PVT-Growth and Characterization of Single Crystalline 3C-SiC on a (0001) 6H-SiC Substrate

2005 ◽  
Vol 483-485 ◽  
pp. 319-322 ◽  
Author(s):  
Efstathios K. Polychroniadis ◽  
Alkyoni Mantzari ◽  
A. Freudenberg ◽  
Jürgen Wollweber ◽  
R. Nitschke ◽  
...  
Keyword(s):  
Defect Density ◽  
Stacking Faults ◽  
Rapid Decrease ◽  
Crystallographic Direction ◽  
Vapour Transport ◽  
Direction Parallel ◽  
Transmission Electron ◽  
Nitrogen Donor ◽  
Capacitance Voltage

The aim of the present work is to grow 3C-SiC on (0001) 6H-SiC seeds using the Physical Vapour Transport (PVT) method and to study the electrical and structural properties of the grown material. Photoluminescence (PL)-mappings reveal that the overgrown layer consists predominantly of the 3C-SiC polytype and capacitance-voltage (C-V) measurements result in a net nitrogen donor concentration of 1x1016cm-3. Transmission Electron Microscopy (TEM) observations also confirm that the overgrown layer is of the 3C-SiC polytype having the cubic [111] crystallographic direction parallel to the c-axis of the 6H-SiC substrate. In some cases, twin crystals of 3C-SiC are formed immediately after the interface and, in a few cases, small 6H-SiC inclusions are observed in the cubic film having the same orientation as the substrate. The film near the substrate/overgrown interface shows a high density of defects such as dislocations and stacking faults (SF’s), which propagate into the overgrown layer. Finally although there is a rapid decrease of the defect density within the first 60 µm from the interface, the SF density remains almost constant within the last 100 µm below the surface.

scholarly journals Characterization of Gaas/Si/GaAs Heterointerfaces

1989 ◽  
Vol 148 ◽  
Author(s):  
Zuzanna Liliental-Weber ◽  
Raymond P. Mariella
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Low Temperature ◽  
Defect Density ◽  
Si Substrate ◽  
Reverse Polarity ◽  
Si Substrates ◽  
Transmission Electron ◽  
Metal Semiconductor Metal

ABSTRACTTransmission electron microscopy of GaAs grown on Si for metal-semiconductor-metal photodetectors is presented in this paper. Two kinds of samples are compared: GaAs grown on a 15 Å Si epilayer grown on GaAs, and GaAs grown at low temperature (300°C) on Si substrates. It is shown that the GaAs epitaxial layer grown on thin Si layer has reverse polarity to the substrate (antiphase relation). Higher defect density is observed for GaAs grown on Si substrate. This higher defect density correlates with an increased device speed, but with reduced sensitivity.

Structural Characterization of CF-PVT Grown Bulk 3C-SiC

2008 ◽  
Vol 600-603 ◽  
pp. 67-70 ◽  
Author(s):  
Alkyoni Mantzari ◽  
Frédéric Mercier ◽  
Maher Soueidan ◽  
Didier Chaussende ◽  
Gabriel Ferro ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Structural Properties ◽  
Structural Characterization ◽  
Stacking Faults ◽  
Vapor Transport ◽  
Physical Vapor Transport ◽  
Transmission Electron ◽  
Continuous Feed

The aim of the present work is to study the structural properties of 3C-SiC which is grown on (0001) 6H-SiC and on (100) 3C-SiC (Hoya) seeds using the Continuous Feed Physical Vapor Transport (CF-PVT) method. Transmission Electron Microscopy (TEM) observations confirm that the overgrown layer is of the 3C-SiC polytype. In the case of the 6H-SiC substrate, microtwins (MTs), stacking faults (SFs) and dislocations (D) are observed at the substrate-overgrown interface with most of the dislocations annihilating within the first few µm from the interface. In the case of 3C-SiC crystals grown on 3C seeds, repeated SFs are formed locally and also coherent (111) twins of 3C-SiC are frequently observed near the surface. The SF density is reduced at the uppermost part of the grown material.

Homoepitaxial growth and characterization of thick SiC layers with a reduced micropipe density

2004 ◽  
Vol 815 ◽  
Author(s):  
H. Tsuchida ◽  
I. Kamata ◽  
S. Izumi ◽  
T. Tawara ◽  
T. Jikimoto ◽  
...  
Keyword(s):  
Growth Rate ◽  
High Performance ◽  
Defect Density ◽  
Stacking Faults ◽  
High Growth ◽  
High Growth Rate ◽  
Effective Lifetime ◽  
Growth Technique ◽  
Homoepitaxial Growth

AbstractGrowth technique for thick SiC epilayers with a reduced micropipe density has been developed in a vertical hot-wall CVD reactor. Micropipe closing by growing an epilayer is possible with a nearly 100% probability for 4H-SiC substrates oriented (0001) and (000-1) off-cut towards either [11-20] or [1-100]. By applying the micropipe closing technique, a high-performance Schottky barrier diode (SBD) was demonstrated on a substrate including micropipes. Growth of low-doped and thick SiC epilayers is also possible with a good morphology at a high growth rate, and 14.4 kV blocking performance was demonstrated using a 210 μm-thick epilayer. Epitaxial growth on (000-1) substrates with low doping and a low epi-induced defect density was also demonstrated. Deep centers and impurities were investigated to determine the effective lifetime killer of the epilayers. Dislocations and stacking faults in epilayers grown on 4H-SiC substrates off-cut towards different directions were also investigated.

scholarly journals Characterization of individual stacking faults in a wurtzite GaAs nanowire by nanobeam X-ray diffraction

2017 ◽  
Vol 24 (5) ◽  
pp. 981-990 ◽  
Author(s):  
Arman Davtyan ◽  
Sebastian Lehmann ◽  
Dominik Kriegner ◽  
Reza R. Zamani ◽  
Kimberly A. Dick ◽  
...  
Keyword(s):  
Bragg Peak ◽  
Stacking Faults ◽  
Growth Direction ◽  
X Ray Diffraction ◽  
X Ray ◽  
Patterson Function ◽  
Transmission Electron ◽  
Gaas Nanowires ◽  
Gaas Nanowire

Coherent X-ray diffraction was used to measure the type, quantity and the relative distances between stacking faults along the growth direction of two individual wurtzite GaAs nanowires grown by metalorganic vapour epitaxy. The presented approach is based on the general property of the Patterson function, which is the autocorrelation of the electron density as well as the Fourier transformation of the diffracted intensity distribution of an object. Partial Patterson functions were extracted from the diffracted intensity measured along the [000\bar{1}] direction in the vicinity of the wurtzite 00\bar{1}\bar{5} Bragg peak. The maxima of the Patterson function encode both the distances between the fault planes and the type of the fault planes with the sensitivity of a single atomic bilayer. The positions of the fault planes are deduced from the positions and shapes of the maxima of the Patterson function and they are in excellent agreement with the positions found with transmission electron microscopy of the same nanowire.

Planar Defects in Small Particles

1985 ◽  
Vol 43 ◽  
pp. 392-393
Author(s):  
R. Pérez ◽  
M. Avalos-Borja
Keyword(s):  
Stacking Faults ◽  
Particle Growth ◽  
Small Particles ◽  
Planar Defects ◽  
Metallic Particles ◽  
Weak Beam ◽  
Transmission Electron ◽  
Imaging Conditions

Transmission electron microscope techniques have been extensively used in the determination of the morphology of fine metallic particles. These techniques have been of particular importance in obtaining topographical information during particle growth and sintering. Thus, for example, it has been found that some of the most elementary forms consist of half cubo-octahedral units with (111) faces and (100) basis. Furthermore, full cubo-octahedral units have also been found, some of them showing stacking faults (SF) through the particles.It is important to point out that the characterization of this type of planar defects in small metallic particles has commonly been based on geometrical con. siderations. Additionally, the imaging conditions which have been used are the so-called weak beam (WB) diffraction conditions. Recent investigations have shown, on the other hand, that SF images under WB conditions present serious inconveniences, for example, contrast asymmetries in SF images which are not totally explained. Another difficulty with these WB fault images arises from twin boundaries which display image contrast similar to SF when a common reflection is strongly excited.

Structural Characterization of Nc-Si/A-Sio2 Superlattices Subjected To Thermal Treatment

1998 ◽  
Vol 536 ◽  
Author(s):  
G. F. Grom ◽  
L. Tsybeskov ◽  
K. D. Hirschman ◽  
P. M. Fauchet ◽  
J. P. McCaffrey ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Raman Spectroscopy ◽  
Defect Density ◽  
High Temperature Annealing ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Si Nanocrystals

AbstractThe morphology of nanocrystalline (nc)-Si/amorphous (a)-SiO2 superlattices (SLs) is studied using Raman spectroscopy in the acoustic and optical phonon ranges, transmission electron microscopy (TEM), and atomic force microscopy (AFM). It is demonstrated that high temperature annealing (up to 1100°C) and oxidation in O2/H2O ambient do not destroy the SL structure, which retains its original periodicity and nc-Si/a-SiO2 interface abruptness. It is found that oxidation at high temperatures reduces the defect density in nc-Si/a-SiO2 SLs and induces the lateral coalescence of Si nanocrystals (NCs). The size, shape, packing density, and crystallographic orientation of the Si nanocrystals are studied as a function of the oxidation time.

Hrtem Characterization of 6H-15R Polytype Boundaries in Silicon Carbide Grown by Physical Vapor Transport

1996 ◽  
Vol 442 ◽  
Author(s):  
E. K. Sanchez ◽  
M. De Graef ◽  
W. Qian ◽  
M. Skowronski
Keyword(s):  
Electron Microscopy ◽  
Silicon Carbide ◽  
Cross Section ◽  
Stacking Faults ◽  
Vapor Transport ◽  
Physical Vapor Transport ◽  
Stacking Sequence ◽  
Fault Density ◽  
Transmission Electron

AbstractThe interface between 6H and 15R polytypes of silicon carbide, grown by Physical Vapor Transport, was studied by high-resolution transmission electron microscopy. The sample was investigated in cross-section cut perpendicular to the [11.0] irection. The atomic stacking sequence at the interface of the polytypes was determined. Polytype boundaries with orientations parallel and perpendicular to the 6H c-axis were investigated. Stacking faults associated with low angle grain boundaries in both 6H and 15R regions were observed and the 15R regions systematically showed a higher fault density than the 6H regions.

Characterization of Dislocations in GaN Thin Film and GaN/AlN Multilayer

2012 ◽  
Vol 725 ◽  
pp. 75-78
Author(s):  
Noriko Ohmori ◽  
Tomonori Uchimaru ◽  
Hiroyuki Fujimori ◽  
Jun Komiyama ◽  
Yoshihisa Abe ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Buffer Layer ◽  
Direction Parallel ◽  
Density Of Dislocations ◽  
Transmission Electron ◽  
Sudden Decrease

The dislocations in GaN thin film with GaN/AlN multilayer (ML) as the buffer layer were evaluated using transmission electron microscopy. A high density of dislocations parallel to the GaN/ML interface and a sudden decrease in the dislocation density at the GaN/ML interface were found. Dislocation propagation in the direction parallel to the GaN/ML interface by turning horizontally on the GaN/ML interface is considered to be effective in decreasing the dislocation density at the top layer of GaN.

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