Electrical characteristics of ohmic contact on n-type in situ doped GeSiSn

2018 ◽  
Vol 57 (10) ◽  
pp. 106504
Author(s):  
Yongwang Zhang ◽  
Jun Zheng ◽  
Zhi Liu ◽  
Chunlai Xue ◽  
Chuanbo Li ◽  
...  
Author(s):  
F. M. Ross ◽  
R. Hull ◽  
D. Bahnck ◽  
J. C. Bean ◽  
L. J. Peticolas ◽  
...  

We describe an investigation of the electrical properties of interfacial dislocations in strained layer heterostructures. We have been measuring both the structural and electrical characteristics of strained layer p-n junction diodes simultaneously in a transmission electron microscope, enabling us to correlate changes in the electrical characteristics of a device with the formation of dislocations.The presence of dislocations within an electronic device is known to degrade the device performance. This degradation is of increasing significance in the design and processing of novel strained layer devices which may require layer thicknesses above the critical thickness (hc), where it is energetically favourable for the layers to relax by the formation of misfit dislocations at the strained interfaces. In order to quantify how device performance is affected when relaxation occurs we have therefore been investigating the electrical properties of dislocations at the p-n junction in Si/GeSi diodes.


Sensors ◽  
2021 ◽  
Vol 21 (17) ◽  
pp. 5887
Author(s):  
Linlin Shi ◽  
Hong Wang ◽  
Xiaohui Ma ◽  
Yunpeng Wang ◽  
Fei Wang ◽  
...  

The realization of electrically pumped emitters at micro and nanoscale, especially with flexibility or special shapes is still a goal for prospective fundamental research and application. Herein, zinc oxide (ZnO) microwires were produced to investigate the luminescent properties affected by stress. To exploit the initial stress, room temperature in situ elastic bending stress was applied on the microwires by squeezing between the two approaching electrodes. A novel unrecoverable deformation phenomenon was observed by applying a large enough voltage, resulting in the formation of additional defects at bent regions. The electrical characteristics of the microwire changed with the applied bending deformation due to the introduction of defects by stress. When the injection current exceeded certain values, bright emission was observed at bent regions, ZnO microwires showed illumination at the bent region priority to straight region. The bent emission can be attributed to the effect of thermal tunneling electroluminescence appeared primarily at bent regions. The physical mechanism of the observed thermoluminescence phenomena was analyzed using theoretical simulations. The realization of electrically induced deformation and the related bending emissions in single microwires shows the possibility to fabricate special-shaped light sources and offer a method to develop photoelectronic devices.


2006 ◽  
Vol 111 (3) ◽  
pp. 1180-1185 ◽  
Author(s):  
Congkang Xu ◽  
Junghwan Chun ◽  
Hyo Jin Lee ◽  
Yoon Hee Jeong ◽  
Seong-Eok Han ◽  
...  

2003 ◽  
Vol 82 (5) ◽  
pp. 736-738 ◽  
Author(s):  
H. Tang ◽  
J. A. Bardwell ◽  
J. B. Webb ◽  
S. Rolfe ◽  
Y. Liu ◽  
...  

2000 ◽  
Vol 380 (1-2) ◽  
pp. 57-60 ◽  
Author(s):  
Takaaki Noda ◽  
Doohwan Lee ◽  
Hyunyoung Shim ◽  
Masao Sakuraba ◽  
Takashi Matsuura ◽  
...  

2014 ◽  
Vol 61 (8) ◽  
pp. 2774-2778 ◽  
Author(s):  
Quang Ho Luc ◽  
Edward Yi Chang ◽  
Hai Dang Trinh ◽  
Yueh Chin Lin ◽  
Hong Quan Nguyen ◽  
...  

1993 ◽  
Vol 57 (1) ◽  
pp. 3848-3852 ◽  
Author(s):  
Kyu-Jong Lee ◽  
Kil-ho Kim ◽  
Seung-Ryeol Kim ◽  
Gi-Yoong Tae ◽  
Jong-Duk Kim

1996 ◽  
Vol 423 ◽  
Author(s):  
E. D. Luckowski ◽  
J. R. Williams ◽  
M. J. Bozack ◽  
T. Isaacs-Smith ◽  
J. Crofton

AbstractResults are reported for ohmic contacts formed on n-type 4H and 6H-SiC using nichrome (80/20 weight percent Ni/Cr). In comparison to contacts formed on 6H-SiC using pure Ni, the electrical characteristics of these NiCr contacts are similar (∼ 1E-5 Ω-cm2 for moderately doped material), and composite Au/NiCr contacts exhibit good stability during long-term anneals (∼ 2500 hr) at 300 C without the requirement of a diffusion barrier layer between the ohmic contact layer and the Au cap layer. The use of NiCr also results in success rates near 100% for direct wire bonding to the Au cap layers.


2013 ◽  
Vol 22 (10) ◽  
pp. 1340021 ◽  
Author(s):  
XIAOXU KANG ◽  
JIAQING LI ◽  
CHAO YUAN ◽  
SHOUMIAN CHEN ◽  
YUHANG ZHAO

In this work, TaN bottom electrode thermal sensing resistor for MEMs-based bolometer was designed and fabricated by 200 mm Cu -BEOL compatible process. Thermal sensing material was B -doped alpha- Si deposited by PECVD in situ doping process. PVD TaN film was used as the bottom electrode. Dedicated process on modified tool was introduced to achieve a good contact between the TaN and the sensing material. There are both CVD and Etch chambers installed on this modified tool. Wafer with bottom electrode pattern was pre-cleaned firstly by low-power Ar /CF4 gas to remove oxide and possible surface residue on TaN in the etch chamber. Then, the wafer was transferred to CVD chamber through transfer chamber in vacuum condition. With vacuum transfer condition under tight Q-time control, Ohmic contact can be achieved for the TaN bottom electrode and B -doped alpha- Si . Through the IV curve and TCR data, it can be seen that the bottom electrode device can well meet the MEMs-based bolometer requirements.


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