Evaluation of PECVD a-SiC:H as a Cu Diffusion Barrier Layer of Cu Dual Damascene Process
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2001 ◽
Vol 40
(Part 1, No. 4B)
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pp. 2663-2668
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1996 ◽
Vol 35
(Part 1, No. 2B)
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pp. 1086-1089
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2008 ◽
Vol 595-598
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pp. 107-116
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Influence of crystallinity on the oxidation resistance of Ni–Al film used as diffusion barrier layer
2009 ◽
Vol 42
(6)
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pp. 065419
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2017 ◽
Vol 344
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pp. 141-151
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2016 ◽
Vol 2016
(4)
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pp. 36-44
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2021 ◽
Vol 21
(8)
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pp. 4498-4502
2016 ◽
Vol 307
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pp. 385-390
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