PRODICUS ON CORRECTNESS OF NAMES

2020 ◽  
pp. 154-156
Author(s):  
Tatiana Suvorkina
Keyword(s):  
Moral Relativism ◽  
Area Of Interest ◽  
Deep Interest

Prodicus of Ceos was rightfully considered one of the most famous sophists of his time. However neither research in the field of rhetoric, nor examples of eloquence and sophisticated argumentation (although, undoubtedly, all this was also his area of interest) are his main legacy. This paper will focus on his method of comparing synony-mous words, which was used to determine their exact meaning and identify differences. This method was the result of a deep interest in the study of language and, perhaps, was a response to the skepticism of contemporaries about what can be considered real and the moral relativism that flowed from such views.

Image registration with a computer driven S.T.E.M.

1978 ◽  
Vol 36 (1) ◽  
pp. 98-99
Author(s):  
A.M.H. Schepman ◽  
J.A.P. van der Voort ◽  
J.E. Mellema
Keyword(s):  
Spot Size ◽  
Scanning Transmission Electron Microscope ◽  
Small Computer ◽  
Structural Studies ◽  
Area Of Interest ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Specimen Area ◽  
On Line ◽  
Minimum Distances

A Scanning Transmission Electron Microscope (STEM) was coupled to a small computer. The system (see Fig. 1) has been built using a Philips EM400, equipped with a scanning attachment and a DEC PDP11/34 computer with 34K memory. The gun (Fig. 2) consists of a continuously renewed tip of radius 0.2 to 0.4 μm of a tungsten wire heated just below its melting point by a focussed laser beam (1). On-line operation procedures were developped aiming at the reduction of the amount of radiation of the specimen area of interest, while selecting the various imaging parameters and upon registration of the information content. Whereas the theoretical limiting spot size is 0.75 nm (2), routine resolution checks showed minimum distances in the order 1.2 to 1.5 nm between corresponding intensity maxima in successive scans. This value is sufficient for structural studies of regular biological material to test the performance of STEM over high resolution CTEM.

Advanced TEM sample preparation techniques for submicron Si devices

1995 ◽  
Vol 53 ◽  
pp. 516-517 ◽  
Author(s):  
P. B. Basham ◽  
H. L. Tsai
Keyword(s):  
Sample Preparation ◽  
Process Development ◽  
Light Transmission ◽  
Specific Area ◽  
Turnaround Time ◽  
Small Hole ◽  
Area Of Interest ◽  
Transmission Electron ◽  
Polished Side ◽  
Preparation Techniques

The use of transmission electron microscopy (TEM) to support process development of advanced microelectronic devices is often challenged by a large amount of samples submitted from wafer fabrication areas and specific-spot analysis. Improving the TEM sample preparation techniques for a fast turnaround time is critical in order to provide a timely support for customers and improve the utilization of TEM. For the specific-area sample preparation, a technique which can be easily prepared with the least amount of effort is preferred. For these reasons, we have developed several techniques which have greatly facilitated the TEM sample preparation.For specific-area analysis, the use of a copper grid with a small hole is found to be very useful. With this small-hole grid technique, TEM sample preparation can be proceeded by well-established conventional methods. The sample is first polished to the area of interest, which is then carefully positioned inside the hole. This polished side is placed against the grid by epoxy Fig. 1 is an optical image of a TEM cross-section after dimpling to light transmission.

A technique for preparing semiconductor cross sections for both TEM and SEM analysis

1989 ◽  
Vol 47 ◽  
pp. 712-713
Author(s):  
Stanley J. Klepeis ◽  
J.P. Benedict ◽  
R.M Anderson
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Cross Sections ◽  
Sem Analysis ◽  
Preparation Technique ◽  
Ion Milling ◽  
Tem Analysis ◽  
Polished Cross Section ◽  
Area Of Interest ◽  
Polished Side

The ability to prepare a cross-section of a specific semiconductor structure for both SEM and TEM analysis is vital in characterizing the smaller, more complex devices that are now being designed and manufactured. In the past, a unique sample was prepared for either SEM or TEM analysis of a structure. In choosing to do SEM, valuable and unique information was lost to TEM analysis. An alternative, the SEM examination of thinned TEM samples, was frequently made difficult by topographical artifacts introduced by mechanical polishing and lengthy ion-milling. Thus, the need to produce a TEM sample from a unique,cross-sectioned SEM sample has produced this sample preparation technique.The technique is divided into an SEM and a TEM sample preparation phase. The first four steps in the SEM phase: bulk reduction, cleaning, gluing and trimming produces a reinforced sample with the area of interest in the center of the sample. This sample is then mounted on a special SEM stud. The stud is inserted into an L-shaped holder and this holder is attached to the Klepeis polisher (see figs. 1 and 2). An SEM cross-section of the sample is then prepared by mechanically polishing the sample to the area of interest using the Klepeis polisher. The polished cross-section is cleaned and the SEM stud with the attached sample, is removed from the L-shaped holder. The stud is then inserted into the ion-miller and the sample is briefly milled (less than 2 minutes) on the polished side. The sample on the stud may then be carbon coated and placed in the SEM for analysis.

Area of interest/field-of-view research using ASPT.

1978 ◽  
Author(s):  
W. Dean LeMaster ◽  
Thomas M. Longridge
Keyword(s):  
Field Of View ◽  
Area Of Interest

Buffalo Crusaders: The Sacred Struggle for America’s Last Wild and Pure Herd

2017 ◽  
Author(s):  
Justin Farrell
Keyword(s):  
Brucella Abortus ◽  
Direct Action ◽  
Moral Relativism ◽  
Religious Conflict ◽  
Field Campaign ◽  
Activist Group ◽  
Religious Dimensions ◽  
Post Hoc

This chapter examines the bitter, long-lasting, and sometimes violent dispute over the Yellowstone bison herd—America's only remaining genetically pure and free-roaming herd, which once numbered more than 30 million but was exterminated down to a mere 23 single animals. This intractable issue hinges on current scientific disagreements about the biology and ecology of the disease brucellosis (Brucella abortus). But in recent years, a more radical, grassroots, and direct action activist group called the Buffalo Field Campaign (BFC) has found success by shifting the focus of the debate away from science, toward the deeper religious dimensions of the issue. The chapter shows how the infusion of the conflict with moral and spiritual feeling has brought to the fore deeper questions that ultimately needed to be answered, thus making this a public religious conflict as much as a scientific one, sidestepping rabbit holes of intractability. It observes the ways in which BFC activists engaged in a phenomenon called moral and religious “muting.” This has theoretical implications for understanding how certain elements of culture (e.g., individualism and moral relativism) can organize and pattern others—especially in post hoc explanations of religiously motivated activism.

Failure Analysis Case Study of a 1.5 Meter Space Flex Harness

2017 ◽  
Author(s):  
Erick Kim ◽  
Kamjou Mansour ◽  
Gil Garteiz ◽  
Javeck Verdugo ◽  
Ryan Ross ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Field Of View ◽  
Area Of Interest ◽  
Air Stream ◽  
Novel Method ◽  
Temperature Controlled ◽  
Non Destructive ◽  
Failure Site

Abstract This paper presents the failure analysis on a 1.5m flex harness for a space flight instrument that exhibited two failure modes: global isolation resistances between all adjacent traces measured tens of milliohm and lower resistance on the order of 1 kiloohm was observed on several pins. It shows a novel method using a temperature controlled air stream while monitoring isolation resistance to identify a general area of interest of a low isolation resistance failure. The paper explains how isolation resistance measurements were taken and details the steps taken in both destructive and non-destructive analyses. In theory, infrared hotspot could have been completed along the length of the flex harness to locate the failure site. However, with a field of view of approximately 5 x 5 cm, this technique would have been time prohibitive.

LADA Synchronization for Symmetric and Asymmetric ATE Test Program Cycles

2019 ◽  
Author(s):  
Arun Kumar Karunanithi ◽  
Joseph Caroselli ◽  
Jason Christensen ◽  
Michell Espitia
Keyword(s):  
Cycle Time ◽  
Dwell Time ◽  
Turnaround Time ◽  
Test Program ◽  
Area Of Interest ◽  
Marginal State ◽  
Structural Failures ◽  
Major Factors ◽  
High Level ◽  
Program Cycle

Abstract Laser Assisted Device Alteration (LADA) or Soft Defect Localization (SDL) is commonly used to root cause device marginality due to functional or structural failures. At a high level, LADA involves setting the device under test (DUT) at its marginal state and using focused near infra-red laser beams to perturb sensitive circuitry [1]. Scanning the focused laser beam over the die can be a long and time-consuming process. In this paper, two LADA cases are presented, which involve a parametric measurement failure while running a dynamic ATE test. Using LADA technique, these two cases were root caused. These two cases also explain how a parametric measurement-based LADA can be setup on ATE, as well as a synchronization method independent of vectors in a pattern. Synchronization was necessitated in the 2nd case due to the asymmetric test program loop, as well as the long test program cycle time. There are many factors which impact LADA turnaround time and it can take anywhere between few seconds to one day. The two major factors are the size of the Area of Interest (AOI) and test program cycle time. Test program cycle time influences the laser “dwell time” for LADA. Dwell time, in simple terms, is the total time the laser is parked at each pixel. The laser can also be synchronized with the test program cycle, keeping the two always in phase. This is explained in Case 2, where LADA synchronization was implemented, and the analysis was successfully completed in time, even though the test cycle time was very long.

Investigation of Die Tilting of Packages with Single and Multi-chips

2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Optical Microscopy ◽  
Device Performance ◽  
Electronic Components ◽  
Area Of Interest ◽  
On Chip ◽  
Scanning Electron

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

Sample Preparation and Preservation for TEM Analysis of Copper Interconnect Integrated Circuit

2004 ◽  
Author(s):  
Qiang Gao ◽  
Mark Zhang ◽  
Ming Li ◽  
Chorng Niou ◽  
W.T. Kary Chien
Keyword(s):  
Integrated Circuit ◽  
Thermal Exposure ◽  
Ambient Atmosphere ◽  
Ion Milling ◽  
Tem Analysis ◽  
Single Beam ◽  
Copper Interconnect ◽  
Beam Modulation ◽  
Area Of Interest ◽  
Transmission Electron

Abstract This paper examines copper-interconnect integrated circuit transmission electron microscope (TEM) sample contamination. It investigates the deterioration of the sample during ion milling and storage and introduces prevention techniques. The paper discusses copper grain agglomeration issues barrier/seed step coverage checking. The high temperature needed for epoxy solidifying was found to be harmful to sidewall coverage checking of seed. Single beam modulation using a glass dummy can efficiently prevent contamination of the area of interest in a TEM sample during ion milling. Adoption of special low-temperature cure epoxy resin can greatly reduce thermal exposure of the sample and prevent severe agglomeration of copper seed on via sidewall. TEM samples containing copper will deteriorate when stored in ordinary driers and sulphur contamination was found at the deteriorated point on the sample. Isolation of the sample from the ambient atmosphere has been verified to be very effective in protecting the TEM sample from deterioration.

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