Wafer Preparation Parameter Optimization for Wafer Defects Elimination
In every new technology developed and introduced to the manufacturing floor, particularly in the wafer preparation, entails problems that later induce defects affecting the wafer yield. This paper discusses the optimization of wafer preparation parameters, particularly the tensionless backgrinding tape lamination and DAF cut vacuum control, that mitigates wafer yield detractors such as edge cut, kerf shift and dice pop-out. Based on the evaluation results, tensionless backgrinding lamination affects the kerf shifting and edge cutting, and with proper vacuum control to attain zero dice pop-out process.
2007 ◽
Vol 359-360
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pp. 559-563
1983 ◽
Vol 41
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pp. 86-89
Keyword(s):
1975 ◽
Vol 33
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pp. 86-87
A Qualitative Examination of User Perceptions of User-Driven and App-Controlled Hearing Technologies
2019 ◽
Vol 28
(4)
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pp. 993-1005
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Keyword(s):
1989 ◽
Vol 22
(1)
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pp. 75-87