30% in resin, the diamond is 50% in whole mixed material. Slicing experiments proves that the resin bonded diamond wire saw manufactured in this study has better slicing performance. The failure forms of the resin bonded diamond wire saw are wear out of resin adhesive, falling off of diamond grains and the partial peeling off of the resin bond.

Study on the Wear Topography of Diamond Endless Wire Saw when Cutting Granite

2011 ◽  
Vol 487 ◽  
pp. 361-365 ◽  
Author(s):  
Wei Gao ◽  
J.T. Zhang ◽  
J.Y. Duan
Keyword(s):  
Diamond Particle ◽  
Cutting Speed ◽  
The Self ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Wear Topography ◽  
Feeding Pressure ◽  
Diamond Grain ◽  
Scanning Electron

In this paper, the fall off and wear of electroplated endless diamond wire saws were studied when cutting granite. The self-made electroplating diamond wire saw was adapted in the experiment. Diamond particle size used was 200-230 US mesh. A kind of granite named Shi Daohong 375-2 with 18mm thickness was sawed. The test piece was sawed with constant cutting speed and feeding pressure. The topographies of wear, breakage and fall off of diamond grains were observed by using scanning electron microscopy. It was showed by the research that the damage of diamond grains appeared three forms including polishing wear and partial breakage and whole breakage. The fall off of diamond grain could be divided into two kinds of partial fall off and whole fall off during the cutting process. At the beginning cutting period, the wear of diamond grain mainly was polishing wear and partial breakage and with the extension of cutting time, the diamond grains would take place whole breakage and fall off.

Development of Endless Diamond Wire Saw and Sawing Experiments

2004 ◽  
Vol 471-472 ◽  
pp. 481-484 ◽  
Author(s):  
Pei Qi Ge ◽  
L. Zhang ◽  
W. Gao ◽  
Zhen Chang Liu
Keyword(s):  
Grain Size ◽  
Cutting Force ◽  
Cutting Efficiency ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Diamond Grain ◽  
Sawing Process

The endless diamond wire saw was developed using complex electroplating method. The sawing process on granite was experimented. The effects of diamond grain size, feed load, wire speed, and granite properties on sawing process were investigated. It is proved that the edges of sawing slot of granite were regulative and the cutting surfaces were smooth. The cutting efficiency could be improved by increasing the diamond grain size, wire speed, and feed load. However the increase of the feed load would induce higher tangential cutting force, and the case of the effect of wire speed was reversed.

Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture

2010 ◽  
Vol 135 ◽  
pp. 393-397
Author(s):  
Wen Bo Bi ◽  
Pei Qi Ge ◽  
S.Q. Song ◽  
Y.F. Gao ◽  
Z.S. Wang ◽  
...  
Keyword(s):  
Orthogonal Design ◽  
Silicon Crystal ◽  
Diamond Wire ◽  
Good Surface ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Resin Binder ◽  
Design Experiments ◽  
Piano Wire ◽  
Made In

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

Influence of diamond wire saw slicing parameters on (010) lattice plane beta-gallium oxide single crystal wafer

2021 ◽  
Vol 133 ◽  
pp. 105939
Author(s):  
Pengcheng Gao ◽  
Baimei Tan ◽  
Fan Yang ◽  
Hui Li ◽  
Na Bian ◽  
...  
Keyword(s):  
Single Crystal ◽  
Gallium Oxide ◽  
Lattice Plane ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Crystal Wafer

Al2O3 and CaO as sintering aids: A strategy to remove impurity boron and SiO2 surface-layer of diamond wire saw silicon waste

2021 ◽  
Vol 270 ◽  
pp. 118823
Author(s):  
Guangyu Chen ◽  
Yan Li ◽  
Wang Sheng ◽  
Liuqing Huang ◽  
Lizhi Tang ◽  
...  
Keyword(s):  
Surface Layer ◽  
Sintering Aids ◽  
Diamond Wire ◽  
Sio2 Surface ◽  
Wire Saw ◽  
Diamond Wire Saw

scholarly journals EFFECTS OF CONTROLLABLE AND UNCONTROLLABLE PARAMETERS ON DIAMOND WIRE CUTTING PERFORMANCE USING STATISTICAL ANALYSIS: A CASE STUDY

2021 ◽  
Vol 36 (4) ◽  
pp. 21-32
Author(s):  
Arezou Rasti ◽  
Hamid Ranjkesh Adarmanabadi ◽  
Mohammad Reza Sahlabadi
Keyword(s):  
Cost Estimation ◽  
Production Performance ◽  
Engineering Properties ◽  
Critical Parameters ◽  
Rock Engineering ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cutting Rate ◽  
Operational Aspects

Nowadays, most mining and quarrying industries utilize a diamond wire saw machine for bench cutting operations. This method uses a metal wire or cable assembled by diamond beads to cut the hard stone into large blocks. Many parameters classified into controllable and uncontrollable parameters affect the performance of the diamond wire saw cutting method. The uncontrollable parameters are related to rock engineering properties, and controllable parameters are related to operational aspects and machine performance. The diamond wire sawing process’s production rate is one of the most critical parameters influencing the design optimization and quarrying cost estimation. The cutting rate and wear rate of diamond beads are the most important factors to evaluate quarries’ production performance. This study aims to determine the effects of different controllable and uncontrollable parameters on different quarries’ production rates. Rock engineering properties like strength, hardness, and abrasivity, and operational aspects, such as cutting angle and drive wheel diameters, are considered as the main factors affecting the production performance of the diamond wire saw method. To discover the influence of these parameters, a detailed investigation in ten quarry operations was carried out. The relation between cutting rate and diamond bead wear with different parameters is estimated. It was observed that different controllable and uncontrollable parameters could increase or decrease the cutting rate and diamond bead wearing. Furthermore, using simple and multiple regression analysis, performance prediction of the cutting rate and wearing of diamond beads was developed, and the best equations were proposed.

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

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