scholarly journals A Wirebonding Instrument for Insulated and Coaxial Wires

2020 ◽  
Vol 17 (2) ◽  
pp. 52-58
Author(s):  
Mitchell Meinhold ◽  
Caprice Gray ◽  
Jeffery Delisio ◽  
Ernest Kim ◽  
Christian Wells ◽  
...  

A tool has been developed that supports a novel microelectronic integration paradigm whereby interconnects between components are directly established by means of microcoax wire bonding. A near-term use case of the tool is to facilitate rapid prototyping of high-bandwidth systems. When further matured, it will be able to rapidly integrate complex systems with hundreds or thousands of interconnects with minimal design time. Automatic stripping and bonding of coax wires having overall diameters between 50 and 100 μm present an array of process challenges that pose interesting demands on the material system of the wire and the bonding tool. This study reviewed a microcoax bonding system that is currently in development at Draper which is able to strip, feed, and bond microcoax wire. The system utilizes a combination of electric flame-off and thermal reflow to strip outer metal shielding and polymer dielectric layers, respectively. It leverages a rotary wire feed mechanism to precisely control wire position so that predetermined wire lengths can be established. Progress in the design of the wires, tooling, and software control architecture is reviewed.

2019 ◽  
Vol 2019 (1) ◽  
pp. 000503-000508
Author(s):  
Mitchell Meinhold ◽  
Caprice Gray ◽  
Jeffery Delisio ◽  
Ernest Kim ◽  
Christian Wells ◽  
...  

Abstract A tool has been developed that supports a novel microelectronic integration paradigm whereby interconnects between components are directly established by way of micro-coax wirebonds. A near term use-case of the tool is to facilitate rapid prototyping of high-bandwidth systems. When further matured, it will lead to the ability to rapidly integrate complex systems with hundreds or thousands of interconnects with minimal design time. Automatic stripping and bonding of coax wires having overall diameters between 50 to 150μm presents an array of process challenges that pose interesting demands on the material system of the wire and the bonding tool. This paper will review a micro-coax bonding system that is currently in development at Draper which is able to strip, feed and bond micro coax wire. The system utilizes a combination of electric-flame-off (EFO) and thermal reflow to strip outer metal shielding and polymer dielectric layers respectively. It leverages a rotary wire feed mechanism to precisely control wire position so that pre-determined wire-lengths can be established. Progress in design of the wires, tooling and software control architecture are reviewed.


Materials ◽  
2020 ◽  
Vol 13 (14) ◽  
pp. 3200 ◽  
Author(s):  
Libor Topolář ◽  
Dalibor Kocáb ◽  
Jiří Šlanhof ◽  
Pavel Schmid ◽  
Petr Daněk ◽  
...  

The paper describes an experiment focusing on the way the material system influences the bond strength of large-format tiles installed on concrete substrate during mechanical loading under conditions that correspond to real-life application. This involves a controllable mechanical load applied over an area of a test model while observing its condition using non-destructive methods (ultrasonic pulse velocity test, acoustic emission method, strain measurement, and acoustic tracing). The model consisted of a concrete slab onto which were mounted four different systems with large-format tiles with the dimensions of 3 m × 1 m. The combinations differed in the thickness of the tile, the adhesive, and whether or not a fabric membrane was included in the adhesive bed. The experiment showed that the loading caused no damage to the ceramic tile. All the detected failures took place in the adhesive layer or in the concrete slab.


Author(s):  
Aurélien Faravelon ◽  
Stéphanie Chollet

Pervasive applications are entering the mainstream, but at the present time, exhibit significant security weaknesses. Service-driven architectural approaches facilitate the development of pervasive applications, however, security with respect to access control and data privacy of pervasive applications are currently not managed comprehensively from design time through run time. This chapter presents a use case emphasizing the security challenges for pervasive applications and proposes a novel, generative architectural approach, to include security in pervasive applications at design time. This is a model-driven approach based on models pertaining to access control management that respect the temporal constraints relating to pervasive applications. The approach is implemented with a design and runtime environment and the results of the validation applied to the pervasive use case are presented.


2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Peng Yu ◽  
Fanqin Zhou ◽  
Tao Zhang ◽  
Wenjing Li ◽  
Lei Feng ◽  
...  

An attractive architecture called heterogeneous cloud radio access networks (H-CRAN) becomes one of the important components of 5G networks, which can provide ubiquitous high-bandwidth services with flexible network construction. However, massive access nodes increase the risk of cell outages, leading to negative impact on user-perceived QoS (Quality of Service) and QoE (Quality of Experience). Thus, cell outage management (COM) became a key function proposed in SON (Self-Organized Networks) use cases. Based on COM, cell outage detection (COD) will be resolved before cell outage compensation (COC). Currently few studies concentrate on COD for 5G H-CRAN, and we propose self-organized COD architecture and approach for it. We firstly summarize current COD solutions for LTE/LTE-A HetNets and then introduce self-organized architecture and approach suitable for H-CRAN, which includes COD architecture and procedures, and corresponding key technologies for it. Based on the architecture, we take a use case with handover data analysis using modified LOF (Local Outlier Factor) detection approach to detect outage for different kinds of cells in H-CRAN. Results show that the proposed approach can identify the outage cell effectively.


2017 ◽  
Vol 11 (04) ◽  
pp. 473-496
Author(s):  
Jan Novacek ◽  
Alexander Viehl ◽  
Oliver Bringmann ◽  
Wolfgang Rosenstiel

This article presents an ontology-supported approach to tackle the complexity of the Robustness Validation (RV) process of automotive electrical/electronic (E/E) components. The approach uses formalized knowledge from the RV process and stress, operating, and load profiles, so-called Mission Profiles (MPs). In contrast to the error-prone industrially established manual procedure, we show how component characteristics are formalized in OWL in order to form the foundation of an efficient automated analysis selection and decision support during the RV process. Additionally, a rule-based transformation of component characteristics upon propagation via SWRL is described. The proposed approach is based on the idea of mapping MPs to an OWL representation in order to allow to execute semantic queries against MP data to improve their integration into the RV process. The resulting ontology-supported application framework has been applied to an industrial use-case from automotive power electronics. A generalization of the approach is described and demonstrated by applying it to stress test selection within the AEC Q100 standard. We present experimental results showing that the RV process can be significantly improved in terms of reduced design time and increased exhaustiveness by automating the analyses selection step and the provisioning of all the relevant data to be used.


2021 ◽  
Vol 2086 (1) ◽  
pp. 012100
Author(s):  
S A Scherbak ◽  
E I Moiseev ◽  
I A Melnichenko ◽  
Ju A Guseva ◽  
M V Maximov ◽  
...  

Abstract We studied experimentally and numerically self-heating of a microdisk laser developed in the AlGaInAs material system and covered with dielectric layers. By experiments, we found that planarization of the microlaser with SU-8 photoresist significantly (almost, 2-fold) decreases the microlaser thermal resistance. Calculations demonstrate that a downward heat flux through the substrate to the heat sink is a dominant way of heat dissipation, and upward convection is much less relevant. Also, the calculations showed that covering microlaser with a TiO2 layer barely affects microdisk temperature but decreases heat localization in the structure.


Author(s):  
R.W. Carpenter

Interest in precipitation processes in silicon appears to be centered on transition metals (for intrinsic and extrinsic gettering), and oxygen and carbon in thermally aged materials, and on oxygen, carbon, and nitrogen in ion implanted materials to form buried dielectric layers. A steadily increasing number of applications of microanalysis to these problems are appearing. but still far less than the number of imaging/diffraction investigations. Microanalysis applications appear to be paced by instrumentation development. The precipitation reaction products are small and the presence of carbon is often an important consideration. Small high current probes are important and cryogenic specimen holders are required for consistent suppression of contamination buildup on specimen areas of interest. Focussed probes useful for microanalysis should be in the range of 0.1 to 1nA, and estimates of spatial resolution to be expected for thin foil specimens can be made from the curves shown in Fig. 1.


Author(s):  
F. Shaapur

Non-uniform ion-thinning of heterogenous material structures has constituted a fundamental difficulty in preparation of specimens for transmission electron microscopy (TEM). A variety of corrective procedures have been developed and reported for reducing or eliminating the effect. Some of these techniques are applicable to any non-homogeneous material system and others only to unidirectionalfy heterogeneous samples. Recently, a procedure of the latter type has been developed which is mainly based on a new motion profile for the specimen rotation during ion-milling. This motion profile consists of reversing partial revolutions (RPR) within a fixed sector which is centered around a direction perpendicular to the specimen heterogeneity axis. The ion-milling results obtained through this technique, as studied on a number of thin film cross-sectional TEM (XTEM) specimens, have proved to be superior to those produced via other procedures.XTEM specimens from integrated circuit (IC) devices essentially form a complex unidirectional nonhomogeneous structure. The presence of a variety of mostly lateral features at different levels along the substrate surface (consisting of conductors, semiconductors, and insulators) generally cause non-uniform results if ion-thinned conventionally.


Author(s):  
Matthew R. Libera ◽  
Martin Chen

Phase-change erasable optical storage is based on the ability to switch a micron-sized region of a thin film between the crystalline and amorphous states using a diffraction-limited laser as a heat source. A bit of information can be represented as an amorphous spot on a crystalline background, and the two states can be optically identified by their different reflectivities. In a typical multilayer thin-film structure the active (storage) layer is sandwiched between one or more dielectric layers. The dielectric layers provide physical containment and act as a heat sink. A viable phase-change medium must be able to quench to the glassy phase after melting, and this requires proper tailoring of the thermal properties of the multilayer film. The present research studies one particular multilayer structure and shows the effect of an additional aluminum layer on the glass-forming ability.


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