Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique

Abstract IR-OBIRCH (Infrared Ray – Optical Beam Induced Resistance Change) is one of the main failure analysis techniques [1] [2] [3] [4]. It is a useful tool to do fault localization on leakage failure cases such as poor Via or contact connection, FEoL or BEoL pattern bridge, and etc. But the real failure sites associated with the above failure mechanisms are not always found at the OBIRCH spot locations. Sometimes the real failure site is far away from the OBIRCH spot and it will result in inconclusive PFA Analysis. Finding the real failure site is what matters the most for fault localization detection. In this paper, we will introduce one case using deep sub-micron process generation which suffers serious high Isb current at wafer donut region. In this case study a BEoL Via poor connection is found far away from the OBIRCH spots. This implies that layout tracing skill and relation investigation among OBIRCH spots are needed for successful failure analysis.

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Case Study in Fault Isolation of a Metal Short for Yield Enhancement

ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2010p0049 ◽

2010 ◽

Author(s):

Sarven Ipek ◽

David Grosjean

Keyword(s):

Failure Analysis ◽

Failure Mechanism ◽

Photon Emission ◽

Fault Isolation ◽

Yield Enhancement ◽

Analysis Technique ◽

Laser Signal ◽

Signal Injection ◽

Microscopy Techniques

Abstract The application of an individual failure analysis technique rarely provides the failure mechanism. More typically, the results of numerous techniques need to be combined and considered to locate and verify the correct failure mechanism. This paper describes a particular case in which different microscopy techniques (photon emission, laser signal injection, and current imaging) gave clues to the problem, which then needed to be combined with manual probing and a thorough understanding of the circuit to locate the defect. By combining probing of that circuit block with the mapping and emission results, the authors were able to understand the photon emission spots and the laser signal injection microscopy (LSIM) signatures to be effects of the defect. It also helped them narrow down the search for the defect so that LSIM on a small part of the circuit could lead to the actual defect.

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Test Circuit Conditioning for Soft Defect Localization

ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2014p0396 ◽

2014 ◽

Author(s):

Kristopher D. Staller ◽

Corey Goodrich

Keyword(s):

Laser Beam ◽

Failure Analysis ◽

Signal Frequency ◽

Dynamic Failure ◽

The Third ◽

Analysis Technique ◽

Test Circuit ◽

Defect Localization ◽

Manual Input ◽

Fast Dynamic

Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM tool. Most failure analysis LSM sessions use the endo-thermic mode (TIVA, XIVA, OBIRCH), followed by the photo-injection mode (LIVA) to isolate most of their failures. SDL is seldom used or attempted, unless there is a unique and obvious failure mode that can benefit from the application. Many failure analysts, with a creative approach to the analysis, can employ SDL. They will benefit by rapidly finding the location of the failure mechanism and forgoing weeks of nodal probing and isolation. This paper will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM for laser stimulation. Discussions of several cases will demonstrate how the laser can be employed for triggering across a pass/fail boundary as defined by voltage levels, supply currents, signal frequency, or digital flags. A technique for manual input of the LSM trigger is also discussed.

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A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Microelectronics Reliability ◽

10.1016/j.microrel.2009.08.008 ◽

2010 ◽

Vol 50 (1) ◽

pp. 116-126 ◽

Cited By ~ 36

Author(s):

Dominik Herkommer ◽

Jeff Punch ◽

Michael Reid

Keyword(s):

Thermal Cycling ◽

Reliability Model ◽

Mechanical Cycling ◽

Sac Solder

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A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

ASME 2007 InterPACK Conference, Volume 1 ◽

10.1115/ipack2007-33271 ◽

2007 ◽

Cited By ~ 1

Author(s):

X. Long ◽

I. Dutta ◽

R. Guduru ◽

R. Prasanna ◽

M. Pacheco

Keyword(s):

Thermal Cycling ◽

Solder Joints ◽

Low Cycle Fatigue ◽

Inelastic Strain ◽

Fatigue Reliability ◽

Element Analysis ◽

Mechanical Cycling ◽

Experimental Apparatus ◽

Dependent Strain ◽

Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

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Progressive Failure Analysis in Open-Hole Tensile Composite Laminates of Airplane Stringers Based on Tests and Simulations

Applied Sciences ◽

10.3390/app11010185 ◽

2020 ◽

Vol 11 (1) ◽

pp. 185

Author(s):

Jian Shi ◽

Mingbo Tong ◽

Chuwei Zhou ◽

Congjie Ye ◽

Xindong Wang

Keyword(s):

Failure Analysis ◽

Composite Laminates ◽

Progressive Failure ◽

Tensile Load ◽

Fiber Failure ◽

Stress Criterion ◽

Progressive Failure Analysis ◽

Analysis Technique ◽

Open Hole ◽

Failure Types

The failure types and ultimate loads for eight carbon-epoxy laminate specimens with a central circular hole subjected to tensile load were tested experimentally and simulated using two different progressive failure analysis (PFA) methodologies. The first model used a lamina level modeling based on the Hashin criterion and the Camanho stiffness degradation theory to predict the damage of the fiber and matrix. The second model implemented a micromechanical analysis technique coined the generalized method of cells (GMC), where the 3D Tsai–Hill failure criterion was used to govern matrix failure, and the fiber failure was dictated by the maximum stress criterion. The progressive failure methodology was implemented using the UMAT subroutine within the ABAQUS/implicit solver. Results of load versus displacement and failure types from the two different models were compared against experimental data for the open hole laminates subjected to tensile displacement load. The results obtained from the numerical simulation and experiments showed good agreement. Failure paths and accurate damage contours for the tested specimens were also predicted.

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Nanomachining with a focused neon beam: A preliminary investigation for semiconductor circuit editing and failure analysis

Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena ◽

10.1116/1.3660797 ◽

2011 ◽

Vol 29 (6) ◽

pp. 06F604 ◽

Cited By ~ 27

Author(s):

Shida Tan ◽

Richard Livengood ◽

Paul Hack ◽

Roy Hallstein ◽

Darryl Shima ◽

...

Keyword(s):

Failure Analysis ◽

Preliminary Investigation

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Design and Reliability in Electronic Packaging Including Power Temperature Cycling and Vibration Effects

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35353 ◽

2003 ◽

Cited By ~ 1

Author(s):

Mark D. Nickerson ◽

Chandrakant S. Desai

Keyword(s):

Finite Element ◽

Failure Analysis ◽

Thermal Cycling ◽

Temperature Cycling ◽

Damage Models ◽

Disturbed State Concept ◽

Solder Balls ◽

Element Failure ◽

Viscoplastic Models ◽

Cycles To Failure

Thermomechanical, power temperature cycling (PTC) and vibration analyses were performed on a 313 staggered pin PBGA package using plastic and viscoplastic disturbed-state damage models. An accelerated finite element failure analysis was performed using a newly developed procedure. Validations were performed using published PBGA test data. The disturbed state concept was used to model the disturbance (damage) accumulated in PBGA solder joints subjected to thermal cycling (PTC and TCT), vibration, and vibration coupled with three distinct temperatures. 2D FEA plastic and viscoplastic models were created based on a diagonal “slice” of the PBGA. This allowed the most critical solder balls (under the die and furthest DNP) to be analyzed in the same model. The thermal cycling results indicate that the solder balls under the die are the most likely to fail. The vibration results indicate the solder balls furthest from the package center are most likely to fail. The vibration results, coupled with distinct isothermal temperatures, indicate that as temperature increases, the cycles to failure decreases.

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