Thermally Conductive Nanocomposites Based on Epoxy Modified with SiC and POSS

2017 ◽  
Vol 727 ◽  
pp. 553-557 ◽  
Author(s):  
Ji Fang Fu ◽  
Qi Lu ◽  
Pei Song Zong ◽  
Li Ya Chen ◽  
Guo Jun Ding ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Filler Content ◽  
Flexural Properties ◽  
Impact Properties ◽  
Conductive Nanocomposites ◽  
Thermally Conductive

OAPS/SiC/EP, SiC/EP, A151-SiC/EP composites were prepared and their impact properties, flexural properties, thermal conductivity and insulation and thermal stability were investigated. The comparison of three different composites showed that OAPS/SiC/EP composites had best properties. The thermal conductivity of OAPS/SiC/EP composites increased with increasing filler content. The thermal conductivity of OAPS/SiC/EP composites with 20 wt% SiC was 0.34 W/mK and was 55% higher than that of unmodified EP.

Insulating and Thermally Conductive Composite Filled with Boron Nitride Particles

2011 ◽  
Vol 391-392 ◽  
pp. 282-286 ◽  
Author(s):  
Jun Peng Li ◽  
Shu Hua Qi ◽  
Fan Xie
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
Filler Content ◽  
Glass Fibers ◽  
High Surface ◽  
Conductive Filler ◽  
Volume Resistivity ◽  
Conductive Composites ◽  
Thermally Conductive

A new kind of thermally conductive composites reinforced by glass fibers with boron nitride (BN) as thermally conductive filler was prepared in heat press molding. Thermal conductivity of the composites was found to increase with increasing in filler content. But impact strength and flexural strength reach the top point, 385.05KJ/m2 and 912.6481MPa, with content of 50wt% and 20wt% respectively. The thermal conductivity of 0.8385 W/mK was obtained at 50wt% filler content. Experimental dates show that mixed matrix of epoxy (EP) and polyimide (PI) displays high thermal stability and can improve thermal stability compared to pure epoxy obviously at 50wt% PI content. Additionally, the obtained composites possess high surface resistivity and volume resistivity, which are suitable for substrate materials.

Effect of exfoliated graphite nanoplatelets on thermal and heat deflection properties of kenaf polypropylene hybrid nanocomposites

2016 ◽  
Vol 36 (9) ◽  
pp. 877-889 ◽  
Author(s):  
Christopher Igwe Idumah ◽  
Azman Hassan
Keyword(s):  
Electron Microscopy ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Heat Dissipation ◽  
Hybrid Nanocomposites ◽  
Exfoliated Graphite ◽  
Graphite Nanoplatelets ◽  
Uniform Dispersion ◽  
Thermally Conductive ◽  
And Behavior

Abstract Exfoliated graphite nanoplatelet (GNP) polypropylene (PP)/kenaf fiber (KF) hybrid nanocomposites (PP/KF/MAPP/GNP collectively presented as PKMG) were developed through melt extrusion using a co-rotating screw speed extruder. The loadings of GNPs in nanocomposites were varied from 1–5 phr and characterized for thermal conductivity, stability and behavior, morphology, and heat deflection temperature (HDT). Results revealed increasing effective thermal conductivity with increasing inclusion of GNP. This behavior was attributed to the formation of thermally conductive, interconnected, sheets of GNP which enhanced heat dissipation. Thermal stability analysis revealed high thermal residue content at 3 phr loading attributed to uniform dispersion of GNP sheets in polymer matrix and the formation of enhanced oxygen-barrier due to effective char formation. Results also revealed enhanced HDT (0.46 MPa/1.8 MPa) with increasing incorporation of GNP ascribed to high modulus and thermal stability of GNP sheets. This implies capability of material to sustain loading at high temperatures without losing its rigidity. Thermal behavior revealed increased crystallization temperature and reduced degree of crystallization with slight increase in melting temperature in the range of 2–5°C. Morphological analysis using transmission electron microscopy (TEM) and field emission scanning electron microscopy (FESEM) revealed exfoliated and uniform dispersion of graphene in matrix polymer at 3 phr loading.

Study on Glass Fiber Reinforced EP/PSF Insulating and Thermally Conductive Composite Filled with BN Particles

2013 ◽  
Vol 341-342 ◽  
pp. 153-156
Author(s):  
Fan Xie ◽  
Shu Hua Qi ◽  
Jun Peng Li
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Composite Materials ◽  
Glass Fiber ◽  
Glass Fiber Reinforced ◽  
The Matrix ◽  
Thermally Conductive ◽  
Modified Epoxy ◽  
Thermal Stability Of ◽  
Press Molding

Polysulfone modified epoxy resin was chosen as the matrix of composite materials. The epoxy/glass fiber/boron nitride composite materials were prepared by heat press molding. The effect of different size and content of BN on the thermal, mechanical, electrical properties and thermal stability of the composite was investigated. The results showed that thermal conductivity and thermal stability of the composite increased with the content of the BN particles, the thermal conductivity of the composite reached 0.672W/m·K when filled with 1μm BN at 20 wt.%. Impact strength and flexure strength of the composite increased initially and then decreased with the increasing content of BN. The electrical insulating property of the composite remained with the content of 20 wt.% BN.

scholarly journals Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3634
Author(s):  
John M. Hutchinson ◽  
Sasan Moradi
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Filler Content ◽  
Electronic Devices ◽  
Cure Kinetics ◽  
The Matrix ◽  
Thermally Conductive ◽  
Filler Particles ◽  
Kinetics Of

Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects include the following: the filler content; the type of epoxy system used for the matrix; the morphology of the filler particles (platelets, agglomerates) and their size and concentration; the use of surface treatments of the filler particles or of coupling agents; and the composite preparation procedures, for example whether or not solvents are used for dispersion of the filler in the matrix. The dependence of thermal conductivity on filler content, obtained from over one hundred reports in the literature, is examined in detail, and an attempt is made to categorise the effects of the variables and to compare the results obtained by different procedures.

scholarly journals Development of Thermally Conductive Polymer Materials and their Investigation

2012 ◽  
Vol 729 ◽  
pp. 80-84 ◽  
Author(s):  
András Suplicz ◽  
József Gábor Kovács
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Conduction ◽  
Filler Content ◽  
New Products ◽  
Conductive Polymer ◽  
Polymer Materials ◽  
Electronic Industry ◽  
Conductive Composites ◽  
Thermally Conductive

In the recent years a remarkable development can be observed in the electronics. New products of electronic industry generate more and more heat. To dissipate this heat, thermally conductive polymers offer new possibilities. The goal of this work was to develop a novel polymer based material, which has a good thermal conduction. The main purpose during the development was that this material can be processed easily with injection molding. To eliminate the weaknesses of the traditional conductive composites low-melting-point alloy was applied as filler. Furthermore in this work the effect of the filler content on thermal conductivity, on structure and on mechanical properties was investigated.

Effect of highly thermally conductive Ag@BN on the thermal and mechanical properties of phthalonitrile resins

2021 ◽  
pp. 095400832110580
Author(s):  
Xinggang Chen ◽  
Xiongwei Qu ◽  
Jun Chen ◽  
De Zheng
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Storage Modulus ◽  
Dynamic Mechanical Properties ◽  
Decomposition Temperature ◽  
Potential Candidate ◽  
Thermal And Mechanical Properties ◽  
X Ray ◽  
Thermally Conductive

Ag@BN/phthalonitrile resin composites were prepared using highly thermally conductive BN modified by Ag plating. The effects of different contents of Ag@BN particles on the dynamic mechanical properties, thermal stability, and thermal conductivity of composites were examined. The results of Fourier-transform infrared spectroscopy, X-ray powder diffraction, scanning electron microscopy, and energy-dispersive X-ray spectroscopy analyses showed that Ag was successfully deposited on the surface of BN. The prepared Ag@BN was subjected to KH550 grafting treatment. With the increase in the content of Ag@BN/KH550, the storage modulus, thermal stability, and thermal conductivity of the composite increased. The storage modulus, decomposition temperature, and thermal conductivity of the Ag@BN/phthalonitrile composite with 20 wt.% Ag@BN/KH550 were 5.0 GPa, 539°C, and 0.80 W/(mK), respectively, which are 1.35, 1.18, and 3.33 times higher than those of pure resin, respectively. The compatibility and dispersibility of BN modified by Ag plating in phthalonitrile resin were effectively enhanced, thereby providing a potential candidate to be used at high-temperature devices with high thermal conductivity.

scholarly journals Modeling the Thermal Conductivity Inhomogeneities of Injection-Molded Particle-Filled Composites, Caused by Segregation

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1691 ◽  
Author(s):  
András Suplicz ◽  
Orsolya Viktória Semperger ◽  
József Gábor Kovács
Keyword(s):  
Thermal Conductivity ◽  
Filler Content ◽  
Great Accuracy ◽  
New Materials ◽  
Conductive Composites ◽  
Thermally Conductive ◽  
Innovative Solution ◽  
Dependent Model ◽  
Injection Molded ◽  
Conductive Particles

Many applications require new materials that have good thermal conductivity, are electrical insulators and can be processed easily and with relatively little energy. A new innovative solution for this problem is thermally conductive composites, which can replace metals in many cases. Many papers have focused on the prediction of their thermal conductivity. At the same time segregation has to be taken into account in the case of composites because it affects the distribution of thermally conductive particles, and thus local thermal conductivities. In this paper, we examined and modeled segregation during injection molding and its effect on thermal conductivity. We injection-molded samples from polypropylene with glass beads of different sizes and analyzed their filler content as a function of the flow path. We described the distribution of the filler with a mathematical model. Using this, we created a new, segregation-dependent model that describes the local thermal conductivity of polymer composites as a function of filler content with great accuracy.

scholarly journals Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 597 ◽  
Author(s):  
Van-Dung Mai ◽  
Dae-Il Lee ◽  
Jun-Hong Park ◽  
Dai-Soo Lee
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Packaging ◽  
Epoxy Resins ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Packaging Materials ◽  
Thermally Conductive

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

Highly thermally conductive UHMWPE/NG composites with the segregated structure and their application for heat spreader

2020 ◽  
pp. 089270572096564
Author(s):  
Xiao Wang ◽  
Hui Lu ◽  
Jun Chen
Keyword(s):  
Thermal Conductivity ◽  
Laser Flash ◽  
Heating Process ◽  
X Ray Diffraction ◽  
Heat Spreader ◽  
Conductive Composites ◽  
Compression Direction ◽  
Thermal Analyzer ◽  
Thermally Conductive ◽  
Plane Direction

In this work, ultra-high molecular weight polyethylene (UHMWPE)/natural flake graphite (NG) polymer composites with the extraordinary high thermal conductivity were prepared by a facile mixed-heating powder method. Morphology observation and X-ray diffraction (XRD) tests revealed that the NG flakes could be more tightly coated on the surface of UHMWPE granules by mixed-heating process and align horizontally (perpendicular to the hot compression direction of composites). Laser flash thermal analyzer (LFA) demonstrated that the thermal conductivity (TC) of composites with 21.6 vol% of NG reached 19.87 W/(m·K) and 10.67 W/(m·K) in the in-plane and through-plane direction, respectively. Application experiment further demonstrated that UHMWPE/NG composites had strong capability to dissipate the heat as heat spreader. The obtained results provided a valuable basis for fabricating high thermal conductive composites which can act as advanced thermal management materials.

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