Study on Characterization of Cationic Polyelectrolyte Modified Benzoguanamine Formaldehyde/Silica Composite Abrasives Slurry

2011 ◽  
Vol 175 ◽  
pp. 254-258
Author(s):  
Xue Feng Xu ◽  
Bin Shan Zhao ◽  
Yu Zhi Yang ◽  
Quan Guo ◽  
Wei Peng
Keyword(s):  
Zeta Potential ◽  
Adsorption Capacity ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cationic Polyelectrolyte ◽  
Experimental Results ◽  
Maximum Value ◽  
New Type

In this paper, the adsorption characteristics of cationic polyelectrolyte PDADMAC on BGF particles and the Zeta potential of BGF particles have been investigated. A new type of composite abrasives slurry was obtained with cationic polyelectrolyte modified BGF particles and its polishing performance was studied. Experimental results showed that the Zeta potential of the modified BGF particles was changed from negative to positive and the maximum value (+35mv) was obtained when the adsorption saturation was achieved, and the adsorption capacity of SiO2 abrasives on BGF particles was improved significantly. The material removal rate was 469nm/min with the modified BGF/SiO2 composite abrasives slurry containing 5% SiO2 and 3% modified BGF particles, increasing by 47% and 89% than those of the unmodified BGF/SiO2 composite abrasives slurry (319nm/min) and the single silica abrasives slurry (248nm/min), respectively.

Preparation and its Silica Wafer CMP Performance of Cationic Polyelectrolyte Modified Benzoguanamine Formaldehyde/SiO2 Composite Abrasives Slurry

2011 ◽  
Vol 189-193 ◽  
pp. 4158-4162
Author(s):  
Xue Feng Xu ◽  
Bin Shan Zhao ◽  
Yu Zhi Yang ◽  
Quan Guo ◽  
Wei Peng
Keyword(s):  
Zeta Potential ◽  
Adsorption Capacity ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cationic Polyelectrolyte ◽  
Experimental Results ◽  
Adsorption Characteristics ◽  
Maximum Value ◽  
New Type

In this paper, the adsorption characteristics of cationic polyelectrolyte PDADMAC on BGF particles and Zeta potential of BGF particles have been investigated. A new type of composite abrasive slurry was obtained with cationic polyelectrolyte modified BGF particles and its polishing performance was studied. Experimental results showed that the Zeta potential of the modified BGF particles was changed from negative to positive and the maximum value (+35mv) was obtained when the adsorption saturation was achieved, and the adsorption capacity of SiO2 abrasives on BGF particles was improved significantly as well. The material removal rate was 469nm/min with the modified BGF/ SiO2 composite abrasives slurry containing 5% SiO2 and 3% modified BGF particles, increasing by 47% and 89% than those of the unmodified BGF/SiO2 composite abrasives slurry (319nm/min) and the single silica abrasives slurry (248nm/min), respectively.

Material Removal Model and Experimental Verification for Abrasive Jet Precision Finishing with Wheel as Restraint

2006 ◽  
Vol 304-305 ◽  
pp. 555-559 ◽  
Author(s):  
Chang He Li ◽  
Guang Qi Cai ◽  
Shi Chao Xiu ◽  
Q. Li
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Grinding Wheel ◽  
Rate Model ◽  
Material Removal Model ◽  
Material Removal Rate Model ◽  
Three Body ◽  
Precision Finishing

The material removal rate (MRR) model was investigated in abrasive jet precision finishing (AJPF) with wheel as restraint. When abrasive wore and workpiece surface micro-protrusion removed, the size ratio for characteristic particle size to minimum film thickness gradually diminishing, the abrasive machining from two-body lapping to three-body polishing transition in AJPF with grinding wheel as restraint. In the study, the material removal rate model was established according to machining mechanisms and machining modes from two-body to three-body process transition condition, and active number of particles in grinding zone were calculated and simulated. Experiments were performed in the plane grinder for material removal mechanism and academic models verification. It can be observed from experimental results that the surface morphology change dramatically to a grooved or micro-machined surface with all the grooves aligned in the sliding direction in two-body lapping mode. On the other hand, the surface is very different, consists of a random machining pits with very little sign of any directionality to the deformation in the three-body machining mode. Furthermore, the material removal rate model was found to give a good description of the experimental results.

Research on CMP Characteristics Attribute to Groove Size

2011 ◽  
Vol 189-193 ◽  
pp. 4112-4115 ◽  
Author(s):  
Yong Chang Guo ◽  
Young Kyun Lee ◽  
Hyun Seop Lee ◽  
Hae Do Jeong
Keyword(s):  
Size Effect ◽  
Friction Force ◽  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Experimental Results ◽  
Groove Width ◽  
Significant Difference

Groove pads are used quite widely in chemical mechanical polishing (CMP), and groove size plays an important role in CMP characteristics. This study focuses on the investigation of the groove size effect using X-Y groove pads which are different with pitch and width. The first experiment shows the size effect on the polishing characteristics including material removal rate (MRR), within wafer non-uniformity (WIWNU) on 4 inch oxide blanket wafers for 60 seconds. The second experiment verifies the reason why MRR and WIWNU are different, by the calculation of slurry duration time (SDT) resulting from the change of friction force. All experimental results indicated that a significant difference of slurry flow attributed to groove width and pitch has an impressive influence on friction force, finally the MRR and WIWNU are affected by the groove size.

Finite Element Modeling for Analyzing Material Removal Rate in ECDM Process

2020 ◽  
Vol 19 (04) ◽  
pp. 815-835 ◽  
Author(s):  
Viveksheel Rajput ◽  
Mudimallana Goud ◽  
Narendra Mohan Suri
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Material Removal Rate ◽  
Thermal Model ◽  
Material Removal ◽  
Removal Rate ◽  
Experimental Results ◽  
Temperature Fields ◽  
Work Material ◽  
Transient Thermal

Electrochemical discharge machining (ECDM) has been developed as a hybrid and robust technology for machining non-conductive work material at a preferable removal rate. ECDM exhibits various applications in the micro-machining of these materials like nuclear, automotive, medical industries, etc. Due to some peculiar properties of nonconductive materials, for example, glass transparency, their utilization in MEMS applications are also very numerous. In the ECDM process, removal of material takes place primarily due to high-temperature thermal erosion and secondarily due to electrolyte chemical etching action. Many rigorous experimental studies have reported in the empirical estimation of the material removal rate (MRR) in the ECDM process. However, very few studies have reported in the modeling of the ECDM process for predicting material removal rate through single spark simulation. The present paper attempts to develop a transient thermal model based upon finite element modeling (FEM) to simulate a single spark in the ECDM process for obtaining temperature fields in the work material. The obtained temperature fields are further post-processed to predict the material removal rate. FEM results are compared with the previous simulated and experimental results to confirm the approach. Moreover, an experimental study is also performed to validate the developed thermal model and it was found to be in an acceptable range of the experimental results. Further, a parametric study revealed that MRR increases with the increase in applied voltage and electrolyte concentration during soda-lime glass machining with ECDM. The developed FEM-based transient thermal model can be successfully utilized for predicting the removal rate of nonconductive work material.

Modeling of High Efficiency Removal in the Grinding of Aluminal/ZrO2 Nanocomposites with the Aid of Two-Dimensional Ultrasonic Vibration

2007 ◽  
Vol 329 ◽  
pp. 451-458 ◽  
Author(s):  
Yan Wu ◽  
A.G. Sun ◽  
Bo Zhao ◽  
Xun Sheng Zhu
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Experimental Results ◽  
Two Dimensional ◽  
Conventional Grinding ◽  
Vibration Assistance

Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional ultrasonic vibration grinding (WTDUVG), the theoretical model representing the material removal rate are deduced and verified, and the reason of high efficiency material removal by applying two-dimensional ultrasonic vibration is analyzed. Finally, experimental researches on material removal rate of ceramics were carried out using coarse grit diamond wheel both with and without workpiece two-dimensional ultrasonic vibration assistance grinding. Experimental results indicated that (1) Material removal rate (MRR) in vibration grinding process is about 1.5 times as large as that of in conventional grinding, the experimental results are in good agreement with the calculated ones. (2)The material removal rate increases along with increases of the grinding depth and workpiece velocity both in with and without vibration grinding. (3)The vibration grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of WTDUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile regime grinding.

Anisotropic Lapping of Single Crystal Sapphire

2010 ◽  
Vol 102-104 ◽  
pp. 502-505
Author(s):  
Ping Zhou ◽  
Peng Fei Gao ◽  
Wei Fang Wang ◽  
Dong Hui Wen
Keyword(s):  
Fracture Toughness ◽  
Surface Roughness ◽  
Elastic Modulus ◽  
Single Crystal ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Orientation ◽  
Experimental Results ◽  
Single Crystal Sapphire

Lapping processes of single crystal sapphire are investigated in relation to crystallo- graphic orientation, the influence of the crystal anisotropism under different lapping liquid concentration, loading forces on materials removal rate and roughness in sapphire lapping is discussed. C-plane(0001),M-plane ( ),R-plane ( ),A-plane ( ) sapphire wafers were used for lapping experiments, experimental results show that Surface roughness is depend on the fracture toughness, surface orientation with higher fracture toughness such as C-plane would get better roughness during lapping, material removal rate of R-plane is the lowest in four planes, it is for elastic modulus and fracture toughness of R-plane are less than other three planes.

Multi-objective optimization using the genetic algorithms for external cylindrical grinding process of 9CrSi alloy

2020 ◽  
Vol 34 (22n24) ◽  
pp. 2040161
Author(s):  
Tuan-Linh Nguyen ◽  
Nhu-Tung Nguyen ◽  
Long Hoang
Keyword(s):  
Surface Roughness ◽  
Genetic Algorithms ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cylindrical Grinding ◽  
Maximum Value ◽  
Grinding Conditions ◽  
Optimal Values ◽  
External Cylindrical Grinding

In this study, by performing the experimental research, the surface roughness, cutting force and vibration were modeled. The Genetic Algorithms (GAs) were applied to determine the optimal values of external cylindrical grinding conditions to achieve the minimum value of surface roughness and the maximum value of the material removal rate. The optimum values of surface roughness and material removal rate are 0.490 [Formula: see text]m and 3.974 mm2/s, respectively, that were obtained at a feed rate of 0.3 m/min, at a workpiece speed of 164.82 rpm, at a cutting depth of 0.015 mm, and a workpiece Rockwell hardness of 56.32 HRC. The optimal values were successfully verified by experimental results with very promising results.

Study on High-Speed WEDM in Gas

2006 ◽  
Vol 315-316 ◽  
pp. 136-139 ◽  
Author(s):  
Tong Wang ◽  
Xin Fu Zhang
Keyword(s):  
Material Removal Rate ◽  
Electrical Discharge ◽  
Material Removal ◽  
High Speed ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Experimental Results ◽  
Processing Quality

This paper investigates the influence on finish high-speed Wire-cut Electrical Discharge Machining (WEDM) in atmosphere and emulsion liquid. Experimental results have shown that WEDM in atmosphere offers a series of advantages such as better straightness accuracy and higher removal rate (material removal rate). It was also found that the removal rate increased significantly at a higher wire winding speed, with the straightness got worse at the meanwhile both in atmosphere and emulsion liquid. Considering its better processing quality and higher removal rate, the high-speed WEDM in gas possesses broad prospects for its application.

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

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