scholarly journals ANALYTICAL MODEL OF TEMPERATURE DISTRIBUTION OVER AN ELECTRONIC CIRCUIT BOARD

2003 ◽  
Vol 2 (1) ◽  
pp. 32 ◽  
Author(s):  
V. V. Vlassov
Keyword(s):  
Temperature Distribution ◽  
Electronic Circuit ◽  
Integral Transform ◽  
Heat Conduction Problem ◽  
Circuit Board ◽  
Multiple Sources ◽  
Temperature Dependent ◽  
Closed Expression ◽  
Driver Plate ◽  
Steady State Heat

The thermal model of an electronic circuit board with installed heat dissipating components is presented as a two-dimension steady-state heat conduction problem with multiple sources distributed over a rectangular region. The corresponding energy equation includes a source term and a temperature-dependent term to account for linear heat transfer in z-direction. Boundary conditions are of first type with unique temperature along the perimeter. The integral-transform technique is applied to obtain closed-form integral solution. Assuming that all dissipated components have a rectangular contact area with the plate, multiple integrals for each dissipated sub-region are easily found. A temperature map over the board is calculated from the closed expression with a triple sum of series with respect to each coordinate and source. The error is evaluated by the estimation of the truncated terms. The solution was applied to obtain the temperature distribution over the electronic Driver Plate of the CEP block of the CIMEX Brazilian experiment for flight qualifying of the Optical Block Detector Assembling.

scholarly journals ANALYTICAL MODEL OF TEMPERATURE DISTRIBUTION OVER AN ELECTRONIC CIRCUIT BOARD

2003 ◽  
Vol 2 (1) ◽  
Author(s):  
V. V. Vlassov
Keyword(s):  
Temperature Distribution ◽  
Electronic Circuit ◽  
Integral Transform ◽  
Heat Conduction Problem ◽  
Circuit Board ◽  
Multiple Sources ◽  
Temperature Dependent ◽  
Closed Expression ◽  
Driver Plate ◽  
Steady State Heat

The thermal model of an electronic circuit board with installed heat dissipating components is presented as a two-dimension steady-state heat conduction problem with multiple sources distributed over a rectangular region. The corresponding energy equation includes a source term and a temperature-dependent term to account for linear heat transfer in z-direction. Boundary conditions are of first type with unique temperature along the perimeter. The integral-transform technique is applied to obtain closed-form integral solution. Assuming that all dissipated components have a rectangular contact area with the plate, multiple integrals for each dissipated sub-region are easily found. A temperature map over the board is calculated from the closed expression with a triple sum of series with respect to each coordinate and source. The error is evaluated by the estimation of the truncated terms. The solution was applied to obtain the temperature distribution over the electronic Driver Plate of the CEP block of the CIMEX Brazilian experiment for flight qualifying of the Optical Block Detector Assembling.

Thermal Math Modeling and Analysis of an Electronic Assembly

2000 ◽  
Vol 123 (4) ◽  
pp. 372-378 ◽  
Author(s):  
K. N. Shukla
Keyword(s):  
Temperature Distribution ◽  
Integral Transform ◽  
Three Dimensional ◽  
Thermal Characteristics ◽  
Circuit Board ◽  
Heat Sources ◽  
The Finite Element Method ◽  
Modeling And Analysis ◽  
Discrete Surface ◽  
Integral Transform Technique

This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function.

scholarly journals Nonlinear Solution to a Non-Fourier Heat Conduction Problem in a Slab Heated by Laser Source

2016 ◽  
Vol 63 (1) ◽  
pp. 129-144
Author(s):  
Mohammad Javad Noroozi ◽  
Seyfolah Saedodin ◽  
Davood Domiri Ganji
Keyword(s):  
Heat Conduction ◽  
Heat Conduction Problem ◽  
Adomian Decomposition Method ◽  
Laser Source ◽  
Temperature Dependent ◽  
Conduction Model ◽  
Non Linear Equation ◽  
Adomian Decomposition ◽  
Non Linear ◽  
Fourier Heat Conduction

Abstract The effect of laser, as a heat source, on a one-dimensional finite body was studied in this paper. The Cattaneo-Vernotte non-Fourier heat conduction model was used for thermal analysis. The thermal conductivity was assumed temperature-dependent which resulted in a non-linear equation. The obtained equations were solved using the approximate-analytical Adomian Decomposition Method (ADM). It was concluded that the non-linear analysis is important in non-Fourier heat conduction problems. Significant differences were observed between the Fourier and non-Fourier solutions which stresses the importance of non-Fourier solutions in the similar problems.

Steady-State Thermal Stresses in Wedge-Shaped Cutting Tools

1975 ◽  
Vol 97 (3) ◽  
pp. 1060-1066
Author(s):  
P. F. Thomason
Keyword(s):  
Thermal Stress ◽  
Steady State ◽  
Metal Cutting ◽  
Thermal Stresses ◽  
Heat Conduction Problem ◽  
Equivalent Stress ◽  
Cutting Tools ◽  
Thermoelastic Stress ◽  
Plastic State ◽  
Steady State Heat

Closed form expressions for the steady-state thermal stresses in a π/2 wedge, subject to constant-temperature heat sources on the rake and flank contact segments, are obtained from a conformal mapping solution to the steady-state heat conduction problem. It is shown, following a theorem of Muskhelishvili, that the only nonzero thermal stress in the plane-strain wedge is that acting normal to the wedge plane. The thermal stress solutions are superimposed on a previously published isothermal cutting-load solution, to give the complete thermoelastic stress distribution at the wedge surfaces. The thermoelastic stresses are then used to determine the distribution of the equivalent stress, and this gives an indication of the regions on a cutting tool which are likely to be in the plastic state. The results are discussed in relation to the problems of flank wear and rakeface crater wear in metal cutting tools.

Electrothermal analysis of integrated circuits: a realization by infrared thermography

2021 ◽  
Author(s):  
Farnoos Farrokhi
Keyword(s):  
Temperature Distribution ◽  
Integrated Circuits ◽  
Power Dissipation ◽  
Electronic Device ◽  
Power Measurement ◽  
Device Under Test ◽  
Distribution Analysis ◽  
Ir Thermography ◽  
Temperature Dependent ◽  
Run Time

The International Technology Roadmap for Silicon (ITRS) predicted that by the year 2016, a high-performance chip could dissipate as much as 300 W/cm² of heat. Another more noticeable thermal issue in IC's is the uneven temperature distribution. Increased power dissipation and greater temperature variation highlight the need for electrothermal analysis of electronic components. The goal of this research is to develop an experimental infrared measurement technique for the thermal and electrothermal analysis of electronic circuits. The objective of the electrothermal analysis is to represent the behavior of the temperature dependent characteristics of electronic device in near real work condition. An infrared (IR) thermography setup to perform the temperature distribution analysis and power dissipation measurement of the device under test is proposed in this reasearch. The system is based on a transparent oil heatsink which captures the thermal profile and run-time power dissipation from the device under test with a very fine degree of granularity. The proposed setup is used to perform the thermal analysis and power measurement of an Intel Dual Core E2180 processor. The power dissipation of the processor is obtained by calculating and measuring the heat transfer coefficient of the oil heatsink. Moreover, the power consumption of the processor is measured by isolating the current used by the CPU at run time. A three-dimensional fininte element thermal model is developed to simulate the thermal properties of the processor. The results obtained using this simulation is compared to the experimental results from IR thermography. A methodology to perform electrothermal analysis on integrated circuits is introduced. This method is based on coupling a standard electrical simulator, which is often used in the design process, and IR thermography system through an efficient interface program. The proposed method is capable of updating the temperature dependent parameters of device in near real time. The proposed method is applied to perform electrothermal analysis of a power MOSFET to measure the temperature distribution and the device performance. The DC characteristics of the device are investigated. The obtained results indicated that the operating point, I-V characteristics and power dissipation of the MOSFET vary significantly with temperature.

Transient Conjugated Conduction: External Convection With Front Face Imposed Wall Heat Flux

2007 ◽  
Author(s):  
Carolina P. Naveira ◽  
Renato M. Cotta ◽  
Mohammed Lachi ◽  
Jacques Padet
Keyword(s):  
Heat Flux ◽  
Integral Transform ◽  
Heat Conduction Problem ◽  
Solid Wall ◽  
Method Of Lines ◽  
Wall Heat Flux ◽  
Front Face ◽  
Flat Plates ◽  
Partial Differential ◽  
Differential Formulation

This work presents hybrid numerical-analytical solutions for transient laminar forced convection over flat plates of non-negligible thickness, subjected to arbitrary time variations of applied wall heat flux at the interface fluid-solid wall. This conjugated conduction-convection problem is first simplified through the employment of the Coupled Integral Equations Approach (CIEA) to reformulate the heat conduction problem on the plate by averaging the related energy equation in the transversal direction. As a result, a partial differential formulation for the average wall temperature is obtained, while a third kind boundary condition is achieved for the fluid in the heat balance at the solid-fluid interface. From the available velocity distributions, the solution method is then proposed for the coupled partial differential equations, based on the Generalized Integral Transform Technique (GITT) under its partial transformation mode, combined with the method of lines implemented in the Mathematica 5.2 routine NDSolve.

Electrochemical Investigation Cu Corrosion Behaviour of Electronic Circuit Board in Base Electrolyte

2014 ◽  
Vol 556-562 ◽  
pp. 141-144
Author(s):  
Zhi Hua Tao ◽  
Bin Leng ◽  
Chong Wang ◽  
Ding Jun Xiao ◽  
Ze Tan ◽  
...  
Keyword(s):  
Potentiodynamic Polarization ◽  
Electronic Circuit ◽  
Corrosion Behaviour ◽  
Chloride Ions ◽  
Circuit Board ◽  
Corrosion Mechanism ◽  
Base Electrolyte ◽  
Eis Measurements ◽  
Inhibition Performance ◽  
Cu Corrosion

The eleetronic material, or even the whole equipments may be destroyed by very slight corrosion, so it is important to study the corrosion mechanism and corrosion protections. The Cyproconazole as a Cu corrosion inhibitor for Electronic Circuit Board in the base electrolyte (containing 70 ppm chloride ions, 0.54 mol/L H2SO4and 0.8 mol/L CuSO4) was investigated using polarization curves and AC impedance. The results showed that the inhibition performance of the Cyproconazole depended on the concentration of the inhibitor and the highest inhibition efficiency of the Cyproconazole reached 99.9% at 1×10-3mol/L in the base electrolyte. The results obtained from EIS measurements are in good agreement with that obtained from potentiodynamic polarization. Potentiodynamic polarization studies clearly revealed that Cyproconazole adsorption acted essentially as the mixed-type inhibitor.

Sign in / Sign up

Export Citation Format

Share Document