An Investigation on Resistive Switching Characteristics Induced by HfOx and Electrode Interfaces

2015 ◽  
Vol 645-646 ◽  
pp. 169-177
Author(s):  
Xiao Rong Chen ◽  
Jie Feng

Pt/HfOx/Pt resistive switching devices with symmetric electrodes were fabricated. Bipolar resistive switching (RS) behaviors and unipolar behaviors were then observed under a positive/negative bias applied to the top electrode (TE). A comparison and analysis of bipolar/unipolar RS behaviors under different voltage polarities was then performed.The results demonstrated that bipolar RS was achieved via a drift of anion (O2-) under the electric field resulting in the rupture and recovery of filaments at the interface. When the filaments dissolved and formed at the interface near BE, the performance of the bipolar RS devices was better. However, for unipolar RS devices, when filaments dissolved and formed at the interface near TE, the performance was even better. These results indicated that a drift of O2-caused by electric field and a diffusion of O2-induced by Joule heat were the main reasons for unipolar RS. The different characteristics of the bipolar and unipolar devices can be attributed to the existence of a different number of defects at the active interface of the devices. This was where the rupture and recovery of filaments occurred. The results also indicate that the active interface is more important than other interfaces for RRAM performance.

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Sera Kwon ◽  
Min-Jung Kim ◽  
Kwun-Bum Chung

AbstractTiOx-based resistive switching devices have recently attracted attention as a promising candidate for next-generation non-volatile memory devices. A number of studies have attempted to increase the structural density of resistive switching devices. The fabrication of a multi-level switching device is a feasible method for increasing the density of the memory cell. Herein, we attempt to obtain a non-volatile multi-level switching memory device that is highly transparent by embedding SiO2 nanoparticles (NPs) into the TiOx matrix (TiOx@SiO2 NPs). The fully transparent resistive switching device is fabricated with an ITO/TiOx@SiO2 NPs/ITO structure on glass substrate, and it shows transmittance over 95% in the visible range. The TiOx@SiO2 NPs device shows outstanding switching characteristics, such as a high on/off ratio, long retention time, good endurance, and distinguishable multi-level switching. To understand multi-level switching characteristics by adjusting the set voltages, we analyze the switching mechanism in each resistive state. This method represents a promising approach for high-performance non-volatile multi-level memory applications.


2018 ◽  
Vol 18 (4) ◽  
pp. 2650-2656 ◽  
Author(s):  
Xuejiao Zhang ◽  
Zhiwei Xu ◽  
Bai Sun ◽  
Jianjun Liu ◽  
Yanyan Cao ◽  
...  

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1282 ◽  
Author(s):  
Zhao ◽  
Li ◽  
Ai ◽  
Wen

A kind of devices Pt/Ag/ZnO:Li/Pt/Ti with high resistive switching behaviors were prepared on a SiO2/Si substrate by using magnetron sputtering method and mask technology, composed of a bottom electrode (BE) of Pt/Ti, a resistive switching layer of ZnO:Li thin film and a top electrode (TE) of Pt/Ag. To determine the crystal lattice structure and the Li-doped concentration in the resulted ZnO thin films, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) tests were carried out. Resistive switching behaviors of the devices with different thicknesses of Li-doped ZnO thin films were studied at different set and reset voltages based on analog and digital resistive switching characteristics. At room temperature, the fabricated devices represent stable bipolar resistive switching behaviors with a low set voltage, a high switching current ratio and a long retention up to 104 s. In addition, the device can sustain an excellent endurance more than 103 cycles at an applied pulse voltage. The mechanism on how the thicknesses of the Li-doped ZnO thin films affect the resistive switching behaviors was investigated by installing conduction mechanism models. This study provides a new strategy for fabricating the resistive random access memory (ReRAM) device used in practice.


2020 ◽  
Author(s):  
Enrique Miranda ◽  
Jordi Suñé

This paper reports the fundamentals and SPICE implementation of the dynamic memdiode model (DMM) for the conduction characteristics of bipolar resistive switching devices. The model equations are implemented in the LTSpice simulator using an equivalent circuital approach with behavioral components and sources.


2016 ◽  
Vol 19 (2) ◽  
pp. 92-100
Author(s):  
Ngoc Kim Pham ◽  
Thang Bach Phan ◽  
Vinh Cao Tran

In this study, we have investigated influences of the thickness on the structure, surface morphology and resistive switching characteristics of CrOx thin films prepared by using DC reactive sputtering technique. The Raman and FTIR analysis revealed that multiphases including Cr2O3, CrO2, Cr8O21... phases coexist in the microstructure of CrOx film. It is noticed that the amount of stoichiometric Cr2O3 phase increased significantly as well as the surface morphology were more visible with less voids and more densed particles with larger thickness films. The Ag/CrOx/FTO devices exhibited bipolar resistive switching behavior and high reliability. The resistive switching ratio has decreased slightly with the thickness increments and was best achieved at CrOx – 100 nm devices.


2018 ◽  
Vol 740 ◽  
pp. 816-822 ◽  
Author(s):  
Y.R. Chen ◽  
Z.M. Li ◽  
Z.W. Zhang ◽  
L.Q. Hu ◽  
H. Jiang ◽  
...  

2012 ◽  
Vol 10 (1) ◽  
pp. 013102-13105 ◽  
Author(s):  
Jianwei Zhao Jianwei Zhao ◽  
Fengjuan Liu Fengjuan Liu ◽  
Jian Sun Jian Sun ◽  
Haiqin Huang Haiqin Huang ◽  
Zuofu Hu Zuofu Hu ◽  
...  

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