Joining of Silicon Nitride to Metal (Mo and Ti) Using a Cu-Foil Interlayer

2006 ◽  
Vol 509 ◽  
pp. 99-104 ◽  
Author(s):  
José G. Flores ◽  
José Cervantes ◽  
José Lemus-Ruiz
Keyword(s):  
Silicon Nitride ◽  
Diffusion Bonding ◽  
The Other ◽  
Reaction Products ◽  
Interface Formation ◽  
High Affinity ◽  
Higher Temperature ◽  
Reactive Interface ◽  
Cu Foil ◽  
Foil Interlayer

This work focuses on various aspects of diffusion bonding silicon nitride to Mo and Ti using a Cu-foil interlayer. Si3N4/Cu/Ti/Cu/Si3N4 and Si3N4/Cu/Mo/Cu/Si3N4 combinations have been diffusion joined at temperatures ranging from 950 to 1150 °C using different holding times in Ar. The results show that Si3N4 could not be bonded to Mo at temperature lower than 1100 °C even for holding times of 60 minutes, however, successful joining is achieved at 1150 °C. On the other hand, successful joining is accomplished at 1050 and 1100 °C for a Si3N4/Cu/Ti/Cu/Si3N4 sample. In the Si3N4/Cu/Ti system, joining occurs by the formation of a reactive interface with several reaction products on the metal side of the joint. All the silicon nitride samples have joined to titanium with no several interfacial cracking and porosity at the interface. The results corresponding to the Si3N4/Cu/Mo system show that a higher temperature is required to join the materials compared with the Si3N4/Cu/Ti system, since the formation of liquid produced by the interaction of Cu with Ti and Si promotes bonding and the high affinity of Ti for Si results in rapid interface formation.

On the Chemistry of Tetrabenzyl Thiuram Disulfide and Tetramethyl Thiuram Disulfide with Bis (Triethoxysilylpropyl) Tetrasulfide in Silica Compounds

2003 ◽  
Vol 76 (4) ◽  
pp. 876-891 ◽  
Author(s):  
R. N. Datta ◽  
A. G. Talma ◽  
S. Datta ◽  
P. G. J. Nieuwenhuis ◽  
W. J. Nijenhuis ◽  
...  
Keyword(s):  
High Performance ◽  
Room Temperature ◽  
Succinic Anhydride ◽  
Dynamic Properties ◽  
The Other ◽  
Resonance Spectroscopy ◽  
Reaction Products ◽  
Negative Effect ◽  
Higher Temperature ◽  
Analytical Tools

Abstract The use of thiurams such as Tetramethyl thiuram disulfide (TMTD) or Tetrabenzyl thiuram disulfide (TBzTD) has been explored to achieve higher cure efficiency. The studies suggest that a clear difference exists between the effect of TMTD versus TBzTD. TMTD reacts with Bis (triethoxysilylpropyl) tetrasulfide (TESPT) and this reaction can take place even at room temperature. On the other hand, the reaction of TBzTD with TESPT is slow and takes place only at higher temperature. High Performance Liquid Chromatography (HPLC) with mass (MS) detection, Nuclear Magnetic Resonance Spectroscopy (NMR) and other analytical tools have been used to understand the differences between the reaction of TMTD and TESPT versus TBzTD and TESPT. The reaction products originating from these reactions are also identified. These studies indicate that unlike TMTD, TBzTD improves the cure efficiency allowing faster cure without significant effect on processing characteristics as well as dynamic properties. The loading of TESPT is reduced in a typical Green tire compound and the negative effect on viscosity is repaired by addition of anhydrides, such as succinic anhydride, maleic anhydride, etc.

Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper

2017 ◽  
Vol 115 (1) ◽  
pp. 115 ◽  
Author(s):  
Gopinath Thirunavukarasu ◽  
Sukumar Kundu ◽  
Tapas Laha ◽  
Deb Roy ◽  
Subrata Chatterjee
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding ◽  
Pure Copper ◽  
Bonding Time ◽  
304 Stainless Steel ◽  
Time Interval ◽  
Reaction Products ◽  
Bonding Pressure ◽  
Ternary Intermetallic Compounds ◽  
Cu Foil

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu–Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu–Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu–Fe–Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu–Fe–Ti-based intermetallics.

Kinetics of carbon monoxide methanation on a Ni/SiO2 catalyst

1990 ◽  
Vol 55 (7) ◽  
pp. 1678-1685
Author(s):  
Vladimír Stuchlý ◽  
Karel Klusáček
Keyword(s):  
Carbon Monoxide ◽  
Reaction Rate ◽  
Catalyst Activity ◽  
Adsorbed Hydrogen ◽  
Reaction Products ◽  
Co Methanation ◽  
Molar Ratios ◽  
Rate Determining Step ◽  
Higher Temperature ◽  
Kinetics Of

Kinetics of CO methanation on a commercial Ni/SiO2 catalyst was evaluated at atmospheric pressure, between 528 and 550 K and for hydrogen to carbon monoxide molar ratios ranging from 3 : 1 to 200 : 1. The effect of reaction products on the reaction rate was also examined. Below 550 K, only methane was selectively formed. Above this temperature, the formation of carbon dioxide was also observed. The experimental data could be described by two modified Langmuir-Hinshelwood kinetic models, based on hydrogenation of surface CO by molecularly or by dissociatively adsorbed hydrogen in the rate-determining step. Water reversibly lowered catalyst activity and its effect was more pronounced at higher temperature.

scholarly journals Amide-Type Substrates in the Synthesis of N-Protected 1-Aminomethylphosphonium Salts

Catalysts ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 552
Author(s):  
Dominika Kozicka ◽  
Paulina Zieleźny ◽  
Karol Erfurt ◽  
Jakub Adamek
Keyword(s):  
Reaction Times ◽  
The Other ◽  
Hydroxyl Group ◽  
Other Hand ◽  
Step Procedure ◽  
Higher Temperature ◽  
Short Time ◽  
Work Up

Herein we describe the development and optimization of a two-step procedure for the synthesis of N-protected 1-aminomethylphosphonium salts from imides, amides, carbamates, or lactams. Our “step-by-step” methodology involves the transformation of amide-type substrates to the corresponding hydroxymethyl derivatives, followed by the substitution of the hydroxyl group with a phosphonium moiety. The first step of the described synthesis was conducted based on well-known protocols for hydroxymethylation with formaldehyde or paraformaldehyde. In turn, the second (substitution) stage required optimization studies. In general, reactions of amide, carbamate, and lactam derivatives occurred at a temperature of 70 °C in a relatively short time (1 h). On the other hand, N-hydroxymethylimides reacted with triarylphosphonium salts at a much higher temperature (135 °C) and over longer reaction times (as much as 30 h). However, the proposed strategy is very efficient, especially when NaBr is used as a catalyst. Moreover, a simple work-up procedure involving only crystallization afforded good to excellent yields (up to 99%).

Immunochemical Studies on Antithrombin III

1979 ◽  
Author(s):  
E.J. McKay
Keyword(s):  
Antithrombin Iii ◽  
The Other ◽  
Antigenic Determinants ◽  
Immunochemical Analysis ◽  
Paradoxical Effect ◽  
Test Protocol ◽  
Agar Gel ◽  
High Affinity ◽  
Time Required ◽  
Antigen Antibody

Depressed Antithrombin III (AT) levels Increase thrombic tendency in man, therefore value in assaying this protein has been established. Immunochemical analysis of AT in clinical disease has however proved controversial, consequently systematic studies were undertaken to rationalize the requirements necessary to optimise these methods in particular electro-Immunoassay. The known binding affinity of AT for heparin has been exploited to differentiate high affinity AT from its inhibitor - protease complexes and has resulted in reports stating that heparin added to the agar gel prior to electrophoresis significantly reduces the time required for completion of antigen/antibody complexes. Our studies however have demonstrated that the antibody required for quantitative analysis must be capable of not only reacting with “native” antigenic determinants of AT but also with “neo” antigens that are exposed when inhibitor-protease complexes are formed. Heparin should not be used in the test protocol, for it has a paradoxical effect on Immunopreclpltation in gels, masking some antigenic determinants of unbound - high affinity AT on one hand, and appear to disrupt the Immunoprecipitin “rocket” formed with the inhibitor-protease complexes during electrophoresis on the other.

NaCl-dependent expression of amiloride-blockable Na+ channel in Xenopus oocytes

1992 ◽  
Vol 262 (2) ◽  
pp. G244-G248 ◽  
Author(s):  
C. Asher ◽  
D. Singer ◽  
R. Eren ◽  
O. Yeger ◽  
N. Dascal ◽  
...  
Keyword(s):  
Xenopus Oocytes ◽  
The Other ◽  
Na Channel ◽  
Channel Activity ◽  
High Affinity ◽  
Other Hand ◽  
Exogenous Rna ◽  
Lower Intestine ◽  
Regulation Of Transport

RNA was isolated from chicken lower intestine (both colon and coprodeum) and injected into Xenopus oocytes. 22Na+ fluxes measured after 1-4 days demonstrated the induction of an amiloride-blockable pathway. The Na+ transporter expressed by the exogenous RNA had a high affinity to amiloride (inhibitory constant less than 0.1 microM), but was insensitive to ethylisopropyl amiloride, i.e., it is likely to be the apical Na+ channel. Functional channels were readily expressed in oocytes injected with RNA derived from chickens fed a low-NaCl diet. On the other hand, no channel activity was detected in oocytes injected with RNA isolated from chickens fed a high-NaCl diet. Thus the previously reported regulation of transport by the dietary NaCl intake involves modulations in the level of mRNA that codes either for the Na+ channel or a posttranscriptional regulator of the channel.

Interfacial behavior in the brazing of silicon nitride joint using a Nb-foil interlayer

2013 ◽  
Vol 213 (3) ◽  
pp. 411-417 ◽  
Author(s):  
L. Ceja-Cárdenas ◽  
J. Lemus-Ruíz ◽  
S. Díaz-de la Torre ◽  
R. Escalona-González
Keyword(s):  
Silicon Nitride ◽  
Interfacial Behavior ◽  
Foil Interlayer

Diffusion bonding of zirconia to silicon nitride using nickel interlayers

1998 ◽  
Vol 33 (18) ◽  
pp. 4525-4530 ◽  
Author(s):  
R. H. VEGTER ◽  
R. H. VEGTER
Keyword(s):  
Silicon Nitride ◽  
Diffusion Bonding

Newly Developed Heat Resistant Magnesium Alloy by Thixomolding®

2005 ◽  
Vol 488-489 ◽  
pp. 287-290 ◽  
Author(s):  
Tadayoshi Tsukeda ◽  
Ken Saito ◽  
Mayumi Suzuki ◽  
Junichi Koike ◽  
Kouichi Maruyama
Keyword(s):  
Aluminum Alloy ◽  
Magnesium Alloy ◽  
Magnesium Alloys ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Die Casting ◽  
The Other ◽  
Heat Resistant ◽  
Higher Temperature ◽  
Better Than

We compared the newly developed heat resistant magnesium alloy with conventional ones by Thixomolding® and aluminum alloy by die casting. Tensile properties at elevated temperatures of AXEJ6310 were equal to those of ADC12. In particular, elongation tendency of AXEJ6310 at higher temperature was better than those of the other alloys. Creep resistance of AXEJ6310 was larger than that of AE42 by almost 3 orders and smaller than that of ADC12 by almost 2 orders of magnitude. Fatigue limits at room temperature and 423K of AXEJ6310 was superior among conventional magnesium alloys.

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