Simple Models on Enhancement of Mechanical Properties of Porous Silica Low-k Films by Tetramethylcyclotetrasiloxane(TMCTS) Vapor Annealing Treatment

2004 ◽  
Author(s):  
Yutaka Seino ◽  
Rie Ichikawa ◽  
Yuko Takasu ◽  
Kazuo Kohmura ◽  
Hirofumi Tanaka ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Porous Silica ◽  
Annealing Treatment ◽  
Vapor Annealing ◽  
Low K ◽  
Simple Models

Effect of Plasma Treatment and TMCTS Vapor Annealing on the Reinforcement of Porous low-k Films

2005 ◽  
Vol 863 ◽  
Author(s):  
Kazuo Kohmura ◽  
Hirofumi Tanaka ◽  
Shunsuke Oike ◽  
Masami Murakami ◽  
Tetsuo Ono ◽  
...  
Keyword(s):  
Mechanical Strength ◽  
Plasma Treatment ◽  
Polymer Network ◽  
Porous Silica ◽  
Argon Plasma ◽  
Silica Films ◽  
Oh Groups ◽  
Vapor Annealing ◽  
Silica Wall ◽  
Low K

AbstractA novel process of TMCTS vapor annealing combined with a plasma treatment has been developed for improving the mechanical strength of porous silica films having ultralow dielectric constant. When porous silica films annealed under 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) vapor were treated with argon plasma and then re-treated with TMCTS vapor, the mechanical strength (i.e., elastic modulus, hardness) of the films increased significantly. Results of Fourier transform infrared spectroscopy (FT-IR) suggested an accelerative effect resulted from the plasma treatment on the conversion of Si-CH3 and Si-H groups to Si-OH groups. The latter group appears to react faster with TMCTS from the second annealing to form cross-linked polymer network on the porous silica wall surfaces. The resulting cross-linked network is thought to keep the low permittivity and enhance the mechanical strength of the low-k films.

A Novel Organosiloxane Vapor Annealing Process for Improving Elastic Modulus of Porous Low-k Films

2004 ◽  
Vol 812 ◽  
Author(s):  
Kazuo Kohmura ◽  
Shunsuke Oike ◽  
Masami Murakami ◽  
Hirofumi Tanaka ◽  
Syozo Takada ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Mechanical Strength ◽  
Porous Silica ◽  
Thermal Desorption Spectroscopy ◽  
Silica Film ◽  
Low Dielectric ◽  
Porous Silica Film ◽  
Vapor Annealing ◽  
Ft Ir ◽  
Low K

AbstractA novel organosiloxane-vapor-annealing method has been developed for improving the mechanical strength of porous silica films with a low dielectric constant. Treatment of a porous silica film with 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) under atmospheric nitrogen above 350 °C significantly enhanced the mechanical strength (i.e., elastic modulus and hardness) of the film. Results of Fourier transform infrared spectroscopy (FT-IR) and thermal desorption spectroscopy (TDS) suggested the formation of cross-linked poly(TMCTS) network on the porous silica internal wall surfaces by the TMCTS treatment. Such TMCTS cross-linked network is thought to enhance the mechanical strength of the low-k film.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

Mechanical Properties and Porosity of Organo-Silicate Glass (OSG) Low-k Dielectric Films

2001 ◽  
Vol 695 ◽  
Author(s):  
J. B. Vella ◽  
Q. Xie ◽  
N. V. Edwards ◽  
J. Kulik ◽  
K. H. Junker
Keyword(s):  
Mechanical Properties ◽  
Photoelectron Spectroscopy ◽  
Elastic Moduli ◽  
Porous Silica ◽  
Material Behavior ◽  
Dielectric Films ◽  
X Ray ◽  
Transmission Electron ◽  
Microelectronics Industry ◽  
Low K

ABSTRACTLow-k material integration issues that plague the microelectronics industry include the compromise in mechanical properties that one incurs in abandoning fully dense silica dieletrics. Typical elastic moduli of OSG low-k dieletric films are 2-10 GPa with corresponding hardnesses of 0.5 to 1.5 GPa. In the present study, the hardness and elastic modulus properties measured by nanoindentation of porous silica based low-k films are correlated with in initial estimates of density using a novel technique of spectroscopic ellispsometry. Transmission electron microscopy and X-ray photoelectron spectroscopy show the structural and chemical similarity of the films. Nanoindentation and spectroscopic ellipsometry results reflect significant deviations in material behavior from that expected from a simple model of silica (SiO2) with included voids or porosity, suggesting that the methyl groups are actively participating in the mechanical and optical properties of the material.

Recovery of Process-induced Damages of Porous Silica Low- k Films by TMCTS Vapor Annealing

2004 ◽  
Author(s):  
Y. Oku ◽  
N. Fujii ◽  
Y. Seino ◽  
Y. Takasu ◽  
H. Takahashi ◽  
...  
Keyword(s):  
Porous Silica ◽  
Vapor Annealing ◽  
Low K

scholarly journals Full characterization of ultrathin 5-nm low- k dielectric bilayers: Influence of dopants and surfaces on the mechanical properties

2020 ◽  
Vol 4 (7) ◽  
Author(s):  
Travis D. Frazer ◽  
Joshua L. Knobloch ◽  
Jorge N. Hernández-Charpak ◽  
Kathleen M. Hoogeboom-Pot ◽  
Damiano Nardi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Full Characterization ◽  
Low K
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