Reliability Tests of Au-Metallized Ni-Based Ohmic Contacts to 4H-n-SiC with and without Nanocomposite Diffusion Barriers

2010 ◽  
Vol 645-648 ◽  
pp. 737-740 ◽  
Author(s):  
Andrian V. Kuchuk ◽  
M. Guziewicz ◽  
Renata Ratajczak ◽  
Marek Wzorek ◽  
V.P. Kladko ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Diffusion Barriers ◽  
Oxygen Penetration ◽  
Long Time ◽  
Small Change ◽  
The Stability ◽  
Reaction Processes ◽  
Aging In Air

The reliability of Ni2Si/n-SiC ohmic contacts with Au overlayer either without or with Ta-Si-N diffusion barrier was investigated after long-time aging in air at 400oC and rapid thermal annealing in Ar up to 800oC. It is shown that aging of the Au/Ni2Si/n-SiC contacts in air at 400oC resulted in complete degradation due to both oxygen penetration and interdiffusion/reaction processes. In contrast, only a small change in properties was detected on the contacts annealed in Ar at 800°C. The stability of both electrical and structural properties of Au/TaSiN/Ni2Si/n-SiC thermally stressed contacts at different conditions points out their superior thermal stability.

Solid-Phase Ohmic Contacts to GaAs with TiN Diffusion Barriers

1984 ◽  
Vol 37 ◽  
Author(s):  
H. P. Kattelus ◽  
J. L. Tandon ◽  
A. H. Hamdi ◽  
M-A. Nicolet
Keyword(s):  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Solid Phase ◽  
Diffusion Barriers ◽  
Thermally Stable ◽  
Ohmic Behavior ◽  
Tin Film ◽  
The Stability ◽  
P Type

AbstractWe report on contacts to p-type GaAs formed by a GaAs/Pt/TiN/Ag system. Ohmic behavior in this system is believed to be accomplished by the solidstate reaction of Pt with GaAs. This reaction is confined by the TiN film which is thermally stable. In addition, the TiN film acts as an excellent diffusion barrier in preventing the intermixing of the top Ag layer with GaAs or Pt. Contacts formed with such controlled reaction have important implications for the stability of shallow p-n junction devices.

Improved Ohmic Contacts to n-Type GaAs, Using Oiboride Diffusion Barriers

1985 ◽  
Vol 54 ◽  
Author(s):  
Joel R. Shappirio ◽  
Robert A. Lux ◽  
John J. Finnegan ◽  
Donald C. Fox ◽  
Joseph H. Kwiatkowski
Keyword(s):  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Diffusion Barriers ◽  
Specific Contact ◽  
Contact Resistivities

ABSTRACTOhmic contacts employing Au/Metal/Au/Ge/Ni (Metal=Ni or. TiB2) to n-type GaAs have been investigated. Alloying of the contacts, performed by both optical (rapid thermal) and strip heater methods, resulted in very low specific contact resistivities for the samples employing the TiB2 diffusion barrier. Such contacts are shown to be stable on aging at 350C for 180 hours.

The formation and thermal stability of multilayer ohmic contacts to n-GaAs with TiBx and Mo diffusion barriers

2000 ◽  
Vol 45 (11) ◽  
pp. 1452-1456
Author(s):  
V. V. Milenin ◽  
R. V. Konakova ◽  
V. N. Ivanov ◽  
G. V. Beketov ◽  
V. I. Poludin ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ohmic Contacts ◽  
Diffusion Barriers ◽  
Thermal Stability Of

Long-Time Thermal Stability Comparison of Alloyed and Non-Alloyed Ohmic Contacts for InP-Based HEMTs

2017 ◽  
Vol 214 (11) ◽  
pp. 1700411 ◽  
Author(s):  
Yinghui Zhong ◽  
Wenbin Wang ◽  
Shuxiang Sun ◽  
Peng Ding ◽  
Zhi Jin
Keyword(s):  
Thermal Stability ◽  
Ohmic Contacts ◽  
Long Time

Diffusion barriers for CeFe4Sb12/Cu thermoelectric devices

2013 ◽  
Vol 1490 ◽  
pp. 197-202 ◽  
Author(s):  
Laetitia Boulat ◽  
Romain Viennois ◽  
Didier Ravot ◽  
Nicole Fréty
Keyword(s):  
Thermal Stability ◽  
Thermoelectric Material ◽  
Diffusion Barrier ◽  
Copper Electrode ◽  
Diffusion Barriers ◽  
Tantalum Nitride ◽  
Thermoelectric Devices ◽  
Microstructural Study ◽  
Copper Material ◽  
Thermal Stability Of

ABSTRACTThe efficiency of a tantalum nitride interlayer as a diffusion barrier for CeFe4Sb12 thermoelectric material against electrode copper material has been investigated. The thermal stability of CeFe4Sb12/TaN/Cu stackings has been investigated after annealing at 600°C from a microstructural study. CeFe4Sb12 and Cu appear to chemically react through the formation of CeCu2 and Cu2Sb phases whereas no reaction is observed for CeFe4Sb12 with TaN. This study showed that the TaN interlayer cannot inhibit the diffusion of Sb from the skutterudite substrate to the copper electrode but prevents the diffusion of Ce and consequently the formation of the CeCu2 phase.

Ohmic Contact to n-GaN with TiN Diffusion Barrier

1996 ◽  
Vol 449 ◽  
Author(s):  
E. Kamińska ◽  
A. Piotrowska ◽  
M. Guziewicz ◽  
S. Kasjaniuk ◽  
A. Barcz ◽  
...  
Keyword(s):  
Phase Transformation ◽  
Ohmic Contact ◽  
Diffusion Barrier ◽  
Ohmic Contacts ◽  
Diffusion Barriers ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
Thermally Induced ◽  
X Ray ◽  
Tin Diffusion Barrier

ABSTRACTThe formation of n-GaN/Ti ohmic contacts with TiN diffusion barriers has been investigated by electrical measurements, x-ray diffraction and SIMS. It has been shown that the onset of the ohmic behaviour is associated with the thermally induced phase transformation of Ti into TiN at the GaN/Ti interface. It is suggested that the process is accompanied by an increase in the doping level in the semiconductor subcontact region. The presence of a TiN barrier is found to inhibit excessive decomposition of GaN and to confine the reaction between n-GaN and Ti.

Thermal Stability of Nitride-Based Diffusion Barriers for Ohmic Contacts to n-GaN

2007 ◽  
Vol 36 (12) ◽  
pp. 1662-1668 ◽  
Author(s):  
L.F. Voss ◽  
L. Stafford ◽  
R. Khanna ◽  
B.P. Gila ◽  
C.R. Abernathy ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ohmic Contacts ◽  
Diffusion Barriers ◽  
Thermal Stability Of

Sustainability and adaptability of regional development in the conditions of digitalization

2020 ◽  
Vol 19 (9) ◽  
pp. 1550-1613
Author(s):  
O.E. Akimova ◽  
S.K. Volkov ◽  
E.A. Gladkaya ◽  
I.M. Kuzlaeva
Keyword(s):  
Sustainable Development ◽  
Regional Development ◽  
Economic Behavior ◽  
Regional Inequality ◽  
Environmental Damage ◽  
Economic Potential ◽  
Human Welfare ◽  
Long Time ◽  
The Stability ◽  
Smart Technologies

Subject. The article discusses the sustainability of regional economy development, its definition, and the substance of sustainable development. Objectives. We aim at performing a comprehensive analysis of indicators of sustainability and adaptability of regional development in the context of digitalization, formulating a strategy for economic behavior that takes into account the multidimensional nature of regional inequality and is focused on boosting the economic potential of regions. Methods. The study draws on dialectic and systems approaches, general scientific methods of retrospective, situational, economic and statistical, and comparative analysis. Results. The sustainability of the region focuses on improving the human welfare over long time horizon. This happens in three areas, i.e. maximizing the efficiency of resource use; ensuring justice and democracy; minimizing resource consumption and environmental damage. The stability of the region can be assessed by using one parameter, or by combining the parameters in accordance with the type of region and expected results. Conclusions. The adaptation of a region to changing conditions depends on its type (‘adapted’, ‘adaptive’, and ‘non-adapted’). Regional inequality has two main components: difference in economic potential and social satisfaction of residents. Another component, affecting the stability and adaptability of regions, is the level of their digitalization. However, some regions have only formally embarked on the path of digitalization. Moreover, a focus on smart technologies, solutions and digitalization often leads to ignoring the goals of sustainable development. Smart technologies should be aimed at ensuring sustainability within the framework of the smart sustainable city concept.

scholarly journals Seawater Absorption and Adhesion Properties of Hydrophobic and Superhydrophobic Thermoset Epoxy Nanocomposite Coatings

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 272
Author(s):  
Ayman M. Atta ◽  
Mohamed H. El-Newehy ◽  
Meera Moydeen Abdulhameed ◽  
Mohamed H. Wahby ◽  
Ahmed I. Hashem
Keyword(s):  
Thermal Stability ◽  
Oleic Acid ◽  
Salt Spray ◽  
Adhesion Properties ◽  
In Situ Modification ◽  
Long Time ◽  
Seawater Environment ◽  
Thermoset Epoxy ◽  
The Cost

The enhancement of both thermal and mechanical properties of epoxy materials using nanomaterials becomes a target in coating of the steel to protect it from aggressive environmental conditions for a long time, with reducing the cost. In this respect, the adhesion properties of the epoxy with the steel surfaces, and its proper superhyrophobicity to repel the seawater humidity, can be optimized via addition of green nanoparticles (NPs). In-situ modification of silver (Ag) and calcium carbonate (CaCO3) NPs with oleic acid (OA) was carried out during the formation of Ag−OA and CaCO3−OA, respectively. The epoxide oleic acid (EOA) was also used as capping for Ca−O3 NPs by in-situ method and epoxidation of Ag−OA NPs, too. The morphology, thermal stability, and the diameters of NPs, as well as their dispersion in organic solvent, were investigated. The effects of the prepared NPs on the exothermic curing of the epoxy resins in the presence of polyamines, flexibility or rigidity of epoxy coatings, wettability, and coatings durability in aggressive seawater environment were studied. The obtained results confirmed that the proper superhyrophobicity, coating adhesion, and thermal stability of the epoxy were improved after exposure to salt spray fog for 2000 h at 36 °C.

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