Normally-off GaN HEMTs with InGaN p-gate cap layer formed by polarization doping

Narrow gate margin has been the critical limiting factor for the p-gate normally-off GaN HEMTs, imposing significant challenges in both gate-drive design and gate reliability. In this work, by developing dopant-free p-type polarization doping technique in composition-graded InGaN layer, high-quality Schottky contact between the gate metal and cap layer was demonstrated, achieving excellent gate current blocking performance (10-6 mA/mm) after the turning-on of the gate heterojunction structure. Resultantly, normally-off GaN HEMTs with enhanced gate breakdown voltage up to 15.2 V was realized, being especially beneficial for the simplification of gate drive design and the safe operation of gate terminal.

Stress engineering for reducing the injection current induced blue shift in InGaN-based red light-emitting diodes

Red LEDs with a small blue shift are fabricated by using a stress engineering strategy through the growth of the pre-stained InGaN layer and dual-wavelength QWs on a cone-shape patterned sapphire substrate.