Electroplated Cu Recrystallization in Damascene Structures at Elevated Temperatures

1999 ◽  
Vol 564 ◽  
Author(s):  
Qing-Tang Jiang ◽  
Michael E. Thomas ◽  
Gennadi Bersuker ◽  
Brendan Foran ◽  
Robert Mikkola ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Grain Size ◽  
Film Thickness ◽  
Grain Growth ◽  
Elevated Temperatures ◽  
Retardation Effect ◽  
Cu Films ◽  
Grain Sizes ◽  
Geometrical Constraints ◽  
The Difference

AbstractTransformations in electroplated Cu films from a fine to course grain crystal structure (average grain sizes went from ∼0.1 µm to several microns) were observed to strongly depend on film thickness and geometry. Thinner films underwent much slower transformations than thicker ones. A model is proposed which explains the difference in transformation rates in terms of the physical constraint experienced by the film since grain growth in thinner films is limited by film thickness. Geometrical constraints imposed by trench and via structures appear to have an even greater retardation effect on the grain growth. Experimental observations indicate that it takes much longer for Cu in damascene structures to go through grain size transformations than blanket films.

Stability of Ruthenium-Silica Bilayer Structures

1994 ◽  
Vol 343 ◽  
Author(s):  
Zara Weng-Sieh ◽  
Tai. D. Nguyen ◽  
Ronald Gronsky
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Silicon Dioxide ◽  
Grain Growth ◽  
Original Film ◽  
Grain Sizes ◽  
Transmission Electron ◽  
20 Nm ◽  
Spherical Grains ◽  
Deposited Films

ABSTRACTThe microstructural evolution of ruthenium-silicon dioxide bilayer structures upon annealing is studied using transmission electron microscopy. SiO2/Ru/SiO2 structures, with thicknesses of 2/1/2 nm, 4/2/4 nm, 8/4/8 nm, and 20/10/20 nm, are formed by magnetron sputtering and annealed at 300 or 600°C. As-deposited films have grain sizes on the order of the Ru film thickness. After annealing at 600°C, significant grain growth is observed for all thicknesses, such that the final grain sizes are approximately 3 to 20x greater than the original film thickness. The largest increase in the average Ru grain size is observed for the 2 nm thick ruthenium film possibly due to the coalescence of Ru grains. The coalescence of the Ru particles in the 1 and 2 nm thick films results in the formation of lamellar Ru grains, which disrupts the contiguity of the Ru film. In all other cases, the increase in grain size is attributed to normal grain growth, but the formation of anomalous spherical grains is also observed.

Recrystallization and Grain Growth during Alloy 718 Processing

2007 ◽  
Vol 539-543 ◽  
pp. 3094-3099
Author(s):  
Nho Kwang Park ◽  
Jeoung Han Kim ◽  
Jong Taek Yeom
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Heat Treatments ◽  
Grain Structure ◽  
Alloy 718 ◽  
Compression Tests ◽  
Δ Phase ◽  
Grain Boundary Characteristics ◽  
The Difference ◽  
Boundary Characteristics

In Alloy 718 ingot cogging process, dynamic and metadynamic recrystallizations, and static grain growth occur, and also the presence of δ phase plays a key role in controlling the grain size. In this study, the evolution of grain structure in VIM/VAR-processed Alloy 718 ingots during post-cogging heat treatments is dealt with. Compression tests were made on VIM/VAR-processed Alloy 718 ingot at temperatures between 900oC ~ 1150oC. Heat treatments were made on the compression-tested specimens, and the variation of grain size was evaluated. Constitutive equations for the grain growth are established to represent the evolution of microstructures. Special attention is paid to the evolution of grain structure under the condition of dynamic and metadynamic recrystallizations, and grain growth. The grain growth rate depends mainly on the presence of δ-phase below the δ-solvus temperature, and on the difference in the grain boundary characteristics above it.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

Structure Evolution in Plated Cu Films

2005 ◽  
Vol 863 ◽  
Author(s):  
D.P. Field ◽  
NJ Park ◽  
PR Besser ◽  
JE Sanchez
Keyword(s):  
Film Thickness ◽  
Grain Growth ◽  
Texture Evolution ◽  
Structural Evolution ◽  
Similar Process ◽  
Structure Evolution ◽  
Line Geometry ◽  
Strong Function ◽  
Cu Films ◽  
Line Widths

AbstractStructure evolution in plated Cu films is a function of sublayer stacking, film thickness, plating chemistry, plating parameters, and temperature. The present work examines grain growth and texture evolution in annealed plated Cu on a 25 nm thick Ta sublayer for films of 480 and 750 nm in thickness. These results are compared against those obtained from damascene Cu lines fabricated from a similar process, using a series of line widths. The results show that the initial structures of the plated films are similar, with slightly weaker (111) texture, a higher fraction of twin boundaries, and larger grains in the thicker films. The microstructure of the Cu within the trench constraints is a strong function of line geometry with the propensity for twin boundary development controlling structural evolution.

Nanostructure Evolution of ZnO in Ultra-fast Microwave Sintering

2011 ◽  
Vol 691 ◽  
pp. 65-71 ◽  
Author(s):  
Rodolfo F. K. Gunnewiek ◽  
Ruth Herta Goldsmith Aliaga Kiminami
Keyword(s):  
Grain Size ◽  
Zinc Oxide ◽  
Grain Growth ◽  
Microwave Sintering ◽  
High Heating Rate ◽  
Heating Rates ◽  
Grain Sizes ◽  
Average Grain Size ◽  
Conventional Sintering ◽  
Holding Temperature

Grain growth is inevitable in the sintering of pure nanopowder zinc oxide. Sintering depend on diffusion kinetics, thus this growth could be controlled by ultra-fast sintering techniques, as microwave sintering. The purpose of this work was to investigate the nanostructural evolution of zinc oxide nanopowder compacts (average grain size of 80 nm) subjected to ultra-rapid microwave sintering at a constant holding temperature of 900°C, applying different heating rates and temperature holding times. Fine dense microstructures were obtained, with controlled grain growth (grain size from 200 to 450nm at high heating rate) when compared to those obtained by conventional sintering (grain size around 1.13µm), which leads to excessively large average final grain sizes.

Environmental magnetism as a stream sediment tracer: an interpretation of the methodology and some case studies

Soil Research ◽  
1998 ◽  
Vol 36 (1) ◽  
pp. 167 ◽  
Author(s):  
R. H. Crockford ◽  
P. M. Fleming
Keyword(s):  
Grain Size ◽  
Case Studies ◽  
Environmental Magnetism ◽  
Extensive Discussion ◽  
Remanent Magnetisation ◽  
Grain Sizes ◽  
South Wales ◽  
Wide Range ◽  
River Confluences ◽  
The Difference

A comprehensive sediment sampling program was undertaken in the upper Molonglo catchment in south-eastern New South Wales to determine if mineral magnetics could be used to estimate sidestream contribution at river confluences in this environment. Some 12 confluences were examined over 1400 km 2 in 2 major basins and over 2 contrasting geological types. Sediment samples were divided into 7 size classes and the following magnetic properties measured: magnetic susceptibility at 2 frequencies, isothermal remanent magnetisation at 3 flux densities, and anhysteristic remanent magnetisation. The sidestream inputs were calculated for each particle size class from the range of magnetic parameters. Significant discrepancies and differences appeared in the resultant sidestream inputs, and this paper outlines the conclusions as to the reliability of the different analytical procedures. It is shown that both the concentration and magnetic grain size of ferrimagnetic minerals in the sediments must be taken into account. Where the difference in magnetic grain size between the upstream and sidestream sediments is small, the use of parameter crossplots or bulked magnetic ratios is generally not appropriate. The use of mass (concentration) magnetic values may be better. The difference in the demands of the crossplots and mass values methods is that crossplots require a wide range of mass magnetic concentrations in each branch, with the upstream and sidestream sediments having different magnetic grain sizes, whereas the mass values procedure does best with a very limited (but different) range of concentrations at the upstream and sidestream branches, but similar magnetic grain sizes. This paper provides an extensive discussion of the estimation technique using different parameter combinations, and uses 3 contrasting confluences as case studies.

Effect of Grain Size on Carbide Precipitation and Intergranuiar Corrosion in AISI Type 201 Stainless Steel

CORROSION ◽  
1965 ◽  
Vol 21 (10) ◽  
pp. 332-336 ◽  
Author(s):  
C. P. DOSHI ◽  
W. W. AUSTIN
Keyword(s):  
Grain Size ◽  
Stainless Steel ◽  
Elevated Temperatures ◽  
Austenitic Steels ◽  
Grain Sizes ◽  
Aisi Type ◽  
Sensitization Behavior ◽  
Acid Test ◽  
Sensitization Time ◽  
Carbide Particles

Abstract The grain size of the austenitic stainless steel affects the rate of intergranular attack at high temperatures. While the effect of grain size has been studied for 18-8 chromium-nickel austenitic steels, little work has been done on chromium-nickel-manganese austenitic steels. It is the purpose of this investigation to correlate intergranuiar attack with grain size in these steels. A commercially available alloy (AISI Type 201) was selected for study. Effect of four different grain sizes (ASTM Grain Size Numbers 1, 2, 3 and 5) at four different sensitization times and four temperatures was studied. Results obtained in terms of weight loss in the boiling nitric acid test and through photomicrography were used to correlate intergranuiar attack with grain size. Best resistance to corrosion was obtained at a sensitization temperature of 800 F (426 C) for all grain sizes. At elevated temperatures [1000 and 1200 F (537 and 649 C)] corrosion rate increased with increasing sensitization time. Upon comparison of sensitization behavior at 1400 F (760 C) for all grain sizes it was found that exposure for 48 hours produced less severe corrosive attack than did the 16-hr exposure. This was explained in terms of increase in size of carbide particles.

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

1998 ◽  
Vol 13 (5) ◽  
pp. 1307-1317 ◽  
Author(s):  
R-M. Keller ◽  
S. P. Baker ◽  
E. Arzt
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Thermal Stresses ◽  
Native Oxide ◽  
Silicon Substrates ◽  
Native Oxide Layer ◽  
X Ray Diffraction ◽  
Cu Films ◽  
Order Of Magnitude ◽  
Constraint Model

Thermal stresses in thin Cu films on silicon substrates were examined as a function of film thickness and presence of a silicon nitride passivation layer. At room temperature, tensile stresses increased with decreasing film thickness in qualitative agreement with a dislocation constraint model. However, in order to predict the stress levels, grain-size strengthening, which is shown to follow a Hall–Petch relation, must be superimposed. An alternative explanation is strain-hardening due to the increase in dislocation density, which was measured by x-ray diffraction. At 600 °C, the passivation increases the stress by an order of magnitude; this leads to a substantially different shape of the stress-temperature curves, which now resemble those of aluminum with only a native oxide layer. The effect of passivation is shown to be very sensitive to the deposition and test conditions.

Effect of rate controlled sintering on microstructure and electrical properties of ZnO doped with bismuth and antimony oxides

1997 ◽  
Vol 12 (9) ◽  
pp. 2447-2454 ◽  
Author(s):  
Gaurav Agarwal ◽  
Robert F. Speyer
Keyword(s):  
Grain Size ◽  
Liquid Phase ◽  
Grain Growth ◽  
Elevated Temperatures ◽  
Antimony Oxide ◽  
Second Phase ◽  
Dopant Content ◽  
Average Grain Size ◽  
Rate Controlled ◽  
Grain Boundary Pinning

Various rate controlled sintering (RCS) schedules were used on isostatically pressed particulate compacts of ZnO with Bi2O3 and Sb2O3 additives. For low additive content, smaller average grain sizes with more rapid RCS schedules were attributable to thermal schedules which minimized the time at elevated temperatures where grain growth could occur. β–Bi2O3, Zn7Sb2O12, and Zn2Sb3Bi3O14 phases formed during/after sintering. Elevated heat-treatment temperatures favored the formation of Zn7Sb2O12 and additional β–Bi2O3, while Zn2Sb3Bi3O14 was dominant in sintered samples where the RCS schedule did not result in temperatures in excess of 1100 °C. Zn2Sb3Bi3O14 precipitated during sintering, functioning as grain boundary pinning sites which impeded ZnO grain growth. Bismuth and antimony oxide-based liquid facilitated sintering at lower temperatures, which in turn resulted in decreased average grain size. Rapid RCS schedules for samples with low dopant content resulted in lower sintering temperatures, since time was not allowed for Zn2Sb3Bi3O14 precipitation to deplete the liquid phase. For higher dopant contents, liquid phase was adequately plentiful, wherein longer RCS schedules resulted in lower sintering temperatures. Increasing concentration of second phase generally fostered decreased grain size and attenuated the effect of thermal schedule on the microstructure. Electrical resistance and breakdown voltage increased consistent with decreasing ZnO average grain size.

Influence of a Capping Layer on the Mechanical Properties of Copper Films

1994 ◽  
Vol 356 ◽  
Author(s):  
R.-M. Keller ◽  
S. Bader ◽  
R. P. Vinci ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Film Thickness ◽  
Grain Growth ◽  
Low Temperatures ◽  
Bauschinger Effect ◽  
Diffusional Creep ◽  
Copper Films ◽  
Cu Films ◽  
Heating And Cooling ◽  
Cooling Stress

AbstractThe substrate curvature technique was employed to study the mechanical properties of 0.6 μm and 1.0 μm Cu films capped with a 50 nm thick Si3N4 layer and to compare them with the mechanical properties of uncapped Cu films. The microstructures of these films were also investigated. Grain growth, diffusional creep and dislocation processes are impeded by the cap layer. This is evident in the form of high stresses at high temperatures on heating and at low temperatures on cooling. At intermediate temperatures on heating and cooling, stress plateaus a relatively low stresses exist. This can be explained by the so-called Bauschinger effect. A film thickness dependence of the stresses in the film could not be observed for capped Cu films.

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