The Influence of Indentation Conditions on Nanohardness Depth Profiles of W-C Based Coatings

2014 ◽  
Vol 606 ◽  
pp. 175-178 ◽  
Author(s):  
Michal Novák ◽  
František Lofaj ◽  
Petra Hviščová
Keyword(s):  
Thin Films ◽  
Strain Rate ◽  
Measurement Method ◽  
Loading Cycle ◽  
Depth Profiles ◽  
Stiffness Measurement ◽  
Continuous Stiffness Measurement ◽  
Rate Frequency ◽  
Loading Type

The influence of different indentation parameters including loading type, loading/strain rate, frequency and amplitude on nanohardness depth profiles on DC-MS W-C based coatings thick from 300 to 850 nm were investigated with the aim to determine the best conditions for the measurement of hardness of thin films during sinusoidal loading cycle. Nanohardness tests were performed on G200 (Agilent Technologies) and NHT (CSM Instruments) nanoindenters using standard loading/unloading cycle, CMC (continuous multicycle) mode and continuous stiffness measurement method (CSM) or sinus mode, respectively. The increase of strain rate and sinus amplitude results in decrease of maxima hardness of profiles while the increase of frequency caused its increase.

scholarly journals Relationship of Stiffness-Based Indentation Properties Using Continuous-Stiffness-Measurement Method

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 97 ◽  
Author(s):  
Wai Yeong Huen ◽  
Hyuk Lee ◽  
Vanissorn Vimonsatit ◽  
Priyan Mendis
Keyword(s):  
Elastic Modulus ◽  
Measurement Method ◽  
Computational Simulation ◽  
Accurate Solution ◽  
New Approach ◽  
Stiffness Measurement ◽  
Pile Up ◽  
Continuous Stiffness Measurement ◽  
Relationship Of

The determination of elastic modulus (E) and hardness (H) relies on the accuracy of the contact area under the indenter tip, but this parameter cannot be explicitly measured during the nanoindentation process. This work presents a new approach that can derive the elastic modulus (E) and contact depth (hc) based on measured experiment stiffness using the continuous-stiffness-measurement (CSM) method. To achieve this, an inverse algorithm is proposed by incorporating a set of stiffness-based relationship functions that are derived from combining the dimensional analysis approach and computational simulation. This proposed solution considers both the sink-in and pile-up contact profiles; therefore, it provides a more accurate solution when compared to a conventional method that only considers the sink-in contact profile. While the proposed solution is sensitive to Poisson’s ratio (ν) and the equivalent indentation conical angle (θ), it is not affected by material plasticity, including yield strength (σy) and work hardening (n) for the investigated range of 0.001 < σy/E < 0.5. The proposed stiffness-based approach can be used to consistently derive elastic modulus and hardness by using stiffness and the load-and-unload curve measured by the continuous-stiffness-measurement (CSM) method.

Hardness and Elastic Modulus Measurements of AIN and TiN Sub-Micron Thin Films Using the Continuous Stiffness Measurement Technique with Fem Analysis

1999 ◽  
Vol 594 ◽  
Author(s):  
T. A. Rawdanowicz ◽  
J. Sankar ◽  
J. Narayan ◽  
V. Godbole
Keyword(s):  
Thin Films ◽  
Elastic Modulus ◽  
Elastic Moduli ◽  
Pulsed Laser ◽  
Fem Analysis ◽  
X Ray Diffraction ◽  
X Ray ◽  
Stiffness Measurement ◽  
Tin Thin Films ◽  
Continuous Stiffness Measurement

AbstractThe hardnesses and elastic moduli of aluminum nitride (AIN) and titanium nitride (TiN) sub-micron thin films pulsed laser deposited (PLD) on silicon (111) were measured using nanoindentation based on a continuous stiffness measurement (CSM) technique. Thin film thicknesses, based on profile measurements of simultaneously grown step samples, are 210 nm and 180 nm with surface roughnesses of 12 nm and 2 nm for AlN and TiN, respectively. X-ray diffraction showed AlN as a highly textured polycrystalline AlN wurzite structure with a (0001) orientation and TiN as a cubic structure with a (111) orientation. The CSM technique provided hardness and elastic modulus as a function of depth. Finite element modeling (FEM) aided in determining the optimum indenter contact depth at which the thin films behaved as a semi-infinite solid with negligible substrate induced artifacts. Hardnesses of these AlN and TiN thin films were, determined analytically, 25 GPa and 33 GPa, as compared to FEM results of 24 GPa and 30 GPa, respectively. The elastic moduli measured 320 GPa and 370 GPa for these AlN and TiN thin films, respectively.

Investigation of the Mechanical Properties of Nanocrystalline Cemented Carbides by Nano-Indentation Technique

2013 ◽  
Vol 456 ◽  
pp. 545-548
Author(s):  
Xue Mei Liu ◽  
Xiao Yan Song ◽  
Hai Bin Wang ◽  
Yao Wang ◽  
Yang Gao ◽  
...  
Keyword(s):  
Measurement Method ◽  
Bulk Material ◽  
In Situ Reduction ◽  
Nano Indentation ◽  
Stiffness Measurement ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Continuous Stiffness Measurement ◽  
Sintering Method

The nanocrystalline WC-Co bulk material with a relative density of 98.5% was prepared by combing in-situ reduction and carbonization reactions and spark plasma sintering method. Using continuous stiffness measurement method in the nanoindentation technique, the high precision modulus and hardness of the material were measured.

The Study on Young's Modulus of Multilayered Cu/Ni Multilayered Nano Thin Films by Molecular Dynamics Simulation

2014 ◽  
Vol 513-517 ◽  
pp. 113-116
Author(s):  
Jen Ching Huang ◽  
Fu Jen Cheng ◽  
Chun Song Yang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Strain Rate ◽  
Young’S Modulus ◽  
Potential Function ◽  
Dynamics Simulation ◽  
System Temperature ◽  
Simulation Results

The Youngs modulus of multilayered nanothin films is an important property. This paper focused to investigate the Youngs Modulus of Multilayered Ni/Cu Multilayered nanoThin Films under different condition by Molecular Dynamics Simulation. The NVT ensemble and COMPASS potential function were employed in the simulation. The multilayered nanothin film contained the Ni and Cu thin films in sequence. From simulation results, it is found that the Youngs modulus of Cu/Ni multilayered nanothin film is different at different lattice orientations, temperatures and strain rate. After experiments, it can be found that the Youngs modulus of multilayered nanothin film in the plane (100) is highest. As thickness of the thin film and system temperature rises, Youngs modulus of multilayered nanothin film is reduced instead. And, the strain rate increases, the Youngs modulus of Cu/Ni multilayered nanothin film will also increase.

The Characterization of Depth Profiles of Thin Films and Interfaces by Nuclear Scattering Techniques

1987 ◽  
pp. 381-386
Author(s):  
C. Chauvin ◽  
J. F. Currie ◽  
S. Poulin-Dandurand ◽  
E. Sacher ◽  
A. Yelon ◽  
...  
Keyword(s):  
Thin Films ◽  
Nuclear Scattering ◽  
Depth Profiles
Sign in / Sign up

Export Citation Format

Share Document