Selective SiGe Etching Formed by Localized Ge Implantation on SOI

2005 ◽  
Vol 108-109 ◽  
pp. 439-444
Author(s):  
Helene Bourdon ◽  
Claire Fenouillet-Béranger ◽  
Claire Gallon ◽  
Philippe Coronel ◽  
Damien Lenoble

The fully depleted SOI devices present lateral isolation issues due to the shallow trench isolation (STI) process. We propose in this paper to study a new fabrication process for integrating local isolation trenches. Germanium (Ge) implantation is used to create SiGe (Silicon-Germanium) layer on thin SOI (silicon on insulator) that can be selectively etched. The advantage is the capability of implantation to localize the SiGe area on this substrate and to avoid STI process issues. Aggressive dimensions and geometries are studied and resulting material transformation (crystallization and Ge diffusion) are apprehending via SEM (Secondary Electron Microscopy) or AFM (Atomic Force Spectroscopy) to understand the etching kinetics. After optimization, we demonstrate the capability of fabricating localized trenches on SOI without degrading the neighboring Si layer or consuming the thin BOX (buried oxide).

2004 ◽  
Vol 815 ◽  
Author(s):  
S. Rao ◽  
S.E. Saddow ◽  
F. Bergamini ◽  
R. Nipoti ◽  
Y. Emirov ◽  
...  

AbstractHigh-dose Al implants in n-type epitaxial layers have been successfully annealed at 1600°C without any evidence of step bunching. Anneals were conducted in a silane ambient and at a process pressure of 150 Torr. Silane, 3% premixed in 97% UHP Ar, was further diluted in a 6 slm Ar carrier gas and introduced into a CVD reactor where the sample was heated via RF induction. A 30 minute anneal was performed followed by a purge in Ar at which time the RF power was switched off. The samples were then studied via plan-view secondary electron microscopy (SEM) and atomic force microscopy (AFM). The resulting surface morphology was step- free and flat.


2011 ◽  
Vol 20 (04) ◽  
pp. 509-523 ◽  
Author(s):  
SHAIMAA MAHDI ◽  
MORITZ GREHN ◽  
AWS AL-SAADI ◽  
MICHAEL HÖFNER ◽  
STEFAN MEISTER ◽  
...  

Optical facet preparation of silicon-on-insulator (SOI) waveguides was done by polishing after saw dicing or cleaving after two different techniques of scoring by a mechanical saw and fs-laser. Cleaving after fs-laser scoring leads to smooth facet surface of air covered SOI waveguides; polishing after dicing is more efficient with SiO2covered waveguides. The prepared end facets were investigated using an atomic force microscope (AFM) and scanning electron microscopy (SEM). The SOI waveguides were characterized by optical transmission of telecommunication wavelength (1.5 μm).


2004 ◽  
Vol 838 ◽  
Author(s):  
Yordan Stefanov ◽  
Tino Ruland ◽  
Udo Schwalke

ABSTRACTThis article proposes a new application of tunneling current measurements Atomic Force Microscopy (AFM) for evaluation of silicon nitride stop-layer erosion in Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP). Simultaneous topographical and electrical AFM measurements allow a clear identification of ‘open’ silicon surfaces on nanometer scale by enhanced tunneling currents in those areas. The measurement technique is non-destructive and can be successfully implemented for process control.


2013 ◽  
Vol 22 (01) ◽  
pp. 1350001
Author(s):  
FRANCISCO GÁMIZ ◽  
CARLOS SAMPEDRO ◽  
LUCA DONETTI ◽  
ANDRES GODOY

State-of-the-Art devices are approaching to the performance limit of traditional MOSFET as the critical dimensions are shrunk. Ultrathin fully depleted Silicon-on-Insulator transistors and multi-gate devices based on SOI technology are the best candidates to become a standard solution to overcome the problems arising from such aggressive scaling. Moreover, the flexibility of SOI wafers and processes allows the use of different channel materials, substrate orientations and layer thicknesses to enhance the performance of CMOS circuits. From the point of view of simulation, these devices pose a significant challenge. Simulations tools have to include quantum effects in the whole structure to correctly describe the behavior of these devices. The Multi-Subband Monte Carlo (MSB-MC) approach constitutes today's most accurate method for the study of nanodevices with important applications to SOI devices. After reviewing the main basis of MSB-MC method, we have applied it to answer important questions which remain open regarding ultimate SOI devices. In the first part of the chapter we present a thorough study of the impact of different Buried OXide (BOX) configurations on the scaling of extremely thin fully depleted SOI devices using a Multi-Subband Ensemble Monte Carlo simulator (MS-EMC). Standard thick BOX, ultra thin BOX (UTBOX) and UTBOX with ground plane (UTBOX+GP) solutions have been considered in order to check their influence on short channel effects (SCEs). The simulations show that the main limiting factor for downscaling is the DIBL and the UTBOX+GP configuration is the only valid one to downscale SGSOI transistors beyond 20 nm channel length keeping the silicon slab thickness above the theoretical limit of 5 nm, where thickness variability and mobility reduction would play an important role. In the second part, we have used the multisubband Ensemble Monte Carlo simulator to study the electron transport in ultrashort DGSOI devices with different confinement and transport directions. Our simulation results show that transport effective mass, and subband redistribution are the main factors that affect drift and scattering processes and, therefore, the general performance of DGSOI devices when orientation is changed


2008 ◽  
Vol 23 (1) ◽  
pp. 49-54 ◽  
Author(s):  
Ye-Hwan Kim ◽  
Seung-Mi Lee ◽  
Kee-June Lee ◽  
Ungyu Paik ◽  
Jea-Gun Park

The effect of changes in poly(acrylic acid) (PAA) conformation on removal of Si3N4 film was investigated. PAA was used as a passivation agent by adsorption on an Si3N4 film in shallow-trench isolation chemical–mechanical planarization (STI CMP). Adsorption behavior of PAA on the Si3N4 film and the conformation transition were determined by adsorption isotherms and force measurements using atomic force microscopy (AFM) as a function of ionic strength. AFM results revealed that, as ionic strength increases, the repulsive force between the negatively charged carboxylate groups along the backbone of PAA is reduced due to counterion screening and to the changes of PAA conformation from a stretched to a coiled configuration. At high ionic strength, the coiled conformation of PAA formed a dense passivation layer on the Si3N4 film, which led to suppression of the removal rate of Si3N4 film from 72 to 61 Å/min in the STI CMP process.


2018 ◽  
Vol 10 (4) ◽  
pp. 24-33 ◽  
Author(s):  
Bich-Yen Nguyen ◽  
Philippe Flatresse ◽  
Jamie Schaeffer ◽  
Franck Arnaud ◽  
Souhir Mhira ◽  
...  

2010 ◽  
Vol 31 (10) ◽  
pp. 1074-1076 ◽  
Author(s):  
Sophie Baudot ◽  
Francois Andrieu ◽  
Olivier Weber ◽  
Pierre Perreau ◽  
Jean-François Damlencourt ◽  
...  

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