Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal

2019 ◽  
Vol 5 (10) ◽  
pp. 1900314 ◽  
Author(s):  
Dong‐Youn Shin ◽  
Sang‐Yup Baek ◽  
Hyung‐Jun Song ◽  
Jeong In Lee ◽  
Gi‐Hwan Kang
Nanoscale ◽  
2021 ◽  
Author(s):  
Hiroki Ota ◽  
Nyamjargal Ochirkhuyag ◽  
Ryosuke Matsuda ◽  
Zihao Song ◽  
Fumika Nakamura ◽  
...  

Research on liquid metals has been steadily garnering more interest in recent times because the properties of these metals are conducive to flexible electronics applications; further, these metals are in...


2021 ◽  
Vol 13 (6) ◽  
pp. 7443-7452
Author(s):  
Jianyu Xu ◽  
Hongda Guo ◽  
Hongyao Ding ◽  
Qiao Wang ◽  
Ziqing Tang ◽  
...  

Materials ◽  
2020 ◽  
Vol 13 (10) ◽  
pp. 2283 ◽  
Author(s):  
Stephan Handschuh-Wang ◽  
Lifei Zhu ◽  
Tao Wang

The liquid metal lyophobicity of a rough substrate was, in previous articles, found to be rather independent on the surface wettability. In this article, we scrutinize the impact of surface wettability of a structured (rough) surface on the liquid metal wettability and adhesion. As a model system, a structured diamond coating was synthesized and modified by air plasma. We show that surface wettability (surface free energy) does not play a prominent role for static contact angle measurements and for the liquid metal repelling properties of the diamond coating in droplet impact experiments. In contrast, roll off angles and repeated deposition experiments illustrate that the increased hydrophilicity impacts the long-term liquid metal repellency of our coating. Liquid metal adhered after around 50 deposition/removal cycles on the hydrophilic diamond coating, while no liquid metal adhesion was visible after 100 cycles on the hydrophobic diamond coating, illustrating the fundamental role for the adhesion of liquid metal. The effect of repeated deposition in conjunction with gentle applied force was employed for coating the liquid metal lyophobic (hydrophilic) diamond coating with a thin liquid metal layer. The observed effect may find application in flexible electronics and thermal management systems as a means to improve interfacing of the liquid metal with conductive non-metal coatings.


Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1539
Author(s):  
Jun-Heng Fu ◽  
Xu-Dong Zhang ◽  
Peng Qin ◽  
Jing Liu

Room temperature liquid metal (LM) showcases a great promise in the fields of flexible functional thin film due to its favorable characteristics of flexibility, inherent conductivity, and printability. Current fabrication strategies of liquid metal film are substrate structure specific and sustain from unanticipated smearing effects. Herein, this paper reported a facile fabrication of liquid metal composite film via sequentially regulating oxidation to change the adhesion characteristics, targeting the ability of electrical connection and electrothermal conversion. The composite film was then made of the electrically resistive layer (oxidizing liquid metal) and the insulating Polyimide film (PI film) substrate, which has the advantages of electrical insulation and ultra-wide temperature working range, and its thickness is only 50 μm. The electrical resistance of composite film can maintain constant for 6 h and could work normally. Additionally, the heating film exhibited excellent thermal switching characteristics that can reach temperature equilibrium within 100 s, and recovery to ambient temperature within 50 s. The maximum working temperature of the as-prepared film is 115 °C, which is consistent with the result of the theoretical calculation, demonstrating a good electrothermal conversion capability. Finally, the heating application under extreme low temperature (−196 °C) was achieved. This conceptual study showed the promising value of the prototype strategy to the specific application areas such as the field of smart homes, flexible electronics, wearable thermal management, and high-performance heating systems.


2019 ◽  
Vol 7 (12) ◽  
pp. 7042-7052 ◽  
Author(s):  
Soňa Uličná ◽  
Panagiota Arnou ◽  
Ali Abbas ◽  
Mustafa Togay ◽  
Liam M. Welch ◽  
...  

The use of a Mo–N barrier for solution-processed CIGS results in reduced MoSe2 formation. This enabled longer selenization time, enhanced grain growth and performance.


2020 ◽  
Vol 578 ◽  
pp. 146-154 ◽  
Author(s):  
Jingzhou Zhang ◽  
Keyue Zhang ◽  
Jiale Yong ◽  
Qing Yang ◽  
Yongning He ◽  
...  

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