XPS Analysis of Oxide Films on Lead-Free Solders with Trace Additions of Germanium and Gallium

2016 ◽  
Vol 857 ◽  
pp. 63-67 ◽  
Author(s):  
K.M. Watling ◽  
A. Chandler-Temple ◽  
Kazuhiro Nogita
Keyword(s):  
Oxidation Resistance ◽  
Sessile Drop ◽  
Depth Profiling ◽  
Sample Surface ◽  
Lead Free ◽  
Slow Heating ◽  
Purple Colour ◽  
Heating And Cooling ◽  
Parent Alloy ◽  
Free Solder

A sessile drop experiment involving slow heating and cooling of lead-free solder alloys under inert gas revealed segregation of trace elements to the sample surface. Addition of germanium or gallium to Sn-0.7Cu-0.05Ni alloys promoted a metallic lustre in samples, in contrast with the blue/purple colour of the parent alloy. Alloys with Ge or Ga additions showed oxidation resistance. Depth profiling of surfaces of sample alloys with Ge or Ga showed a significant concentration of these elements within the oxide film, which may be responsible for oxidation resistance of these alloys.

Melting behavior and oxidation resistance of Ce–Sn alloy designed for lead-free solder manufacturing

2016 ◽  
Vol 125 (3) ◽  
pp. 1009-1015 ◽  
Author(s):  
Marian Drienovsky ◽  
Lydia Rizekova Trnkova ◽  
Milan Ozvold ◽  
Ivona Cernickova ◽  
Marian Palcut ◽  
...  
Keyword(s):  
Oxidation Resistance ◽  
Melting Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

2016 ◽  
Vol 57 (10) ◽  
pp. 1685-1690
Author(s):  
Qing-meng Wang ◽  
Gui-sheng Gan ◽  
Yunfei Du ◽  
Donghua Yang ◽  
Guoqi Meng ◽  
...  
Keyword(s):  
High Temperature ◽  
Oxidation Resistance ◽  
High Temperature Oxidation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Oxidation ◽  
Free Solder

Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

2016 ◽  
Vol 28 (2) ◽  
pp. 93-100 ◽  
Author(s):  
Amir Hossein Nobari ◽  
Mehran Maalekian ◽  
Karl Seelig ◽  
Mihriban Pekguleryuz
Keyword(s):  
Contact Angle ◽  
Sessile Drop ◽  
Drop Test ◽  
Lead Free ◽  
Scanning Calorimetry ◽  
Balance Test ◽  
Content Type ◽  
Wetting Behavior ◽  
Free Solder ◽  
Wetting Balance Test

Purpose The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge. Design/methodology/approach The melting characteristic of the lead-free alloys was studied using differential scanning calorimetry. Wettability was examined using wetting balance test for two liquid fluxes, water based and alcohol based in two temperatures 265°C and 277°C. Also, contact angle was measured using sessile drop test. Findings It is shown that 0.2 wt.% Sb reduces the melting temperature and pasty range. Moreover, the addition of 0.2 wt.% Sb improves wetting behavior for alcohol-based flux. It is also demonstrated that the effect of Sb on meniscus height in wetting balance test and contact angle in sessile drop test follows the trend of wetting performance. Originality/value It is found that adding 0.2 wt.% Sb improves the wettability of Ni-Ge micro-alloyed Sn-Cu solder; however, higher concentration of Sb does not benefit the alloy.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy

2013 ◽  
Vol 785-786 ◽  
pp. 63-66
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Corrosion Resistance ◽  
Oxidation Resistance ◽  
Solder Alloy ◽  
Corrosion Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
P Content ◽  
Free Solder ◽  
P Addition ◽  
Oxidation And Corrosion

The oxidation and corrosion behavior of Sn-9Zn-1Bi lead-free solder alloys with different P content were investigated by weighing the mass of the alloy, as well as the effects of P on the microstructure. The results indicate that the oxidation resistance and the corrosion resistance of Sn-9Zn-1Bi solder alloy can be enhanced significantly with the increase of P content. The microstructure observations show that P addition into Sn-9Zn-1Bi solder alloy can refine the microstructure and the numbers of dark rod-like Zn-rich phases are decreased with increasing of P addition.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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