scholarly journals DESIGN OF ULTRAWIDEBAND MONOPOLE ANTENNA WITH MINIMUM GROUND PLANE EFFECT

Author(s):  
PRAVEEN K P ◽  
T MARY NEEBHA

A Planar ultra wideband antenna design is analyzed for increased impedance matching in the Ultrawideband (UWB) range (3.1GHz to 10.6GHz). Also the effect of the ground plane is minimized by cutting slot on the ground plane. Impedance matching of Ultrawideband (UWB) antenna can be improved by introducing simple microstrip transitions between the 50-ohm feed line and the printed disc. In this paper a dual step feed is proposed between the feed line and radiator. It also offers a very simple geometry suitable for low cost fabrication and straightforward printed circuit board integration. Here triangle slot is provided on the ground plane in order to reduce the ground plane effect. The radiator used here is elliptical disc.

2012 ◽  
Vol 195-196 ◽  
pp. 13-16
Author(s):  
Wen Bo Zeng ◽  
Jia Zhao ◽  
Bao Zhong Ke ◽  
Qi Qi Wu

An ultra-wideband (UWB) printed antenna with dual band-notched characteristic is presented in this paper. The proposed antenna is composed of a semi-circular patch fed by a tapered coplanar waveguide (CPW) and an unclosed ground plane, which are printed onto the same side of a FR4 printed circuit board (PCB) with an overall size of 30 mm × 30 mm × 1.5 mm. By embedding a simple arc-shaped slot in the patch and adding a T-shaped strip on the top of the patch, two notched frequency bands for rejection of WiMAX and WLAN system can be realized. The characteristics of the proposed antenna are investigated by using the software HFSS and validated experimentally, both simulated and measured results show that the proposed antenna prototype achieves good impedance matching over an frequency band from 2.1011.40 GHz for VSWR2 with two notched bands over the frequency range of 5-5.95 GHz and 3.1-3.9 GHz. Furthermore, a relatively stable gain and suitable radiation patterns are also achieved in both lower and upper UWB frequency band.


2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.


Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.


Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.


2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.


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