scholarly journals Advances in Low Cost Silver-Containing Thick Film Conductors

1981 ◽  
Vol 9 (1) ◽  
pp. 67-85 ◽  
Author(s):  
Barry E. Taylor ◽  
John J. Felten ◽  
Samuel J. Horowitz ◽  
John R. Larry ◽  
Richard M. Rosenberg
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Thick Film ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
High Volume ◽  
Film Material ◽  
Advantages And Disadvantages ◽  
Thick Film Technology

Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al2O3substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃.

A High Temperature Pressure Sensor Based on Advanced Thick Film Technology

2012 ◽  
Author(s):  
Zongyang Zhang ◽  
Xingguo Cheng ◽  
Gang Cao ◽  
Chaojun Liu ◽  
Sheng Liu
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Steel Substrate ◽  
Low Cost ◽  
Thermal Sensitivity ◽  
Pressure Sensors ◽  
Wheatstone Bridge ◽  
Structure Design ◽  
Optimal Position ◽  
Thick Film Technology

For the purpose of pressure measurement in oil drilling industry as well as in other industrial measurement and control systems, the low cost pressure sensors that can be operated in high temperature environments are badly needed. In this paper, thick film resistors (TFRs) on 430 stainless steel (SS) substrate for high temperature strain sensor applications have been developed and evaluated. Thick film technology based steel pressure sensors (SPS) are fabricated by screen printing and firing four TFRs on a machined circular diaphragm and then the TFRs are connected in a Wheatstone bridge configuration. Finite element method (FEM) is used to optimize structure design and predict the optimal position where the piezoresistive TFRs are placed on the dielectrics-on-steel substrate. Preliminary tests show that the sensors exhibit a sensitivity of 4.83 mV/V full-scale (FS) with 0.22% FS linearity and 0.27% FS hysteresis and 0.28% FS repeatability. Moreover, the thermal zero drifts and thermal sensitivity drifts of the sensors in the whole temperature range (25 °C to +220 °C) are less than 5% FS. These results indicate that the sensors can be used in high temperature environment up to 220 °C.

scholarly journals Towards a Glass New World: The Role of Ion-Exchange in Modern Technology

2021 ◽  
Vol 11 (10) ◽  
pp. 4610
Author(s):  
Simone Berneschi ◽  
Giancarlo C. Righini ◽  
Stefano Pelli
Keyword(s):  
Ion Exchange ◽  
Communication Networks ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Modern Technology ◽  
Historical Background ◽  
Wide Range ◽  
Happy Marriage

Glasses, in their different forms and compositions, have special properties that are not found in other materials. The combination of transparency and hardness at room temperature, combined with a suitable mechanical strength and excellent chemical durability, makes this material indispensable for many applications in different technological fields (as, for instance, the optical fibres which constitute the physical carrier for high-speed communication networks as well as the transducer for a wide range of high-performance sensors). For its part, ion-exchange from molten salts is a well-established, low-cost technology capable of modifying the chemical-physical properties of glass. The synergy between ion-exchange and glass has always been a happy marriage, from its ancient historical background for the realisation of wonderful artefacts, to the discovery of novel and fascinating solutions for modern technology (e.g., integrated optics). Getting inspiration from some hot topics related to the application context of this technique, the goal of this critical review is to show how ion-exchange in glass, far from being an obsolete process, can still have an important impact in everyday life, both at a merely commercial level as well as at that of frontier research.

scholarly journals In-Plane Monolithic Integration of Scaled III-V Photonic Devices

2021 ◽  
Vol 11 (4) ◽  
pp. 1887
Author(s):  
Markus Scherrer ◽  
Noelia Vico Triviño ◽  
Svenja Mauthe ◽  
Preksha Tiwari ◽  
Heinz Schmid ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
Low Cost ◽  
Photonic Devices ◽  
Monolithic Integration ◽  
Light Emitters ◽  
Fully Integrated ◽  
Large Lattice ◽  
Hybrid Iii ◽  
Gain Material

It is a long-standing goal to leverage silicon photonics through the combination of a low-cost advanced silicon platform with III-V-based active gain material. The monolithic integration of the III-V material is ultimately desirable for scalable integrated circuits but inherently challenging due to the large lattice and thermal mismatch with Si. Here, we briefly review different approaches to monolithic III-V integration while focusing on discussing the results achieved using an integration technique called template-assisted selective epitaxy (TASE), which provides some unique opportunities compared to existing state-of-the-art approaches. This method relies on the selective replacement of a prepatterned silicon structure with III-V material and thereby achieves the self-aligned in-plane monolithic integration of III-Vs on silicon. In our group, we have realized several embodiments of TASE for different applications; here, we will focus specifically on in-plane integrated photonic structures due to the ease with which these can be coupled to SOI waveguides and the inherent in-plane doping orientation, which is beneficial to waveguide-coupled architectures. In particular, we will discuss light emitters based on hybrid III-V/Si photonic crystal structures and high-speed InGaAs detectors, both covering the entire telecom wavelength spectral range. This opens a new path towards the realization of fully integrated, densely packed, and scalable photonic integrated circuits.

scholarly journals A Review of Self-Coherent Optical Transceivers: Fundamental Issues, Recent Advances, and Research Directions

2021 ◽  
Vol 11 (16) ◽  
pp. 7554
Author(s):  
Isiaka Alimi ◽  
Romil Patel ◽  
Nuno Silva ◽  
Chuanbowen Sun ◽  
Honglin Ji ◽  
...  
Keyword(s):  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Dynamic Environment ◽  
Digital Signal ◽  
Research Directions ◽  
Recent Advances ◽  
Heterogeneous Nature ◽  
Signal Processing Algorithms ◽  
Processing Algorithms

This paper reviews recent progress on different high-speed optical short- and medium-reach transmission systems. Furthermore, a comprehensive tutorial on high-performance, low-cost, and advanced optical transceiver (TRx) paradigms is presented. In this context, recent advances in high-performance digital signal processing algorithms and innovative optoelectronic components are extensively discussed. Moreover, based on the growing increase in the dynamic environment and the heterogeneous nature of different applications and services to be supported by the systems, we discuss the reconfigurable and sliceable TRxs that can be employed. The associated technical challenges of various system algorithms are reviewed, and we proffer viable solutions to address them.

Mechanical and Optimization Analyses for Novel Wound Composite Axial Impeller

2009 ◽  
Author(s):  
Jifeng Wang ◽  
Qubo Li ◽  
Norbert Mu¨ller
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Three Dimensional ◽  
Von Mises Stress ◽  
Loading Conditions ◽  
Element Analysis ◽  
Wound Composite

A mechanical and optimal analyses procedure is developed to assess the stresses and deformations of Novel Wound Composite Axial-Impeller under loading conditions particular to centrifuge. This procedure is based on an analytical method and Finite Element Analysis (FEA, commercial software ANSYS) results. A low-cost, light-weight, high-performance, composite turbomachinery impeller from differently designed patterns will be evaluated. Such impellers can economically enable refrigeration plants using water as a refrigerant (R718). To create different complex patterns of impellers, MATLAB is used for creating the geometry of impellers, and CAD software UG is used to build three-dimensional impeller models. Available loading conditions are: radial body force due to high speed rotation about the cylindrical axis and fluid forces on each blade. Two-dimensional plane stress and three-dimensional stress finite element analysis are carried out using ANSYS to validate these analytical mechanical equations. The von Mises stress is investigated, and maximum stress and Tsai-Wu failure criteria are applied for composite material failure, and they generally show good agreement.

The Effect of Strain on the Formation of Dislocations at the SiGe/Si Interface

MRS Bulletin ◽  
1996 ◽  
Vol 21 (4) ◽  
pp. 38-44 ◽  
Author(s):  
F.K. LeGoues
Keyword(s):  
Metal Oxide ◽  
High Speed ◽  
High Performance ◽  
Field Effect Transistors ◽  
Low Cost ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Design Rule ◽  
Strained Si

Recently much interest has been devoted to Si-based heteroepitaxy, and in particular, to the SiGe/Si system. This is mostly for economical reasons: Si-based technology is much more advanced, is widely available, and is cheaper than GaAs-based technology. SiGe opens the door to the exciting (and lucrative) area of Si-based high-performance devices, although optical applications are still limited to GaAs-based technology. Strained SiGe layers form the base of heterojunction bipolar transistors (HBTs), which are currently used in commercial high-speed analogue applications. They promise to be low-cost compared to their GaAs counterparts and give comparable performance in the 2-20-GHz regime. More recently we have started to investigate the use of relaxed SiGe layers, which opens the door to a wider range of application and to the use of SiGe in complementary metal oxide semiconductor (CMOS) devices, which comprise strained Si and SiGe layers. Some recent successes include record-breaking low-temperature electron mobility in modulation-doped layers where the mobility was found to be up to 50 times better than standard Si-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Even more recently, SiGe-basedp-type MOSFETS were built with oscillation frequency of up to 50 GHz, which is a new record, in anyp-type material for the same design rule.

Chemical selective coating of nickel / palladium / gold metallization on screen-printed thick film on LTCC and Al2O3 ceramic for high temperature applications

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000334-000338
Author(s):  
Jens Müller ◽  
Thomas Mache ◽  
Torsten Thelemann
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Low Cost ◽  
Gold Wire ◽  
Wire Bonding ◽  
Pure Gold ◽  
Al2o3 Ceramic ◽  
Selective Coating ◽  
Silver Palladium ◽  
Silver Silver

Electroless plating on silver is a low cost alternative to printing of mixed metals or pure gold paste systems on LTCC. It overcomes the necessity to have material transitions from inner to outer layers or from conductor lines to wire bonding- or solder-pads. Since no commercial process and material set for silver thick film conductors has been available on the market a proprietary Ni/Pd/Au coating technology was developed for the use on silver inks for LTCC and Al2O3-ceramic as a base for both soldering and wire bonding. The work included the screening of different chemicals as well as several silver paste systems from two commercial vendors. Conductor adhesion, plating layer thicknesses, plating accuracy, (lead free) solderability and gold wire-bondability were assessed to optimize the process. Layers of about 5 microns Ni, (0.1 to 0.3) microns Pd and (0.05 to 0.15) microns Au were electrolessly deposited. The developed Ni-Pd-Au finish is an economical alternative with only about a quarter of the cost compared to the conventional use of silver, silver / palladium and gold compounds for ceramic substrates. This technology allows coating of the structures down to a fine pad size of 200×200 microns and a minimum line width of 100 microns, without reducing the adhesion mechanism between thick-film metallization and ceramic substrate. By covering of pure conductors with high temperature glass or dielectrics, further material saving is possible. Besides, the process offers also very good coating of structures in cavities.

Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000053-000057
Author(s):  
Jaroslaw Kita ◽  
Sven Wiegärtner ◽  
Alistair Prince ◽  
Peter Weigand ◽  
Ralf Moos
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Buried Structures ◽  
Ceramic Substrates ◽  
Temperature Characteristics ◽  
Film Type ◽  
Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

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