scholarly journals The DevelopingOf Electronic Teaching Media and Programming Using Printed Circuit Board Solventing

2020 ◽  
Vol 1 (4) ◽  
pp. 324-332
Author(s):  
Rahmat Hidayat ◽  
Reza Setiawan ◽  
Vera Pangni Fahriani ◽  
Enjang Ahmad Juanda ◽  
Rusman
Keyword(s):  
High School Students ◽  
Printed Circuit Board ◽  
Industrial Area ◽  
Circuit Board ◽  
Servo Motor ◽  
Vocational High School ◽  
Electronic Industry ◽  
School Students ◽  
Printed Circuit ◽  
Electronic Teaching

Karawang is one of the regency in West Java having many industrial area in Indonesia.One of the industrial field is electronic industry. This condition gives a chance to the graduatees of vocational High School students, especially electro major study, to gain an occupation and develop the entrepeneurship in the field of electronic  appliances industry in Karawang. This research uses the methods of “rancang bangun”. Sequencely, the method is a neccesity of identification needed. Then, this neccessity is analysed to obtain the specifically component. Furthermore, it is conducted soft and hard applicance design, making and testing. The result working from PCB based on the direction from a microcontroller Atmega8 which have to control the servo motor spin and calcuyate the process timing device work. Before the program is undergone, the  user have to reset the timer process solventing on the menu that can be set through LCD display.  After the program is undergone, so the device will be working as the well made program.Timer will be working as fast as possible after being pressed the “run” button. When the solventing has achieved the setting value or mark, so the microcontroller will direct the step timer motor to stop working on and the buzzer will stop ringing until the reset button pressed or power bottom turning down.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

EFEKTIVITAS METODE DEMONSTRASI DALAM MENINGKATKAN HASIL BELAJAR SISWA SEKOLAH MENENGAH KEJURUAN PADA PENGAJARAN SISTEM KOLOID

2013 ◽  
Vol 19 (1) ◽  
pp. 28
Author(s):  
Hamda Situmorang ◽  
Manihar Situmorang
Keyword(s):  
High School ◽  
High School Students ◽  
Abstract Concept ◽  
Vocational High School ◽  
School Students ◽  
Lecture Method ◽  
Colloid System ◽  
Before And After ◽  
The Right ◽  
And Control

Abstract Implementation of demonstration method in the teaching of chemistry is assigned as the right strategy to improve students’ achievement as it is proved that the method can bring an abstract concept to reality in the class. The study is conducted to vocational high school students in SMKN1 Pargetteng getteng Sengkut Pakfak Barat at accademic year 2013. The teaching has been carried out three cycles on the teaching of chemistry topic of colloid system. In the study, the class is divided into two class, experiment class and control class. The demontration method is used to teach students in experimental class while the teaching in control class is conducted with lecture method. Both are evaluated by using multiple choise tests before and after the teaching procedures, and the ability of students to answer the problems are assigned as students’ achievements. The results showed that demonstration method improved students’ achievement in chemistry. The students in experimental class who are taughed with demonstration method (M=19.08±0.74) have higher achievements compare with control class (M=12.91±2.52), and both are significantly different (tcalculation 22.85 > ttable 1.66). The effectivity of demostration method in experimental class (97%) is found higer compare to conventional method in control class (91%).

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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