An image–temperature model of a microprobe used in wafer testing constructed by particle swarm optimization algorithm

The temperature of a minute object is typically measured by an infrared thermograph, a precise and expensive device. This study presents an image–temperature model constructed by particle swarm optimization algorithm to estimate the temperature according to the color image data on object’s surface. The demonstrated case was a palladium alloy microprobe used in wafer testing. Two series of conduction experiments were implemented to imitate the probing condition of the microprobe in wafer testing. Collecting the images captured from a digital video camera and the temperatures measured by the infrared thermograph, the correlations between the color image data and their corresponding temperatures were investigated. An image–temperature model is further constructed by the particle swarm optimization algorithm based on the image components of the RGB and HSV models of the examined pixel. The model developed provides valuable references for making out the electrothermal effect of the palladium alloy microprobe used in wafer testing.

Using Infrared Thermograph of Chip Temperature to Monitor Cutting Edge Performance

Recently, the need arises for new machining inprocess techniques to monitor and/or control machining systems. Due to the introduction of digital thermal noncontact cameras, it becomes possible to assess the chip temperature hence, to evaluate the possible relation between edge performance and variation within such temperature. A noncontact infrared thermal camera is mounted on a turning lathe carriage to record the cutting temperatures as cutting speed and feed vary using both coated and uncoated carbide inserts. Temperatures gradient, along with the relevant SEM micrographs, are analyzed for possible correlation with both regular and irregular cutting edge deformation. While cutting speed proved not to be an influential parameter on the depicted temperatures, feed increase tends to lower cutting temperatures. Generally, it is observed that lower heat and temperatures are generated when coated inserts are employed. It is found that cutting temperatures are gradually increased as edge wear and deformation develop.