High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed Control System-Performance Results

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000002-000009
Author(s):  
Dan Howe ◽  
Steve Majerus ◽  
Steve Garverick ◽  
Walter Merrill ◽  
Ken Semega
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Distributed Control ◽  
Power Supply ◽  
Low Cost ◽  
Sensors And Actuators ◽  
Sigma Delta ◽  
Serial Interface ◽  
Switched Mode Power Supply ◽  
Voltage Feedback

Four integrated circuits (ICs) have been developed to provide sensing, actuation, and power conversion capabilities in a high-temperature (200 °C) distributed control environment. Patented high-temperature techniques facilitate designs in a conventional, low-cost, 0.5-micron bulk CMOS foundry process. The HHT104 eight-channel instrumentation IC measures LVDTs, RTDs, thermocouples, and other sensors with up to 12-bit resolution. Dual sigma-delta converters and independent, programmable gain allow simultaneous conversion of two differential-output sensors. A stimulus driver may be used to drive bridge sensors with AC excitation and a temperature-stabilized oscillator provides 1.5- and 24-MHz system clocks for microprocessor use. The HHT212 current driver IC may be used to control two motors in full-bridge configuration or four independent half-bridge loads. Each channel is capable of driving up to 300 mA with 12-bit resolution. An internally-generated, temperature-stabilized current reference minimizes external components. The output current is programmed using a SPI serial interface, and the chip has built-in over-current and over-temperature protection. The HHT250 is a quad load driver featuring an integrated PWM controller, push-pull outputs and flexible drive capability. The HHT300 quad-output switched-mode power supply IC implements a compact power solution for multi-voltage microprocessors, sensors, and actuators. The external part count is minimized using integrated output FETs and a novel voltage feedback topology. Synchronous rectification reduces power dissipation and improves current capacity. Each channel has a pin-programmable output voltage and may be independently enabled for power supply sequencing. A high-temperature development system has been created using the four ICs and a DSP for actuator controller prototypes. A reference application was implemented using this system to drive a torque motor using LVDT position feedback.

High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed FADEC System

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000047-000053 ◽  
Author(s):  
Steve Majerus ◽  
Daniel Howe ◽  
Steven Garverick ◽  
David Hiscock ◽  
Walter Merrill
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Power Supply ◽  
High Reliability ◽  
Low Cost ◽  
Sensors And Actuators ◽  
Sigma Delta ◽  
Serial Interface ◽  
Switched Mode Power Supply ◽  
Voltage Feedback

The greatest roadblock to distributed engine control development is the lack of high-temperature, high-reliability electronic components. Four integrated circuits (ICs) have been developed to provide sensing, actuation, and power conversion capabilities in a high-temperature (over 150°C) environment. Patented high-temperature techniques facilitate designs in a conventional, low-cost, 0.5-micron bulk CMOS foundry process. The HHT104 eight-channel instrumentation IC measures LVDTs, RTDs, thermocouples, and other sensors with up to 12-bit resolution. Dual sigma-delta converters and independent, programmable gain allow simultaneous conversion of two differential-output sensors. A stimulus driver may be used to drive bridge sensors with AC excitation and a temperature-stabilized oscillator provides 1.5- and 24-MHz system clocks for microprocessor use. The HHT212 current driver IC may be used to control two motors in full-bridge configuration or four independent half-bridge loads. Each channel is capable of driving up to 300 mA with 12-bit resolution. An internally-generated, temperature-stabilized current reference minimizes external components. The output current is programmed using a SPI serial interface, and the chip has built-in over-current and over-temperature protection. The HHT250 is a quad load driver featuring an integrated PWM controller, push-pull outputs and flexible drive capability. The HHT300 quad-output switched-mode power supply IC implements a compact power solution for multi-voltage microprocessors, sensors, and actuators. The external part count is minimized using integrated output FETs and a novel voltage feedback topology. Synchronous rectification reduces power dissipation and improves current capacity. Each channel has a pin-programmable output voltage and may be independently enabled for power supply sequencing.

A 200 °C Quad-Output Buck Type Switched Mode Power Supply IC

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000022-000027
Author(s):  
Daniel T. Goff ◽  
Steve J. A. Majerus ◽  
Walter Merrill
Keyword(s):  
Power Supply ◽  
Oscillation Frequency ◽  
Low Cost ◽  
Bias Current ◽  
Buck Converter ◽  
Step Response ◽  
Level Shift ◽  
Output Current ◽  
Sensors And Actuators ◽  
Switched Mode Power Supply

A high temperature (>200 °C), quad-output, buck type switched-mode power supply (SMPS) IC capable of operating over a wide input supply range of 6 V to 15 V is described. The IC is a compact power supply solution for multi-voltage microprocessors, sensors, and actuators. The SMPS topology is a 112 kHz fixed-frequency, synchronous buck converter with slope compensation. A novel internal feedback design enables the output voltages to be pin-programmed to one of three common supply voltages—5 V, 3.3 V, or 1.8 V—while an external resistor divider can also be used for arbitrary voltage programming. Integrated power supply output MOSFET switches minimize the external part count and synchronous rectification reduces power dissipation and improves current capacity. The IC was fabricated in a conventional, low-cost, 0.5 μm bulk CMOS foundry process. Patented circuit design techniques allow the IC to operate in excess of 200 °C and circuit operation was demonstrated at ambient temperatures up to 225 °C. The foundry process is optimized for 5 V applications, however, the IC accepts input voltages up to 15 V and can produce outputs up to 10 V by utilizing extended drain single- and double-sided NMOS and PMOS transistors for the linear regulator pass transistor, error amplifier, and SMPS switches. The high-side FETs are controlled through capacitive coupled level shift circuits to ensure the gate-oxide voltage limits are not exceeded while still maintaining fast signal transitions. The IC also includes a tunable, 25 MHz monolithic oscillator that is programmable over a SPI serial interface. The oscillator bias current is comprised of a programmable constant-gm bias current and a programmable PTAT bias current. The programmability can be used to set the oscillation frequency, but can also be used together with a calibration curve on a microcontroller to achieve a more stable oscillation frequency over temperature. The output current of the quad SMPS was limited to 70 mA by a lower than expected saturation current of the extended-drain PMOS switch devices. The system showed good line regulation (<0.1%) and 50% load step response stability (+/− 100 mV) at a nominal output current of 50 mA when tested at 200 °C ambient.

scholarly journals DC UPS for Critical Loads

2015 ◽  
Vol 5 (2) ◽  
pp. 231
Author(s):  
Ganesh S ◽  
Chiranjit Ghosh T ◽  
Kokilasree R ◽  
Nandhakumar M ◽  
Md Haroon Alim T
Keyword(s):  
Power Supply ◽  
Low Cost ◽  
Uninterruptible Power Supply ◽  
Critical Data ◽  
Power Failure ◽  
Switching Losses ◽  
Dc Power ◽  
Full Power ◽  
Switched Mode Power Supply ◽  
Uninterruptible Power

<p>The usual way to avoid a computer shutdown during a mains failure is to connect an  uninterruptible power supply system (UPS), which can be suitably modified and fitted inside the computer cabinet by the use of proposed methodology known as a dc UPS.  Conventional desk top UPS systems store electricity in form of chemical energy in batteries and when ever mains fail the batteries provide DC power which is then converter to ac by inverter and then fed to the computer in order to save critical data.  Thus power from mains or from UPS is fed to switched mode power supply unit which converts it to dc to  supply the computer motherboard and accessories.  Leaving the case of the computer powered by mains, duing power failure the dc power is unnecessarily converted to ac and then to dc again in SMPS hence high switching losses and heat is produced there by making the entire system very lowe efficient.  In this work it is proposed to directly feed the dc power from the battery to the computer SMPS system by building a UPS arrangement within the computer system.  This not noly saves space, it is highly efficient compared to the conventional ups system, easy to carry, low cost and reliable since there is no change over operation is required/.  A complete design of an ac to dc power supply with an internal dc UPS is presented in this paper. . A prototype has been fully developed and tested as a PC power supply. Thus the result is achieved at full power about 6-8 minutes.</p>

scholarly journals Advances in Low Cost Silver-Containing Thick Film Conductors

1981 ◽  
Vol 9 (1) ◽  
pp. 67-85 ◽  
Author(s):  
Barry E. Taylor ◽  
John J. Felten ◽  
Samuel J. Horowitz ◽  
John R. Larry ◽  
Richard M. Rosenberg
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Thick Film ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
High Volume ◽  
Film Material ◽  
Advantages And Disadvantages ◽  
Thick Film Technology

Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al2O3substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃.

An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

2005 ◽  
Author(s):  
Carl M. Nail
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Success Rate ◽  
Mechanical Damage ◽  
Test Equipment ◽  
High Success Rate ◽  
Automated Test Equipment ◽  
Removal Method ◽  
Automated Test ◽  
Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

High Temperature Smart Sensors and Actuators

1992 ◽  
Author(s):  
Oscar J. Almeida ◽  
Brian G. Dixon ◽  
Jill H. Hardin ◽  
John P. Sanford ◽  
Myles Walsh
Keyword(s):  
High Temperature ◽  
Smart Sensors ◽  
Sensors And Actuators

Contradiction Analysis and Solution in the R&D of High-Power Solar LED Street Lamp Controller

2019 ◽  
Vol 12 (1) ◽  
pp. 12-19
Author(s):  
Zhengwang Xu ◽  
Wei Mei ◽  
Jiaqi Yu ◽  
Jiarui Zhang ◽  
Yuchun Yi ◽  
...  
Keyword(s):  
Power Supply ◽  
High Efficiency ◽  
Low Cost ◽  
Solar Panel ◽  
Battery Voltage ◽  
Supply Circuit ◽  
Led Light ◽  
Power Supply Circuit ◽  
Side Mode ◽  
Dual Power

As being restricted by factors such as cost, efficiency and size, the development of high-power solar LED street light controller is faced with plenty of difficulties. In case that a structure of two independent DC/DC is applied as the main circuit, it has to face problems such as large size and high cost; in case of applying the bidirectional BUCK/BOOST circuit, it requires change-over switches to control the solar panel and LED light. As being restricted by withstanding voltage, on-resistance and cost, a PMOS device cannot be used as the change-over switch of solar panel and LED light. However, when being used as a change-over switch, an NMOS device must apply the low-side mode under which the negative ends of the mentioned three parts are cut off. In the condition of applying the low-side mode, a differential circuit must be used to detect the voltage of the solar panel. Furthermore, in order to make sure batteries can still be regularly charged after wearing out in daylight, the controller must be supplied with power through a dual power supply circuit that can obtain power from both the solar panel and the battery. The demander has a requirement on extremely low standby power consumption of the product, and thus it is necessary to minimize the circuit that is live while working in standby mode. Methods: The bidirectional BUCK/BOOST circuit structure is applied to the main circuit to realize a higher change-over efficiency while giving considerations to both cost and size. The NMOS device, model IRFB4410ZPBF, with a price of about three yuan, is used as the switching device, and the low-side mode is applied, that is the switches inserted in between negative end of the solar panel or LED light and that of the DC/DC circuit. The low-cost rail-to-rail operational amplifier LM358 is used to form a differential amplification circuit for detecting the voltage of the solar panel. A XL1509-12E1 chip that only costs 0.88 yuan/pc is selected as the main change-over chip for the power supply, which has realized the highly-efficient and low-cost change-over of the power supply. A dual power supply circuit and a step-down protective circuit are designed for the XL1509-12E1 change-over chip. By comparing solar panel voltage with battery voltage, the solar panel booting circuit is realized. Only when solar panel voltage is higher than battery voltage, does the system program start to power it up for running, so that the outage of most of the circuits of the system under standby mode does not consume energy. Furthermore, the solar panel voltage detecting circuit, the solar panel booting circuit and several return difference functions are corrected during system debugging. Results: The circuit board of the entire controller features small size, low cost and high efficiency. It measures about 100*62*18mm in size, costs about 60 yuan, and the charge/discharge change-over efficiency reaches up to over 95%. The controller has many functions: it is capable of operating within a large scope, in which, solar panel voltage is subject to 15~50V, LED light voltage is subject to 15~60V, battery voltage is subject to 10~35V and battery-end charge/discharge current is 10A; it is capable of adapting to monocrystalline silicon/multicrystalline silicon/thin-film and many other kinds of solar panels, as well as lithium/lead-acid and many other kinds of batteries; it is capable of detecting the conversion of day and night, automatically controlling charging and discharging and automatically making adaptive adjustment according to seasonal variations; the current to be consumed during standby will be maintained below 3mA, and thus the power consumption is extremely low. Conclusion: By selecting the bidirectional BUCK/BOOST circuit structure, applying low-side mode for switching of solar panel and LED light, using a differential circuit to detect solar panel voltage, using a low-cost DC/DC chip to realize power supply change-over, designing a dual power supply circuit, introducing solar panel booting circuit and other hardware design, as well as MPPT algorithm, state recognition and control, return difference control and other software design, a solar LED street light control product featuring small size, low cost, high efficiency and multiple functions is successfully developed.

Applications of CoSi2 to VLSI and ULSI

1993 ◽  
Vol 320 ◽  
Author(s):  
S. P. Murarka
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Integrated Circuits ◽  
Lattice Mismatch ◽  
Electrical Contacts ◽  
High Conductivity ◽  
Low Resistivity ◽  
Polysilicon Films ◽  
Continued Use

ABSTRACTSilicides have found application as high conductivity, high temperature, and corrosion resistance materials that form good electrical contacts to silicon and good low resistivity cladding on polysilicon films used as gate metal. Of various silicides investigated in past CoSi2 offers several advantages including lowest resistivity, self-aligned formation, low lattice mismatch with silicon, stability in presence of dopants and on SiO2, Si3N4, or Sioxynitrides, and reliability to process temperatures ≤900°C even when used in thicknesses as thin as 50-60 nm. Thus, CoSi2 has found an application in VLSI and ULSI. In this paper, the properties, formation and processing, reliability, and applicability of CoSi2 will be reviewed. It will be shown that CoSi2 is only silicide that offers properties and reliability for continued use in sub-0.25 pm VLSI and ULSI integrated circuits.

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