Mechanical and microstructure property evaluation of diffusion bonding of 5083, 6061 and 7075 aluminium to AZ31 magnesium using Cu interlayer

Author(s):  
Nader Nadermanesh ◽  
Abdolhamid Azizi ◽  
Sahebali Manafi

The diffusion bonding of 7075, 6061 and 5083 aluminium alloys to AZ31B magnesium was investigated using copper interlayer. An optical microscope along with scanning electron microscopes, equipped with an energy dispersive spectrometry/electron probe microanalysis, was utilized to characterize the microstructure of the joint. The mechanical properties of the joint were also assessed by micro-hardness and shear strength tests. The results indicate the high effect of temperature on the bonding results; so that, with a small change in temperature, severe changes were observed in the bonding results. A temperature range of 475°C–485°C and a minimum duration of 30 min with a low bonding pressure of 0.4 MPa were identified as advisable process conditions. The joint evaluation revealed the formation of CuAl2, Cu9Al4 and Al-Mg-Cu ternary phases on the aluminium-copper side, as well as Cu2Mg, CuMg2 and Al-Mg-Cu ternary phases on the magnesium-copper side in the reaction layer. When increasing the bonding temperature and duration, the amount of intermetallic compounds and, as a result, the mechanical properties of the joints changed. The highest shear strength and micro-hardness, related to the bonding performed at 480°C and holding time of 45 min, were 31.03 MPa and 167 HV, respectively.

Metals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 152
Author(s):  
Peng Peng ◽  
Shaosong Jiang ◽  
Zhonghuan Qin ◽  
Zhen Lu

This work fabricated a double hollow structural component of Mg-8.3Gd-2.9Y-0.8Zn-0.2Zr alloy by superplastic forming (SPF) and reaction-diffusion bonding (RDB). The superplastic characteristic and mechanical properties of Mg-8.3Gd-2.9Y-0.8Zn-0.2Zr alloy sheets at 250–450 °C were studied. Tensile tests showed that the maximum elongation of tensile specimens was about 1276.3% at 400 °C under a strain rate of 1 × 10−3 s−1. Besides, the effect of bonding temperature and interface roughness on microstructure and mechanical properties of the reaction diffusion-bonded joints with a Cu interlayer was investigated. With the increase of temperature, the diffusion coefficient of Cu increases, and the diffusion transition region becomes wider, leading to tightening bonding of the joint. However, the bonding quality of the joint will deteriorate due to grain size growth at higher temperatures. Shear tests showed that the highest strength of the joints was 152 MPa (joint efficiency = 98.7%), which was performed at 460 °C.


Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1437
Author(s):  
Zeming Wang ◽  
Xu Yang ◽  
Jing Wang ◽  
Zhonglin Xiao ◽  
Fugong Qi ◽  
...  

The development of welding technology for zirconium alloy has great significance on the safety, stability, and reliability of the operation of the nuclear reactor. In this work, vacuum diffusion bonding of Zr-4 alloy was studied at the diffusion temperature ranging from 760 to 820 °C with holding times of 30–90 min. The effects of diffusion bonding temperature and holding time on the interfacial microstructure and mechanical properties of the diffusion bonded Zr-4 alloy joints were investigated in detail, and the relationship between the interfacial microstructure and shear strength of the diffusion bonded joints was discussed. The results show that the interface bonding ratio of the diffusion bonded Zr-4 joint gradually increased from 74% to 95% with the increasing of bonding temperature. In addition, the grain size of the base material became a larger and brittle second phase composed of Zr(Cr, Fe)2 and eutectic α-Zr + Zr(Fe, Cr)2 formed in the joint with the increase of the temperature as well as the extension of the bonding time. The highest shear strength of 349 MPa was obtained at 800 °C for 30 min under 7 MPa, and the crack of the joint was primarily propagated along with the base material rather than the bonded interface.


Metals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 94
Author(s):  
Yuqing Chen ◽  
Guofeng Wang ◽  
Yongkang Liu ◽  
Liqiang Zhan ◽  
He Diao ◽  
...  

Titanium alloys used to be welded to gain good joint strength at 920 °C through diffusion bonding. However, due to the heat preservation at high temperatures for a long time, we obtain joints with great bond strength while the mechanical properties of the sheet are lost. In this paper, taking Ti6Al4V alloy as an example, we studied the microstructure of the surface under the different times of surface mechanical attrition treatment (SMAT). In addition, the microstructure and mechanical properties after diffusion bonding at 800 °C-5 MPa-1 h were also conducted. The results show that the shear strength of TC4 alloy welded joint after SMAT treatment is improved, and the maximum shear strength can reach 797.7 MPa, up about 32.4%


2014 ◽  
Vol 618 ◽  
pp. 150-153 ◽  
Author(s):  
Zhi Tong Chen ◽  
Fei Lin ◽  
Jie Li ◽  
Fei Wang ◽  
Qing Sen Meng

A study on vacuum diffusion bonding between as-extruded AZ31 magnesium alloy and 7075 aluminum alloy was carried out according to atomic diffusion theory. Recrystallization annealing was used for grain refinement of AZ31 magnesium alloy and 7075 aluminum alloy before the diffusion welding. The quality of the bonding joints was checked by shear test, micro-hardness test and microstructure analysis. Experimental results showed that the welding temperature and holding time have a great effect on the joint shear strength. The maximum of shear strength was 38.41MPa under the temperature of 470°C and the holding time of 60min. The result of micro-hardness measurement showed that the micro-hardness of welded joints was maximum. Three kinds of intermetallic compounds, Mg2A13, MgAl and Mgl7Al12, formed at the interfacial transition zone at 470°C.


Metals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1266 ◽  
Author(s):  
Han Mei ◽  
Lihui Lang ◽  
Xiaoxing Li ◽  
Hasnain Ali Mirza ◽  
Xiaoguang Yang

Due to the acceptable high-temperature deformation resistance of Inconel 718, its welding parameters such as bonding temperature and pressure are inevitably higher than those of general metals. As a result of the existing punitive processing environment, it is essential to control the deformation of parts while ensuring the bonding performance. In this research, diffusion bonding experiments based on the Taguchi method (TM) are conducted, and the uniaxial tensile strength and deformation ratio of the experimental joints are measured. According to experimental data, a deep neural network (DNN) was trained to characterize the nonlinear relationship between the diffusion bonding process parameters and the diffusion bonding strength and deformation ratio, where the overall correlation coefficient came out to be 0.99913. The double-factors analysis of bonding temperature–bonding pressure based on the prediction results of the DNN shows that the temperature increment of the diffusion bonding of Inconel 718 significantly increases the deformation ratio of the diffusion bonding joints. Therefore, during the multi-objective optimization of the bonding performance and deformation of components, priority should be given to optimizing the bonding pressure and duration only.


2013 ◽  
Vol 856 ◽  
pp. 153-158
Author(s):  
Kasigavi Chandrappa ◽  
Joel Hemanth

The diffusion bonding of Ti to Ti, Ti-Cu alloy at different temperatures ranging from 673 K to 923 K under an applied stress of 100 MPa for 1 h was studied. The observation of the microstructure reveals that sound joints between the Ti-Ti and dissimilar titanium/Copper metals sheet were successfully joined by diffusion bonding process. Ti-Cu alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 873 K under the applied stress of 100 MPa for 1 h. The bond is composed of the zones, and its width increases with the increase of bonding temperature. The Micro hardness at the interface of joints bonded under different conditions was evaluated through Micro hardness testing and the fracture mode was analyzed by SEM observation.


Author(s):  
X. F. Ang ◽  
G. G. Zhang ◽  
J. Wei ◽  
Z. Chen ◽  
C. C. Wong

Low temperature interconnection is a critical component of 3D integration and packaging technology. In this study, we investigate the characteristics of thermocompression metal bonding using gold stud bumps formed on Si die in the temperature range of 100-300 °C and the pressure range of 200–600 g/bump. We observed a critical bonding temperature below which bonding did not occur and above which shear strength improves linearly with bonding temperature. This critical temperature can be interpreted to be the onset of the break-up of organic barrier films while the linear rise in shear strength can be attributed to the increase in the true bonded area. Above this critical temperature, the tensile strength of the Au-Au bond exhibits a maximum with increasing bonding pressure. This can be related to the pressure dependence of the interfacial stress distribution and its effect on unbonded radius, r. SEM fractographs of the failed surfaces suggest a combination of cohesive and adhesive failures along the bonded interface.


2019 ◽  
Vol 15 (6) ◽  
pp. 1037-1052
Author(s):  
A. Arun Negemiya ◽  
S. Rajakumar ◽  
V. Balasubramanian

Purpose The purpose of this paper is to develop an empirical relationship for predicting the strength of titanium to austenitic stainless steel fabricated by diffusion bonding (DB) process. Process parameters such as bonding pressure, bonding temperature and holding time play the main role in deciding the joint strength. Design/methodology/approach In this study, three-factors, five-level central composite rotatable design was used to conduct the minimum number of experiments involving all the combinations of parameters. Findings An empirical relationship was developed to predict the lap shear strength (LSS) of the joints incorporating DB process parameters. The developed empirical relationship was optimized using particle swarm optimization (PSO). The optimized value discovered through PSO was compared with the response surface methodology (RSM). The joints produced using bonding pressure of 14 MPa, bonding temperature of 900°C and holding time of 70 min exhibited a maximum LSS of 150.51 MPa in comparison with other joints. This was confirmed by constructing response graphs and contour plots. Originality/value Optimizing the DB parameters using RSM and PSO, PSO gives an accurate result when compared with RSM. Also, a sensitivity analysis is carried out to identify the most influencing parameter for the DB process.


2015 ◽  
Vol 787 ◽  
pp. 495-499 ◽  
Author(s):  
K. Dheenadayalan ◽  
S. Rajakumar ◽  
V. Balasubramanian

In this investigation, Commercially Pure (Cp) titanium was diffusion bonded to AA7075-T6 aluminium alloy at various temperatures of 450, 475, 500, 525 and 5500C, bonding pressure of 17, MPa and holding time of 40 minutes was applied during the diffusion bonding. The effects of reaction temperature, Bonding time and atmosphere on the diffusion welding characteristics of titanium and aluminum have been studied. The maximum Lap shear strength was found to be 89 MPa for the specimen bonded at the temperature of 525°C, Bonding Pressure 17 MPa and Holding time for 40 min.


2008 ◽  
Vol 580-582 ◽  
pp. 295-298
Author(s):  
Gui Sheng Zou ◽  
Yan Ju Wang ◽  
Ai Ping Wu ◽  
Hai Lin Bai ◽  
Nai Jun Hu ◽  
...  

To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.


Sign in / Sign up

Export Citation Format

Share Document