W-B-C Nanostructured Layers - Microstructure and Mechanical Properties

2016 ◽  
Vol 258 ◽  
pp. 416-419 ◽  
Author(s):  
Jiří Buršík ◽  
Ivo Kuběna ◽  
Vilma Buršíková ◽  
Pavel Souček ◽  
Lukáš Zábranský ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Cross Sections ◽  
Fracture Resistance ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Thin Layers ◽  
Indentation Hardness ◽  
Berkovich Indenter ◽  
Transmission Electron ◽  
Nanostructured Layers

Several W-B-C layers were prepared by magnetron sputtering. The microstructure of thin layers was observed by means of scanning and transmission electron microscopy on cross sections prepared using a focused ion beam. Both undisturbed layers and the volume under indentation prints were inspected. The W-B-C layers are fine nanostructured materials about 2 μm thick and indents with loads up to 1 N do not cause any visible defects (cracks, delamination etc). The results were correlated with mechanical properties characterized by means of nanoindentation experiments in both the static and the dynamic loading regime using a Berkovich indenter. Elastic modulus, indentation hardness and fracture resistance of prepared nanostructured coatings were evaluated and discussed.

Mo-B-C and Ta-B-C Nanostructured Layers with Promising Fracture Toughness

2016 ◽  
Vol 368 ◽  
pp. 107-110 ◽  
Author(s):  
Jiří Buršík ◽  
Ivo Kuběna ◽  
Vilma Buršíková ◽  
Pavel Souček ◽  
Lukáš Zábranský ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Transmission Electron Microscopy ◽  
Cross Sections ◽  
Fracture Resistance ◽  
Ion Beam ◽  
Transmission Electron ◽  
Focussed Ion Beam ◽  
Nanostructured Layers

X-B-C (X=Mo, Ta) layers prepared by magnetron sputtering were tested. Mechanical properties were characterized by means of nanoindentation experiments in both the static and the dynamic loading regime. The results were correlated with observations of the microstructure under indentation prints by means of scanning and transmission electron microscopy on cross sections prepared using a focussed ion beam. An excellent fracture resistance of prepared nanostructured coatings was found.

Metallic Nanoneedles Arrays for TEM Sample Preparation “Lift-Out”

2012 ◽  
Author(s):  
Romaneh Jalilian ◽  
David Mudd ◽  
Neil Torrez ◽  
Jose Rivera ◽  
Mehdi M. Yazdanpanah ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Electron Microscope ◽  
Sample Preparation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Beam System ◽  
Transmission Electron ◽  
Nanoneedle Array ◽  
Superior Mechanical Properties ◽  
And Performance

Abstract The sample preparation for transmission electron microscope can be done using a method known as "lift-out". This paper demonstrates a method of using a silver-gallium nanoneedle array for a quicker sharpening process of tungsten probes with better sample viewing, covering the fabrication steps and performance of needle-tipped probes for lift-out process. First, an array of high aspect ratio silver-gallium nanoneedles was fabricated and coated to improve their conductivity and strength. Then, the nanoneedles were welded to a regular tungsten probe in the focused ion beam system at the desired angle, and used as a sharp probe for lift-out. The paper demonstrates the superior mechanical properties of crystalline silver-gallium metallic nanoneedles. Finally, a weldless lift-out process is described whereby a nano-fork gripper was fabricated by attaching two nanoneedles to a tungsten probe.

Characterization of the mechanical behavior of wear surfaces on single crystal nickel by nanomechanical techniques

2009 ◽  
Vol 24 (3) ◽  
pp. 844-852 ◽  
Author(s):  
M.J. Cordill ◽  
N.R. Moody ◽  
S.V. Prasad ◽  
J.R. Michael ◽  
W.W. Gerberich
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Mechanical Behavior ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Surface Deformation ◽  
Ion Beam ◽  
Test Methods ◽  
Strong Increase ◽  
Number Of Cycles

In ductile metals, sliding contact induces plastic deformation resulting in subsurfaces, the mechanical properties of which are different from those of the bulk. This article describes a novel combination of nanomechanical test methods and analysis techniques to evaluate the mechanical behavior of the subsurfaces generated underneath a wear surface. In this methodology, nanoscratch techniques were first used to generate wear patterns as a function of load and number of cycles using a Hysitron TriboIndenter. Measurements were made on a (001) single crystal plane along two crystallographic directions, <001> and <011>. Nanoindentation was then used to measure mechanical properties in each wear pattern. The results on the (001) single crystal nickel plane showed that there was a strong increase in hardness with increasing applied load that was accompanied by a change in surface deformation. The amount of deformation underneath the wear patterns was examined from focused ion beam cross-sections of the wear patterns.

Characterization of size, aspect ratio and degree of dispersion of particles in filled polymeric composites using FIB

Clay Minerals ◽  
2009 ◽  
Vol 44 (2) ◽  
pp. 195-205 ◽  
Author(s):  
Y. Zhu ◽  
G. C. Allen ◽  
J. M. Adams ◽  
D. Gittins ◽  
P. J. Heard ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Polymeric Composites ◽  
Degree Of Dispersion ◽  
Transmission Electron ◽  
Twin Screw ◽  
Mineral Fillers

AbstractTwo types of mineral fillers, talc and mica, were compounded into polypropylene (PP) via a twin-screw extruder. The morphologies and mechanical properties of the resultant composites were investigated. The dispersion of minerals in PP was observed using Focused Ion Beam (FIB) techniques. The particle size distribution (PSD) and aspect ratio (AR) of particles in the polymer phase were obtained from FIB image analysis. It was found that FIB imaging displays directly the micron to mesoscale level dispersion of particles in polymeric composites. The technique has significant potential for characterizing such materials, having some advantages over ‘traditional’ scanning and transmission electron microscopy in terms of generating representative data in a realistic timescale. The PSD and AR distribution and degree of dispersion in the composites give insights into the modification of mechanical properties of the composites studied.

TEM FIB Lift-Out of Mount Saint Helens Volcanic Ash

1999 ◽  
Vol 5 (S2) ◽  
pp. 908-909
Author(s):  
J.L. Drown-MacDonald ◽  
B.I. Prenitzer ◽  
T.L. Shofner ◽  
L.A. Giannuzzi
Keyword(s):  
Cross Sections ◽  
Volcanic Ash ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Tem Analysis ◽  
Plan View ◽  
Transmission Electron ◽  
Silver Paint

Focused Ion Beam (FIB) specimen preparation for both scanning and transmission electron microscopy (SEM and TEM respectively) has seen an increase in usage over the past few years. The advantage to the FIB is that site specific cross sections (or plan view sections) may be fabricated quickly and reproducibly from numerous types of materials using a finely focused beam of Ga+ ions [1,2]. It was demonstrated by Prenitzer et al. that TEM specimens may be acquired from individual Zn powder particles by employing the FIB LO specimen preparation technique [3]. In this paper, we use the FIB LO technique to prepare TEM specimens from Mount Saint Helens volcanic ash.Volcanic ash from Mount Saint Helens was obtained at the Microscopy and Microanalysis 1998 meeting in Atlanta. TEM analysis of the ash was performed using the FIB lift out technique [1]. Ash powders were dusted onto an SEM sample stud that had been coated with silver paint.

Direct Insights on Flax Fiber Structure by Focused Ion Beam Microscopy

2010 ◽  
Vol 16 (2) ◽  
pp. 175-182 ◽  
Author(s):  
Bernadette Domenges ◽  
Karine Charlet
Keyword(s):  
Electron Microscopy ◽  
Cell Wall ◽  
Cross Sections ◽  
Secondary Cell Wall ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Flax Fibers ◽  
Transmission Electron ◽  
Transition Modes ◽  
Beam Currents

AbstractIn this article, it is shown that focused ion beam (FIB) systems can be used to study the inner structure of flax fibers, the use of which as a reinforcing material in polymer composites still draws much interest from multiple disciplines. This technique requires none of the specific preparations necessary for scanning electron microscopy or transmission electron microscopy studies. Irradiation experiments performed on FIB prepared cross sections with very low Ga+ion beam currents revealed the softer material components of fibers. Thus, it confirmed the presence of pectin-rich layers at the interfaces between the fibers of a bundle, but also allowed the precise localization of such layers within the secondary cell wall. Furthermore, it suggested new insights on the transition modes between the sublayers of the secondary cell wall.

Failure Analysis of Flip-Chip Bumps After Thermal Stressing

2000 ◽  
Author(s):  
Tejpal K. Hooghan ◽  
Kultaransingh Hooghan ◽  
Sho Nakahara ◽  
Robert K. Wolf ◽  
Robert W. Privette ◽  
...  
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Diagnostic Technique ◽  
Acoustic Microscopy ◽  
Under Bump Metallization ◽  
Thermal Tests ◽  
Transmission Electron ◽  
Electrical Bias

Abstract This paper describes a new diagnostic technique for analyzing microstructural changes occurring to flip chip joints after accelerated thermal tests. Flip chip reliability was assessed at high temperatures, with and without the application of electrical bias. A combination of standard metallurgical polishing techniques and the use of a focused ion beam (FIB) lift out technique was employed to make site-specific samples for transmission electron microscopy (TEM) cross-sections. We studied evaporated 95Pb/5Sn bumps, on sputtered Cr/CrCu/Cu/Au as the under bump metallization (UBM). Thermally stressed samples were tested for electrical continuity and evaluated using 50 MHz C-mode scanning acoustic microscopy (C-SAM). Failed samples were crosssectioned and large voids at the UBM were observed optically. TEM specimens taken from the predefined UBM region of degraded flip chip devices provided critical microstructural information, which led to a better understanding of a cause of degradation occurring in the flip chip joints.

Alleviating Sample Charging during FIB Operation

2015 ◽  
Author(s):  
Q. Liu ◽  
H.B. Kor ◽  
Y.W. Siah ◽  
C.L. Gan
Keyword(s):  
Electron Microscopy ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Semiconductor Device ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Milling Process ◽  
Front Side ◽  
Dual Beam ◽  
Transmission Electron

Abstract Dual-beam focused ion beam (DB-FIB) system is widely used in the semiconductor industry to prepare cross-sections and transmission electron microscopy (TEM) lamellae, modify semiconductor devices and verify layout. One of the factors that limits its success rate is sample charging, which is caused by a lack of conductive path to discharge the accumulated charges. In this paper, an approach using an insitu micromanipulator was investigated to alleviate the charging effects. With this approach, a simple front side semiconductor device modification was carried out and the corresponding stage current was monitored to correlate to the milling process.

FIB Sample Preparation of Polymer Thin Films on Hard Substrates Using the Shadow-FIB Method

2009 ◽  
Vol 17 (6) ◽  
pp. 20-23 ◽  
Author(s):  
Suhan Kim ◽  
Gao Liu ◽  
Andrew M. Minor
Keyword(s):  
Thin Film ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Sacrificial Layer ◽  
Ion Beam ◽  
Initial Sample ◽  
Cross Sectional ◽  
Site Specific ◽  
Transmission Electron ◽  
Hard Substrates

Focused ion beam (FIB) instrumentation has proven to be extremely useful for preparing cross-sectional samples for transmission electron microscopy (TEM) investigations. The two most widely used methods involve milling a trench on either side of an electron-transparent window: the “H-bar” and the “lift-out” methods [1]. Although these two methods are very powerful in their versatility and ability to make site-specific TEM samples, they rely on using a sacrificial layer to protect the surface of the sample as well as the removal of a relatively large amount of material, depending on the size of the initial sample. In this article we describe a technique for making thin film cross-sections with the FIB, known as Shadow FIBing, that does not require the use of a sacrificial layer or long milling times [2].

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