High Temperature Smart Sensors and Actuators

The syntactic and semantic interoperability is a challenge of the Wireless Sensor Networks (WSN) with smart sensors in pervasive computing environments to increase their harmonization in a wide variety of applications. This chapter contains a detailed description of interoperability in heterogeneous WSN using the IEEE 1451 standard. This work focuses on personal area networks (PAN) with smart sensors and actuators. Also, technical, syntactic, and semantic levels of interoperability based on IEEE 1451 standardization are established with common control commands. In this architecture, each node includes a Transducer Electronic Datasheets (TEDS) and intelligent functions. The authors explore different options to apply the IEEE 1451 standard using SOAP or REST Web service style in order to test a common syntactical interoperability that could be predominant in future WSNs.

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HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMS

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-ta23 ◽

2014 ◽

Vol 2014 (HITEC) ◽

pp. 000034-000039 ◽

Cited By ~ 1

Author(s):

John R. Fraley ◽

Lauren Kegley ◽

Stephen Minden ◽

Jimmy L. Davidson ◽

David Kerns

Keyword(s):

High Temperature ◽

Nuclear Reactor ◽

Reactor Core ◽

Chemical Species ◽

Chemical Vapor ◽

Smart Sensors ◽

Sensor Systems ◽

High Temperature Electronics ◽

Wireless Telemetry ◽

Wide Range

In recent years, high temperature semiconductors have been utilized in wireless telemetry systems for use in military and commercial applications, wherein a high temperature environment combined with other factors such as rotating machinery or weight-constraints preclude the use of conventional silicon based wireless telemetry or wired sensor solutions. Present systems include those which can measure temperatures, pressures, vibrations, and strains. By combining the advanced electronics developed for these systems with novel sensor elements created using chemical vapor deposition (CVD) nanodiamond technology, a wide range of other high temperature sensing systems can be enabled. The unique properties of the diamond sensors have proven in principle the capability to sense, with quantifiable signal, a wide variety of parameters under extreme conditions including very high temperatures and pressures. It has been clear for some time that diamond would be the ideal material of choice for solid-state sensors, but only in recent years has the advent of CVD diamond (as opposed to natural or HPHT [high pressure, high temperature] formation) opened the door for its practical development into harsh environment sensor systems. By combining these diamond sensor elements with high temperature electronics and high temperature packaging approaches, smart sensors can be developed to measure parameters ranging from gas chemical species on the surface of Venus, to neutron flux rates outside of a nuclear reactor core. The research presented here is centered around the use of hybrid diamond sensors for neutron detection applications in Nuclear Thermal Propulsion systems. The current technology state and development needs for these hybrid high temperature diamond smart sensors will be highlighted to potentially encourage future R&D from the high-temperature electronics community.

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Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2380-4491.2019.hiten.000034 ◽

2019 ◽

Vol 2019 (HiTen) ◽

pp. 000034-000038 ◽

Cited By ~ 1

Author(s):

Piers Tremlett ◽

Phil Elliot ◽

Pablo Tena

Keyword(s):

High Temperature ◽

Printed Circuit Board ◽

Real Life ◽

Circuit Board ◽

Calibration Data ◽

Engine Fuel ◽

Sensors And Actuators ◽

Pcb Assembly ◽

Operational Life ◽

Mems Technology

Printed circuit board (PCB) assemblies must fit into unusual spaces for many real-life, high temperature applications such as sensors and actuators. This paper details the design and manufacture of a complex control circuit for a jet engine fuel flow valve. “Origami” was needed to fit this control circuitry into the tight space in the valve, this was achieved using a high temperature flex rigid PCB assembly. The valve was mounted on a hot section of the engine, and the assembly was tested for its capability to operate at 178°C and withstand multiple thermal cycles of −55°C and 175°C during its operational life. Various component joining media were investigated to extend the life of the assembly. The project also developed a one-time programmable (OTP) memory aimed at up to 300°C operation for on board memory to provide calibration data or boot memory for high temperature microcontrollers or processors. The device was based on Micro-Electro-Mechanical Systems (MEMS) technology.

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High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed Control System-Performance Results

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-2012-ta11 ◽

2012 ◽

Vol 2012 (HITEC) ◽

pp. 000002-000009

Author(s):

Dan Howe ◽

Steve Majerus ◽

Steve Garverick ◽

Walter Merrill ◽

Ken Semega

Keyword(s):

High Temperature ◽

Integrated Circuits ◽

Distributed Control ◽

Power Supply ◽

Low Cost ◽

Sensors And Actuators ◽

Sigma Delta ◽

Serial Interface ◽

Switched Mode Power Supply ◽

Voltage Feedback

Four integrated circuits (ICs) have been developed to provide sensing, actuation, and power conversion capabilities in a high-temperature (200 °C) distributed control environment. Patented high-temperature techniques facilitate designs in a conventional, low-cost, 0.5-micron bulk CMOS foundry process. The HHT104 eight-channel instrumentation IC measures LVDTs, RTDs, thermocouples, and other sensors with up to 12-bit resolution. Dual sigma-delta converters and independent, programmable gain allow simultaneous conversion of two differential-output sensors. A stimulus driver may be used to drive bridge sensors with AC excitation and a temperature-stabilized oscillator provides 1.5- and 24-MHz system clocks for microprocessor use. The HHT212 current driver IC may be used to control two motors in full-bridge configuration or four independent half-bridge loads. Each channel is capable of driving up to 300 mA with 12-bit resolution. An internally-generated, temperature-stabilized current reference minimizes external components. The output current is programmed using a SPI serial interface, and the chip has built-in over-current and over-temperature protection. The HHT250 is a quad load driver featuring an integrated PWM controller, push-pull outputs and flexible drive capability. The HHT300 quad-output switched-mode power supply IC implements a compact power solution for multi-voltage microprocessors, sensors, and actuators. The external part count is minimized using integrated output FETs and a novel voltage feedback topology. Synchronous rectification reduces power dissipation and improves current capacity. Each channel has a pin-programmable output voltage and may be independently enabled for power supply sequencing. A high-temperature development system has been created using the four ICs and a DSP for actuator controller prototypes. A reference application was implemented using this system to drive a torque motor using LVDT position feedback.

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A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-tha11 ◽

2014 ◽

Vol 2014 (HITEC) ◽

pp. 000278-000284 ◽

Cited By ~ 1

Author(s):

Bhal Tulpule ◽

Bruce Ohme ◽

Mark Larson ◽

Al Behbahani ◽

John Gerety ◽

...

Keyword(s):

Control System ◽

High Temperature ◽

Building Block ◽

Complex Function ◽

Wind Farms ◽

Power Source ◽

System On Chip ◽

Hole Drilling ◽

Sensors And Actuators ◽

On Chip

This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) chipset which was developed by Embedded Systems LLC as a part of the Smart Node based distributed control system architecture under an Air Force SBIR (Small Business Innovative Research) program {4}. The analog part of the SOC chipset has been implemented by Honeywell International under a subcontract using their high temperature SOI (Silicon On Insulator) Process. The complete chipset is expected to be available in early 2015. The key feature of the SOC chipset is that it is a reconfigurable and scalable building block that can be used to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to power and interface with sensors such as RTD (Resistance Temperature Detectors), Strain Gauges (SG), Thermo Couples (TC) and transducers for measuring mass flow, speed, position or angle. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. Finally, the SOC chipset contains PWM (Pulse Width Modulation) circuitry required to interface with external drives for actuators, motors, shutoff Valves etc. The SOC chipset can be powered from a Mil-Std-704F compliant power source or a conditioned DC power source. The chipset can be combined with other devices, such as memory, processor and A to D Converter to implement a high temperature capable Smart Node for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics and /or high level of miniaturization is required.

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A Current-Controlled PCB Integrated MEMS Tilt Mirror

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2014dpc-ta32 ◽

2014 ◽

Vol 2014 (DPC) ◽

pp. 000588-000608

Author(s):

Robert N. Dean ◽

Colin B. Stevens ◽

John J. Tatarchuk

Keyword(s):

Control System ◽

High Temperature ◽

Air Force ◽

Building Block ◽

Beam Steering ◽

Complex Function ◽

Power Source ◽

Sensors And Actuators ◽

Key Features ◽

Sbir Program

Introduction: MEMS Tilt Mirror - a miniature planar micro-mirror that can experience a 1-D or 2-D tilt in response to a control signal. Commonly used technologies- electrostatic, piezoelectric, electrothermal bimorph. Applications - laser beam steering, interferometers, dynamic signal analyzers, opticcal cross-connect switches. This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) that has been developed under an Air Force SBIR program. The SOC device has been implemented by Honeywell International using their High Temperature SOI (Silicon On Insulator) Process. The objective of the Air Force SBIR program {1} was to investigate the potential for use of available High Temperature SOI technology devices for aerospace propulsion control system applications. Several prototype designs implemented by Embedded Systems LLC (ES-LLC) using available SOI devices identified significant limitations in the performance capability and level of integration. The diversity of propulsion system interfacing requirements demanded generic solutions so that they could be deployed in multiple applications without changes. The available devices were also not affordable due to the limited size of the market for this technology. It was therefore decided to develop a generic, reconfigurable SOC chipset {2} that could be implemented using Honeywell's HT200 Family of ASIC Gate Arrays. The paper will describe the architecture and key features of the SOC chipset solution which can be reconfigured to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to interface with sensors such as RTD (resistance Temperature Detectors), Strain Gauges (SG) and thermocouples (TC), mass flow, speed and LVDT (Linear Variable Differential Transducer) position. The excitation circuitry required to power these interfaces is embedded in the chipset and can be reconfigured as required. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. The SOC chipset can be powered from a Mil-Std 704F compliant power source or a conditioned DC power source. The SOC chipset when combined with other external devices can be implemented as a “Smart Node” for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). The SOC chipset thus completes the set of all High Temperature SOI Integrated circuits required for implementation of typical Smart Nodes. It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics is required.

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Manufacturing and Active Control Testing of Active Composite Panels With Embedded Piezoelectric Sensors and Actuators: Wires Out by Cut-Holes and Embedding

Aerospace ◽

10.1115/imece2003-43017 ◽

2003 ◽

Author(s):

Mehrdad N. Ghasemi Nejhad ◽

Richard Russ

Keyword(s):

Composite Material ◽

High Temperature ◽

Vibration Suppression ◽

Curing Temperature ◽

Piezoelectric Sensors ◽

Composite Panels ◽

Sensors And Actuators ◽

Advantages And Disadvantages ◽

Piezoelectric Sensors And Actuators ◽

Active Composite

This work presents manufacturing and testing of active composite panels (ACPs) with embedded piezoelectric sensors and actuators. The composite material employed here is a plain weave carbon/epoxy prepreg fabric with about 0.3 mm ply thickness. A cross-ply type stacking sequence is employed for the ACPs. The piezoelectric flexible patches employed here are Active Fiber Composites with 0.33 mm thickness. Composite cut-out layers are used to fill the space around the embedded piezo patches to minimize the problems associated with ply drops in composites. The piezoelectric patches were embedded inside the composite laminate. High-temperature wires were soldered to the piezo leads, insulated from the carbon substructure by high-temperature materials, and were taken out of the composite laminates employing both cut-hole and embedding techniques. The laminated ACPs were co-cured inside an autoclave employing the cure cycle recommended by the composite material supplier. The Curie temperature of the embedded piezo patches should be well above the curing temperature of the composite materials as was the case here. The manufactured ACPs were trimmed and then tested for their functionality. Vibration suppression as well as simultaneous vibration suppression and precision positioning tests, using Hybrid Adaptive Control techniques were successfully conducted on the manufactured ACP beams and plates and their functionality were demonstrated. The advantages and disadvantages of ACPs manufactured by taking the wires out employing cut-holes and embedding techniques, in terms of manufacturing and performance, are presented.

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