Texture Evolution during Grain Growth under the Influence of Mechanical Stresses

2005 ◽  
Vol 495-497 ◽  
pp. 1279-1284 ◽  
Author(s):  
Myrjam Winning
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Texture Evolution ◽  
Mechanical Stresses ◽  
Stress Fields ◽  
Grain Sizes ◽  
Purity Aluminium ◽  
High Purity Aluminium ◽  
Kinetics Of ◽  
Growth Experiments

In order to study the influence of mechanical stress fields on the kinetics and texture evolution of grain growth, experiments were performed on high purity aluminium. Samples were annealed under the influence of different mechanical stresses. The temporal evolutions of grain sizes and of macrotexture were analysed in ependence on the applied stress. The results show that mechanical stresses can change the kinetics of grain growth and slow down the increase in the grain size. Also effects on the texture evolution were observed and shall be discussed.

Kinetics of Recrystallization and Grain Growth of Cold Rolled TWIP Steel

2010 ◽  
Vol 89-91 ◽  
pp. 153-158 ◽  
Author(s):  
F. de las Cuevas ◽  
Mónica Reis ◽  
A. Ferraiuolo ◽  
G. Pratolongo ◽  
L. Pentti Karjalainen ◽  
...  
Keyword(s):  
Grain Growth ◽  
Twip Steel ◽  
Growth Equation ◽  
Grain Sizes ◽  
Time Space ◽  
Cold Rolled ◽  
Hot Rolled ◽  
Kinetics Of ◽  
Temperature Time ◽  
Growth Experiments

Hot rolled, laboratory-cast, TWIP steel samples (5.4 mm thick) of 22% Mn - 0.6% C (in mass-%) were cold rolled to different reductions (from 40 % to 70 %) and subsequently isothermally annealed for various times at temperatures ranging from 450º C to 1100º C. The evolution of recrystallization and grain growth was followed by control of the softening kinetics complemented by metallographic, OIM and microtexture observations. A map of the recovery, recrystallization and grain growth in the temperature-time space was obtained. In all instances, the grain size at the end of recrystallization was very fine, D ≤ 2 µm and larger grain sizes were the result of grain growth. A range of grain sizes 2 µm ≤ D ≤ 50 µm was covered by the grain growth experiments. A phenomenological grain growth equation that is useful for the annealing control of this steel was derived from the measurements.

scholarly journals Mean Field Analysis of Orientation Selective Grain Growth Driven By Interface-Energy Anisotropy

1994 ◽  
Vol 343 ◽  
Author(s):  
J. A. Floro ◽  
C. V. Thompson
Keyword(s):  
Grain Size ◽  
Size Distribution ◽  
Grain Growth ◽  
Texture Evolution ◽  
Mean Field ◽  
Orientation Distribution ◽  
Interface Energy ◽  
Abnormal Grain Growth ◽  
Field Analysis ◽  
Energy Anisotropy

ABSTRACTAbnormal grain growth is characterized by the lack of a steady state grain size distribution. In extreme cases the size distribution becomes transiently bimodal, with a few grains growing much larger than the average size. This is known as secondary grain growth. In polycrystalline thin films, the surface energy γs and film/substrate interfacial energy γi vary with grain orientation, providing an orientation-selective driving force that can lead to abnormal grain growth. We employ a mean field analysis that incorporates the effect of interface energy anisotropy to predict the evolution of the grain size/orientation distribution. While abnormal grain growth and texture evolution always result when interface energy anisotropy is present, whether secondary grain growth occurs will depend sensitively on the details of the orientation dependence of γi.

Effects of Solubility Limit and the Presence of Ultra-Fine Al6Fe on the Kinetics of Grain Growth in Dilute Al-Fe Alloys

2007 ◽  
Vol 550 ◽  
pp. 339-344 ◽  
Author(s):  
Shigeo Saimoto ◽  
Hai Ou Jin
Keyword(s):  
Grain Size ◽  
Cold Rolling ◽  
Grain Growth ◽  
Solubility Limit ◽  
Rolled Sheet ◽  
Migration Rates ◽  
Cold Rolled ◽  
Fe Alloys ◽  
Grain Growth Kinetics ◽  
Kinetics Of

A nominally pure Al slab was thermo-mechanically treated to result in a near random texture of 90 m grain size. Subsequent cold rolling with intermediate anneals at 230, 275, and 300°C reduced the Fe solute to near equilibrium compositions below 0.5 ppm atomic. The final cold rolled sheet continuously recrystallized; grain growth of this structure is reported. A grain-growth kinetics mapping was generated, correlating the parameters of Fe-in-Al solubility limit, Fe diffusivities in the grain boundaries and the Al lattice and the activation energies for migration rates.

Nanostructure Evolution of ZnO in Ultra-fast Microwave Sintering

2011 ◽  
Vol 691 ◽  
pp. 65-71 ◽  
Author(s):  
Rodolfo F. K. Gunnewiek ◽  
Ruth Herta Goldsmith Aliaga Kiminami
Keyword(s):  
Grain Size ◽  
Zinc Oxide ◽  
Grain Growth ◽  
Microwave Sintering ◽  
High Heating Rate ◽  
Heating Rates ◽  
Grain Sizes ◽  
Average Grain Size ◽  
Conventional Sintering ◽  
Holding Temperature

Grain growth is inevitable in the sintering of pure nanopowder zinc oxide. Sintering depend on diffusion kinetics, thus this growth could be controlled by ultra-fast sintering techniques, as microwave sintering. The purpose of this work was to investigate the nanostructural evolution of zinc oxide nanopowder compacts (average grain size of 80 nm) subjected to ultra-rapid microwave sintering at a constant holding temperature of 900°C, applying different heating rates and temperature holding times. Fine dense microstructures were obtained, with controlled grain growth (grain size from 200 to 450nm at high heating rate) when compared to those obtained by conventional sintering (grain size around 1.13µm), which leads to excessively large average final grain sizes.

scholarly journals Increasing the mean grain size in copper films and features

2008 ◽  
Vol 23 (3) ◽  
pp. 642-662 ◽  
Author(s):  
K. Vanstreels ◽  
S.H. Brongersma ◽  
Zs. Tokei ◽  
L. Carbonell ◽  
W. De Ceuninck ◽  
...  
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Driving Forces ◽  
Texture Evolution ◽  
Deposition Process ◽  
Interface Energy ◽  
Growth Mode ◽  
Copper Films ◽  
Mean Grain Size ◽  
The Mean

A new grain-growth mode is observed in thick sputtered copper films. This new grain-growth mode, also referred to in this work as super secondary grain growth (SSGG) leads to highly concentric grain growth with grain diameters of many tens of micrometers, and drives the system toward a {100} texture. The appearance, growth dynamics, final grain size, and self-annealing time of this new grain-growth mode strongly depends on the applied bias voltage during deposition of these sputtered films, the film thickness, the post-deposition annealing temperature, and the properties of the copper diffusion barrier layers used in this work. Moreover, a clear rivalry between this new growth mode and the regularly observed secondary grain-growth mode in sputtered copper films was found. The microstructure and texture evolution in these films is explained in terms of surface/interface energy and strain-energy density minimizing driving forces, where the latter seems to be an important driving force for the observed new growth mode. By combining these sputtered copper films with electrochemically deposited (ECD) copper films of different thickness, the SSGG growth mode could also be introduced in ECD copper, but this led to a reduced final SSGG grain size for thicker ECD films. The knowledge about the thin-film level is used to also implement this new growth mode in small copper features by slightly modifying the standard deposition process. It is shown that the SSGG growth mode can be introduced in narrow structures, but optimizations are still necessary to further increase the mean grain size in features.

Electroplated Cu Recrystallization in Damascene Structures at Elevated Temperatures

1999 ◽  
Vol 564 ◽  
Author(s):  
Qing-Tang Jiang ◽  
Michael E. Thomas ◽  
Gennadi Bersuker ◽  
Brendan Foran ◽  
Robert Mikkola ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Grain Size ◽  
Film Thickness ◽  
Grain Growth ◽  
Elevated Temperatures ◽  
Retardation Effect ◽  
Cu Films ◽  
Grain Sizes ◽  
Geometrical Constraints ◽  
The Difference

AbstractTransformations in electroplated Cu films from a fine to course grain crystal structure (average grain sizes went from ∼0.1 µm to several microns) were observed to strongly depend on film thickness and geometry. Thinner films underwent much slower transformations than thicker ones. A model is proposed which explains the difference in transformation rates in terms of the physical constraint experienced by the film since grain growth in thinner films is limited by film thickness. Geometrical constraints imposed by trench and via structures appear to have an even greater retardation effect on the grain growth. Experimental observations indicate that it takes much longer for Cu in damascene structures to go through grain size transformations than blanket films.

The Correlation Theory of 2D Normal Grain Growth

2004 ◽  
Vol 467-470 ◽  
pp. 1081-1086 ◽  
Author(s):  
M.W. Nordbakke ◽  
N. Ryum ◽  
Ola Hunderi
Keyword(s):  
Grain Size ◽  
Size Distribution ◽  
Grain Growth ◽  
Grain Size Distribution ◽  
Computer Simulations ◽  
Mean Field Theory ◽  
Mean Field ◽  
Grain Structures ◽  
Spatial Grain ◽  
Kinetics Of

Computer simulations of 2D normal grain growth have shown that size correlations between adjacent grains exist in 2D grain structures. These correlations prevail during the coarsening process and influence on the kinetics of the process and on the grain size distribution. Hillert’s analysis starts with the assumption that all grains in the structure have the same environment. Since computer simulations contradict this assumption, the mean-field theory for normal grain growth needs to be modified. A first attempt was made by Hunderi and Ryum, who modified Hillert’s growth law to include the effect of spatial grain size correlations. In the 1D case the distributions derived by means of the modified growth law agreed well with simulation data. However, the distribution derived for 2D grain growth retained unwanted properties of the Hillert distribution. We review some recent progress in developing a mean-field statistical theory. A paradox related to curvilinear polygons is shown to support the expectation that the grain size distribution has a finite cutoff.

Topology Based Growth Law and New Analytical Grain Size Distribution Function of 3D Grain Growth

2007 ◽  
Vol 558-559 ◽  
pp. 1183-1188 ◽  
Author(s):  
Peter Streitenberger ◽  
Dana Zöllner
Keyword(s):  
Grain Size ◽  
Distribution Function ◽  
Size Distribution ◽  
Grain Growth ◽  
Grain Size Distribution ◽  
Three Dimensional ◽  
Size Distribution Function ◽  
Change Rate ◽  
Grain Sizes ◽  
Self Similar

Based on topological considerations and results of Monte Carlo Potts model simulations of three-dimensional normal grain growth it is shown that, contrary to Hillert’s assumption, the average self-similar volume change rate is a non-linear function of the relative grain size, which in the range of observed grain sizes can be approximated by a quadratic polynomial. In particular, based on an adequate modification of the effective growth law, a new analytical grain size distribution function is derived, which yields an excellent representation of the simulated grain size distribution.

Effect of the Intercalation of the Carbon Layer on the Kinetics of Grain Growth of FePt Magnetic Thin Film during Ordering Reaction - A Monte Carlo Simulation Study

2007 ◽  
Vol 558-559 ◽  
pp. 1237-1242
Author(s):  
M.C. Kim ◽  
D.A. Kim ◽  
Joong Kuen Park
Keyword(s):  
Thin Film ◽  
Monte Carlo Simulation ◽  
Grain Size ◽  
Monte Carlo ◽  
Grain Growth ◽  
Carbon Layer ◽  
Carbon Addition ◽  
Monte Carlo Simulation Study ◽  
Ordering Kinetics ◽  
Kinetics Of

The effect of carbon addition on the grain growth and ordering kinetics of FePt film has been experimentally studied by sputter-depositing a monolithic FePt-20at.%C film of 24 nm. Carbon addition of 20at.% to FePt thin film in a form of FePt (20 nm)/Cn (4 nm) (n = 1, 4) significantly reduced both the grain growth and ordering kinetics. Reducing the thickness of carbon layer, i.e. from n = 1 to n = 4, led to a much finer grain size distribution as well as to a finer grain size. The Monte Carlo simulation study indicated that the decrease of grain growth and ordering kinetics is primarily due to a continuous decrease of the mobility of order – disorder inter-phase with the progress of ordering reaction. This can eventually lead to a stable 2-phase grain structure inter-locked by low mobility inter-phases and is responsible for the formation of a fine grain size distribution in the FePt/Cn film with n = 4.

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