Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking

This paper studies package reliability for the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration) delivering up to 2.78 Tb/s transceiver bandwidth. Each device is packaged on a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. 3D thermal-mechanical simulations are built to analyze package warpage, low-k stresses, microbumps and C4 bumps fatigue as well as BGA ball reliability. Different substrate sizes and designs, lid designs, lid materials and C4 bump underfill materials are investigated in order to optimize package reliability. LTCC ceramic package reduces fatigue in C4 bumps when increasing the risk for BGA balls to fail in thermal stressing. Hence, lid design and C4 bump underfill material are optimized to increase fatigue life for BGA balls. Simulation results indicate heterogeneous stacked-silicon (3D) integration is a reliable method to build very high-bandwidth multi-chip devices that exceed current monolithic capabilities.

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Very high bandwidth digital current controller for high-performance motor drives

6th International Conference on Power Electronics and Variable Speed Drives ◽

10.1049/cp:19960910 ◽

1996 ◽

Cited By ~ 16

Author(s):

P.C. Kjaer

Keyword(s):

High Performance ◽

Motor Drives ◽

Current Controller ◽

High Bandwidth ◽

Very High

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ENABLE HIGH PERFORMANCE COMPUTING IN CLOUD: A REVIEW

10.36106/ijsr/4230701 ◽

2021 ◽

pp. 44-45

Author(s):

Reena Saini ◽

Nachiket Sainis

Keyword(s):

Cloud Computing ◽

High Performance Computing ◽

High Performance ◽

Desktop Computer ◽

Computing Power ◽

High Bandwidth ◽

Scientists And Engineers ◽

Complex Science ◽

Performance Computing ◽

Very High

High Performance Computing (HPC) resulting whole computing power in a way that delivers much higher performance than it could get in typical desktop computer or workstation. High Performance Computing (HPC) allows scientists and engineers to solve complex science, engineering, and business problems using applications that require high bandwidth, enhanced networking, and very high compute capabilities. HPC's democratization has been driven particularly by cloud computing, which has given scientists access to supercomputing-like features as the pay as you go. This paper will provide an overview on benets, challenges and future of HPC in cloud.

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KEMPER C688

Alloy Digest ◽

10.31399/asm.ad.cu0867 ◽

2017 ◽

Vol 66 (12) ◽

Keyword(s):

Corrosion Resistance ◽

Physical Properties ◽

Tensile Properties ◽

Copper Alloy ◽

High Performance ◽

High Conductivity ◽

Bend Strength ◽

Very High

Abstract Alloy C688 is a high-performance copper alloy with very high conductivity. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming and joining. Filing Code: Cu-867. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.

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KEMPER KHP7025

Alloy Digest ◽

10.31399/asm.ad.cu0865 ◽

2017 ◽

Vol 66 (10) ◽

Keyword(s):

Corrosion Resistance ◽

Physical Properties ◽

Tensile Properties ◽

Copper Alloy ◽

High Performance ◽

High Conductivity ◽

Bend Strength ◽

Very High

Abstract Alloy KHP 7025 (UNS C70250) is a high-performance copper alloy with very high conductivity. Uses include connector springs, tabs, contact springs, switches, relays, and leadframes. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming, machining, and joining. Filing Code: Cu-865. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.

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Use of activated carbon to remove undesirable residual amylase from refinery streams

Sugar Industry ◽

10.36961/si18170 ◽

2017 ◽

pp. 96-103 ◽

Cited By ~ 1

Author(s):

Gillian Eggleston ◽

Isabel Lima ◽

Emmanuel Sarir ◽

Jack Thompson ◽

John Zatlokovicz ◽

...

Keyword(s):

Activated Carbon ◽

High Temperature ◽

High Performance ◽

Activated Carbons ◽

Amylase Activity ◽

Sugar Industry ◽

End User ◽

Customer Complaints ◽

Carry Over ◽

Very High

In recent years, there has been increased world-wide concern over residual (carry-over) activity of mostly high temperature (HT) and very high temperature (VHT) stable amylases in white, refined sugars from refineries to various food and end-user industries. HT and VHT stable amylases were developed for much larger markets than the sugar industry with harsher processing conditions. There is an urgent need in the sugar industry to be able to remove or inactivate residual, active amylases either in factory or refinery streams or both. A survey of refineries that used amylase and had activated carbon systems for decolorizing, revealed they did not have any customer complaints for residual amylase. The use of high performance activated carbons to remove residual amylase activity was investigated using a Phadebas® method created for the sugar industry to measure residual amylase in syrups. Ability to remove residual amylase protein was dependent on the surface area of the powdered activated carbons as well as mixing (retention) time. The activated carbon also had the additional benefit of removing color and insoluble starch.

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